公开(公告)号：US20050184384A1

公开(公告)日：2005-08-25

申请号：US11113090

申请日：2005-04-22

申请人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

发明人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

IPC分类号： H01L21/56 ,  H01L23/04 ,  H01L23/12 ,  H05K3/28

CPC分类号： H01L21/56 ,  H01L23/04 ,  H01L24/97 ,  H01L2924/14 ,  H05K3/284 ,  H05K2203/1311 ,  H01L2924/00

摘要： An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

摘要翻译： 电子部件具有与安装有元件的基部的表面相邻的部分浸渍在液体树脂或半固体树脂中，使得安装元件的基部的元件表面不被浸没，其中 然后将树脂硬化。 这导致在硬化树脂和基体的元件表面之间设置间隙，从而形成由一些元件支撑的盖。

公开(公告)号：US07701053B2

公开(公告)日：2010-04-20

申请号：US11113090

申请日：2005-04-22

申请人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

发明人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

IPC分类号： H01L23/12

CPC分类号： H01L21/56 ,  H01L23/04 ,  H01L24/97 ,  H01L2924/14 ,  H05K3/284 ,  H05K2203/1311 ,  H01L2924/00

摘要： An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

摘要翻译： 电子部件具有与安装有元件的基部的表面相邻的部分浸渍在液体树脂或半固体树脂中，使得安装元件的基部的元件表面不被浸没，其中 然后将树脂硬化。 这导致在硬化树脂和基体的元件表面之间设置间隙，从而形成由一些元件支撑的盖。

公开(公告)号：US20060081977A1

公开(公告)日：2006-04-20

申请号：US10549986

申请日：2004-10-15

申请人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

发明人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

IPC分类号： H01L23/06

CPC分类号： H05K1/186 ,  H01L23/5385 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/09436 ,  H05K2203/1581 ,  H01L2224/0401

摘要： A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

摘要翻译： 陶瓷多层基板具有包括多个陶瓷层的陶瓷层叠体，具有第一主表面，并且包括设置在内部的内部电路元件，具有与陶瓷层叠体的第一主表面接触的接合面的树脂层 和与接合面相反的安装面，外部电极，各自设置在树脂层的安装面上，与陶瓷层叠体的至少一个内部电路元件电连接，接地电极，虚拟电极或 设置在陶瓷层叠体的第一主面与树脂层的接合面或树脂层内侧的界面处的电容电极。

公开(公告)号：US07569925B2

公开(公告)日：2009-08-04

申请号：US11462395

申请日：2006-08-04

申请人： Yoshihiko Nishizawa ,  Norio Sakai

发明人： Yoshihiko Nishizawa ,  Norio Sakai

IPC分类号： H01L23/053 ,  H01L23/12 ,  H01L23/06 ,  H01L23/29

CPC分类号： H01L23/24 ,  H01L23/13 ,  H01L23/5384 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing resin molding. A second resin portion is disposed on the mounting surface side of the ceramic multilayer substrate so as to continuously cover a frame-shaped portion and a first resin portion molded. External terminal electrodes are disposed on an outer surface of the second resin portion.

摘要翻译： 具有内置部件的模块通过在陶瓷多层基板的安装表面侧设置空腔，在其中存储电路部件，然后进行树脂成型而制造。 第二树脂部分设置在陶瓷多层基板的安装表面侧，以连续地覆盖框状部分和模制的第一树脂部分。 外部端子电极设置在第二树脂部分的外表面上。

公开(公告)号：US07649252B2

公开(公告)日：2010-01-19

申请号：US10549986

申请日：2004-10-15

申请人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

发明人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

IPC分类号： H01L23/12 ,  H01L23/06

CPC分类号： H05K1/186 ,  H01L23/5385 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/09436 ,  H05K2203/1581 ,  H01L2224/0401

摘要： A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

摘要翻译： 陶瓷多层基板具有包括多个陶瓷层的陶瓷层叠体，具有第一主表面，并且包括设置在内部的内部电路元件，具有与陶瓷层叠体的第一主表面接触的接合面的树脂层 和与接合面相反的安装面，外部电极，各自设置在树脂层的安装面上，与陶瓷层叠体的至少一个内部电路元件电连接，接地电极，虚拟电极或 设置在陶瓷层叠体的第一主面与树脂层的接合面或树脂层内侧的界面处的电容电极。

公开(公告)号：US07446262B2

公开(公告)日：2008-11-04

申请号：US10549005

申请日：2005-01-06

申请人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

发明人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

IPC分类号： H05K1/03

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/13 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/284 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24777 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.

摘要翻译： 层叠电子部件包括具有设置在其主表面上并延伸到侧表面的第一凹槽的陶瓷基板和树脂片。 树脂片包括半固化状态的热固性树脂，并且被压接在陶瓷基片的主表面上以覆盖第一凹槽。 然后通过加热固化树脂片。 因此，制造组合的层压体。 当树脂片被压接时，捕获在与陶瓷衬底的界面中的空气通过第一凹槽被排出到外部。 组合的层压板沿着第一凹槽被分成多个分开的部件。 外部端子电极形成在所得分离片的树脂层的外表面上。

公开(公告)号：US20070026196A1

公开(公告)日：2007-02-01

申请号：US10549005

申请日：2005-01-06

申请人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

发明人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

IPC分类号： B32B3/02

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/13 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/284 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24777 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.

摘要翻译： 层叠电子部件包括具有设置在其主表面上并延伸到侧表面的第一凹槽的陶瓷基板和树脂片。 树脂片包括半固化状态的热固性树脂，并且被压接在陶瓷基片的主表面上以覆盖第一凹槽。 然后通过加热固化树脂片。 因此，制造组合的层压体。 当树脂片被压接时，捕获在与陶瓷衬底的界面中的空气通过第一凹槽被排出到外部。 组合的层压板沿着第一凹槽被分成多个分开的部件。 外部端子电极形成在所得分离片的树脂层的外表面上。

公开(公告)号：US06509531B2

公开(公告)日：2003-01-21

申请号：US09784904

申请日：2001-02-16

申请人： Norio Sakai ,  Isao Kato ,  Kazuhiro Isebo

发明人： Norio Sakai ,  Isao Kato ,  Kazuhiro Isebo

IPC分类号： H05K111

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/85399 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15174 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/4053 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/43 ,  Y10T29/435 ,  Y10T29/49126 ,  Y10T29/49163 ,  Y10T29/49165 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/00012

摘要： A monolithic electronic component includes a composite body having a plurality of stacked ceramic layers. The ceramic layers include interconnecting conductors provided in each of the ceramic layers, including first terminals, arranged on a first end surface in the stacking direction of the composite body, for defining connections with an interconnection substrate, and second terminals, arranged on a second end surface opposite of the first end surface of the composite, for defining connections with a mounted component. The first terminals are defined by conductor layers provided on the first end surface and the second terminals are defined by exposed end surfaces of terminal via-hole conductors which extend from the inner portion of the composite to the second end surface. The exposed end surfaces of the terminal via-hole conductors are flat and are on substantially the same plane as the second end surface.

公开(公告)号：US6165659A

公开(公告)日：2000-12-26

申请号：US317140

申请日：1999-05-21

申请人： Akihiko Kamada ,  Isao Kato ,  Norio Sakai

发明人： Akihiko Kamada ,  Isao Kato ,  Norio Sakai

IPC分类号： G03G9/08 ,  G03G13/26 ,  H01G4/12 ,  H01G4/30 ,  H01L21/48 ,  H05K3/10 ,  H05K3/46 ,  G03G13/00

CPC分类号： H05K3/102 ,  H01G4/30 ,  H01L21/4867 ,  H05K3/4629

摘要： It is an object of the present invention to provide a method of manufacturing ceramic electronic parts, with a reduced manufacturing time and a reduced manufacturing cost so as to be suitable for manufacturing many kinds or types of electronic parts but requiring only a small number of production steps. The method of producing ceramic electronic parts comprises a first process of printing an amount of electrified powder for forming a ceramic layer on a carrier member which is a film consisting of a polyethylene terephthalate (PET), so as to form a desired ceramic layer; a second process of printing an amount of electrified powder for forming internal electrodes on the ceramic layer, so as to form desired electrode patterns which will later be formed into desired internal electrodes; a third process of printing an amount of electrified powder for forming another ceramic layer on the above ceramic layer and the above electrode patterns, so as to form another desired ceramic layer.

摘要翻译： 本发明的目的是提供一种制造陶瓷电子部件的方法，其制造时间缩短并且制造成本降低，从而适用于制造多种类型的电子部件，但仅需要少量的生产 脚步。 制造陶瓷电子部件的方法包括在作为由聚对苯二甲酸乙二醇酯（PET）构成的膜的载体部件上印刷一定量的用于形成陶瓷层的带电粉末的方法，以形成所需的陶瓷层; 在陶瓷层上印刷用于形成内部电极的带电粉末的量的第二工序，形成期望的电极图案，其后来将形成所需的内部电极; 在上述陶瓷层和上述电极图案上印刷用于形成另一陶瓷层的带电粉末的量的第三工序，以形成另一期望的陶瓷层。

公开(公告)号：US6036912A

公开(公告)日：2000-03-14

申请号：US316495

申请日：1999-05-21

申请人： Akihiko Kamada ,  Isao Kato ,  Norio Sakai

发明人： Akihiko Kamada ,  Isao Kato ,  Norio Sakai

IPC分类号： C04B35/64 ,  B28B1/30 ,  C04B35/622 ,  H05K1/03 ,  H05K3/02 ,  B28B1/00

CPC分类号： C04B35/62218 ,  H05K1/0306 ,  H05K3/022

摘要： Provided is a production method and a production apparatus for a ceramic green sheet, capable of achieving a thin layer without using an aqueous or organic solvent. The method of producing a ceramic green sheet includes a first step of charging a carrier sheet, a second step of attaching chargeable powder charged in the polarity opposite to that of the carrier sheet, on the surface of the carrier sheet by electrostatic force, and a third step of applying heat to the chargeable powder attached on the surface of the carrier sheet by electrostatic force so as to fix the chargeable powder onto the surface of the carrier sheet.

摘要翻译： 提供一种陶瓷生片的制造方法和制造装置，其能够在不使用水性或有机溶剂的情况下实现薄层。 陶瓷生片的制造方法包括：对载体片进行充电的第一工序，将以与载体片相反极性相反的带电荷的粉末附着在载体片的表面上的静电力的第二工序， 通过静电力将热量附着在载体片表面上的可充电粉末的第三步骤，以将可充电粉末固定在载体片材的表面上。