公开(公告)号：US20050184384A1

公开(公告)日：2005-08-25

申请号：US11113090

申请日：2005-04-22

申请人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

发明人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

IPC分类号： H01L21/56 ,  H01L23/04 ,  H01L23/12 ,  H05K3/28

CPC分类号： H01L21/56 ,  H01L23/04 ,  H01L24/97 ,  H01L2924/14 ,  H05K3/284 ,  H05K2203/1311 ,  H01L2924/00

摘要： An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

摘要翻译： 电子部件具有与安装有元件的基部的表面相邻的部分浸渍在液体树脂或半固体树脂中，使得安装元件的基部的元件表面不被浸没，其中 然后将树脂硬化。 这导致在硬化树脂和基体的元件表面之间设置间隙，从而形成由一些元件支撑的盖。

公开(公告)号：US07701053B2

公开(公告)日：2010-04-20

申请号：US11113090

申请日：2005-04-22

申请人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

发明人： Yoshihiko Nishizawa ,  Norio Sakai ,  Isao Kato

IPC分类号： H01L23/12

CPC分类号： H01L21/56 ,  H01L23/04 ,  H01L24/97 ,  H01L2924/14 ,  H05K3/284 ,  H05K2203/1311 ,  H01L2924/00

摘要： An electronic component has a portion adjacent to a surface of a base to which elements are mounted is immersed into a liquid resin or semi-solid resin such that an element surface of the base to which the elements are mounted is not immersed and in which the resin is then hardened. This causes a gap to be disposed between the hardened resin and the element surface of the base, such that a cover supported by some of the elements is formed.

摘要翻译： 电子部件具有与安装有元件的基部的表面相邻的部分浸渍在液体树脂或半固体树脂中，使得安装元件的基部的元件表面不被浸没，其中 然后将树脂硬化。 这导致在硬化树脂和基体的元件表面之间设置间隙，从而形成由一些元件支撑的盖。

公开(公告)号：US20060081977A1

公开(公告)日：2006-04-20

申请号：US10549986

申请日：2004-10-15

申请人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

发明人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

IPC分类号： H01L23/06

CPC分类号： H05K1/186 ,  H01L23/5385 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/09436 ,  H05K2203/1581 ,  H01L2224/0401

摘要： A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

摘要翻译： 陶瓷多层基板具有包括多个陶瓷层的陶瓷层叠体，具有第一主表面，并且包括设置在内部的内部电路元件，具有与陶瓷层叠体的第一主表面接触的接合面的树脂层 和与接合面相反的安装面，外部电极，各自设置在树脂层的安装面上，与陶瓷层叠体的至少一个内部电路元件电连接，接地电极，虚拟电极或 设置在陶瓷层叠体的第一主面与树脂层的接合面或树脂层内侧的界面处的电容电极。

公开(公告)号：US07649252B2

公开(公告)日：2010-01-19

申请号：US10549986

申请日：2004-10-15

申请人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

发明人： Norio Sakai ,  Jun Harada ,  Satoshi Ishino ,  Yoshihiko Nishizawa

IPC分类号： H01L23/12 ,  H01L23/06

CPC分类号： H05K1/186 ,  H01L23/5385 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/162 ,  H05K3/4605 ,  H05K2201/0154 ,  H05K2201/09436 ,  H05K2203/1581 ,  H01L2224/0401

摘要： A ceramic multilayer substrate has a ceramic laminate including a plurality of ceramic layers laminated, having a first main surface, and including internal circuit elements disposed in the inside, a resin layer having a bonding surface in contact with the first main surface of the ceramic laminate and a mounting surface opposite to the bonding surface, external electrodes, each disposed on the mounting surface of the resin layer and electrically connected to at least one of the internal circuit elements of the ceramic laminate, and a ground electrode, a dummy electrode, or capacitor electrodes disposed at an interface between the first main surface of the ceramic laminate and the bonding surface of the resin layer or in the inside of the resin layer.

摘要翻译： 陶瓷多层基板具有包括多个陶瓷层的陶瓷层叠体，具有第一主表面，并且包括设置在内部的内部电路元件，具有与陶瓷层叠体的第一主表面接触的接合面的树脂层 和与接合面相反的安装面，外部电极，各自设置在树脂层的安装面上，与陶瓷层叠体的至少一个内部电路元件电连接，接地电极，虚拟电极或 设置在陶瓷层叠体的第一主面与树脂层的接合面或树脂层内侧的界面处的电容电极。

公开(公告)号：US07446262B2

公开(公告)日：2008-11-04

申请号：US10549005

申请日：2005-01-06

申请人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

发明人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

IPC分类号： H05K1/03

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/13 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/284 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24777 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.

摘要翻译： 层叠电子部件包括具有设置在其主表面上并延伸到侧表面的第一凹槽的陶瓷基板和树脂片。 树脂片包括半固化状态的热固性树脂，并且被压接在陶瓷基片的主表面上以覆盖第一凹槽。 然后通过加热固化树脂片。 因此，制造组合的层压体。 当树脂片被压接时，捕获在与陶瓷衬底的界面中的空气通过第一凹槽被排出到外部。 组合的层压板沿着第一凹槽被分成多个分开的部件。 外部端子电极形成在所得分离片的树脂层的外表面上。

公开(公告)号：US20070026196A1

公开(公告)日：2007-02-01

申请号：US10549005

申请日：2005-01-06

申请人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

发明人： Nobuaki Ogawa ,  Norio Sakai ,  Yoshihiko Nishizawa

IPC分类号： B32B3/02

CPC分类号： H01L23/49833 ,  H01L21/4857 ,  H01L23/13 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H05K1/0306 ,  H05K3/284 ,  Y10T428/24488 ,  Y10T428/24612 ,  Y10T428/24777 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

摘要： A laminated electronic component includes a ceramic substrate having a first groove provided on a principal surface thereof and extending to the side surfaces, and a resin sheet. The resin sheet includes a thermosetting resin in a semi-cured state and is compression bonded on the principal surface of the ceramic substrate so as to cover the first groove. The resin sheet is then cured by heating. Thus, a combined laminate is produced. When the resin sheet is compression bonded, air trapped in the interface with the ceramic substrate is discharged outside through the first groove. The combined laminate is divided into separate pieces along the first groove. An outer terminal electrode is formed on the outer surface of a resin layer of the resultant separate piece.

摘要翻译： 层叠电子部件包括具有设置在其主表面上并延伸到侧表面的第一凹槽的陶瓷基板和树脂片。 树脂片包括半固化状态的热固性树脂，并且被压接在陶瓷基片的主表面上以覆盖第一凹槽。 然后通过加热固化树脂片。 因此，制造组合的层压体。 当树脂片被压接时，捕获在与陶瓷衬底的界面中的空气通过第一凹槽被排出到外部。 组合的层压板沿着第一凹槽被分成多个分开的部件。 外部端子电极形成在所得分离片的树脂层的外表面上。

公开(公告)号：US07569925B2

公开(公告)日：2009-08-04

申请号：US11462395

申请日：2006-08-04

申请人： Yoshihiko Nishizawa ,  Norio Sakai

发明人： Yoshihiko Nishizawa ,  Norio Sakai

IPC分类号： H01L23/053 ,  H01L23/12 ,  H01L23/06 ,  H01L23/29

CPC分类号： H01L23/24 ,  H01L23/13 ,  H01L23/5384 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A module with a built-in component is produced by disposing a cavity on a mounting surface side of a ceramic multilayer substrate, storing a circuit component therein and, thereafter, performing resin molding. A second resin portion is disposed on the mounting surface side of the ceramic multilayer substrate so as to continuously cover a frame-shaped portion and a first resin portion molded. External terminal electrodes are disposed on an outer surface of the second resin portion.

摘要翻译： 具有内置部件的模块通过在陶瓷多层基板的安装表面侧设置空腔，在其中存储电路部件，然后进行树脂成型而制造。 第二树脂部分设置在陶瓷多层基板的安装表面侧，以连续地覆盖框状部分和模制的第一树脂部分。 外部端子电极设置在第二树脂部分的外表面上。

公开(公告)号：US07557307B2

公开(公告)日：2009-07-07

申请号：US11755108

申请日：2007-05-30

申请人： Yoshihiko Nishizawa ,  Tetsuya Ikeda

发明人： Yoshihiko Nishizawa ,  Tetsuya Ikeda

IPC分类号： H05K9/00

CPC分类号： H05K1/0218 ,  B32B18/00 ,  C04B35/63 ,  C04B35/634 ,  C04B37/026 ,  C04B37/028 ,  C04B2235/656 ,  C04B2237/125 ,  C04B2237/32 ,  C04B2237/34 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/348 ,  C04B2237/40 ,  C04B2237/403 ,  C04B2237/405 ,  C04B2237/406 ,  C04B2237/408 ,  C04B2237/562 ,  C04B2237/62 ,  C04B2237/702 ,  C04B2237/704 ,  C04B2237/86 ,  C04B2237/88 ,  H01L21/4807 ,  H01L23/04 ,  H01L23/055 ,  H01L23/552 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/15192 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/144 ,  H05K3/4007 ,  H05K2201/0367 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85 ,  H01L2224/45015 ,  H01L2924/207

摘要： An electronic component includes a wiring board having a wiring pattern, a surface mount device mounted on an upper surface of the wiring board, and a cap arranged to cover the wiring board. The cap includes a top portion made of a flat ceramic member, and a leg portion made of a columnar member having a height similar to a height of the surface mount devices.

摘要翻译： 电子部件包括具有布线图案的布线板，安装在布线板的上表面上的表面安装器件和布置成覆盖布线板的盖。 盖包括由平坦陶瓷构件制成的顶部和由具有与表面安装装置的高度相似的高度的柱状构件制成的腿部。

公开(公告)号：US4463024A

公开(公告)日：1984-07-31

申请号：US340893

申请日：1982-01-19

申请人： Yoshihiko Nishizawa ,  Taihei Takezawa ,  Takashi Shinohara

发明人： Yoshihiko Nishizawa ,  Taihei Takezawa ,  Takashi Shinohara

IPC分类号： A21D2/36 ,  A23L27/10 ,  C12G3/07 ,  A23L1/221 ,  A23L1/28

CPC分类号： C12G3/065 ,  A21D2/36 ,  A23L27/11

摘要： A flavoring material comprising a flavoring wooden material obtained by treating a wooden raw material with pressure and heat for a time period of 30 seconds or longer in the presence of a saturated steam having a pressure of 4 kg/cm.sup.2.G or higher or a super-heated steam having a temperature of 151.degree. C. or higher and thereafter rapidly or slowly discharging the wooden material into an atmosphere having a lower pressure, and a process for producing drinks and foods to which said flavoring material has been added.

摘要翻译： 一种矫味材料，其包含通过在压力为4kg / cm 2 .G以上的饱和蒸汽或超级液体存在下，用压力和热量处理木制原料30秒或更长时间而获得的调味木材 温度为151℃以上的加热蒸汽，然后将木质材料快速或缓慢地排放到具有较低压力的气氛中，以及生产已加入调味料的饮料和食品的方法。

公开(公告)号：US07839651B2

公开(公告)日：2010-11-23

申请号：US12269128

申请日：2008-11-12

申请人： Yoshihiko Nishizawa

发明人： Yoshihiko Nishizawa

IPC分类号： H05K1/18

CPC分类号： H05K3/4688 ,  B32B18/00 ,  C04B35/63 ,  C04B2235/663 ,  C04B2235/9607 ,  C04B2237/32 ,  C04B2237/34 ,  C04B2237/582 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/72 ,  H01F17/0006 ,  H01G4/12 ,  H01G4/30 ,  H01G4/40 ,  H01L23/15 ,  H01L23/49822 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/15313 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2201/086 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/24926

摘要： In a multilayer ceramic electronic component, a ceramic laminate is defined by a ceramic base layer and ceramic auxiliary layers arranged on both main surfaces of the ceramic base layer, the ceramic base layer and the ceramic auxiliary layers being co-fired. The ceramic base layer and the ceramic auxiliary layers are made of ferrite materials having substantially the same compositional system and have substantially the same crystal structure. The linear expansion coefficient of the ceramic auxiliary layers is less than the linear expansion coefficient of the ceramic base layer.

摘要翻译： 在多层陶瓷电子部件中，通过陶瓷基底层和布置在陶瓷基底层的两个主表面，陶瓷基底层和陶瓷辅助层上共同烧结的陶瓷辅助层来限定陶瓷层压体。 陶瓷基层和陶瓷辅助层由具有基本上相同的组成系统的铁素体材料制成并且具有基本上相同的晶体结构。 陶瓷辅助层的线膨胀系数小于陶瓷基层的线膨胀系数。