Angular rate detector
    1.
    发明授权
    Angular rate detector 失效
    角速率检测器

    公开(公告)号:US5587529A

    公开(公告)日:1996-12-24

    申请号:US461743

    申请日:1995-06-05

    CPC分类号: G01C19/5691

    摘要: An angular rate detector includes an oscillator having a first terminal to which a drive voltage is applied, a second terminal where a signal occurs having a given phase displacement with respect to a signal appearing at the first terminal during a resonance of the oscillator and a third terminal where a signal occurs having a phase which changes in accordance with an angular rate. An oscillator is provided for producing an alternating signal which corresponds to the drive voltage applied to the first terminal in accordance with the signal appearing at the second terminal. A frequency multiplier responsive to a signal which corresponds to the oscillation frequency of the oscillator produces a clock pulse having a frequency higher than the oscillation frequency. A phase difference pulse signal is produced having a duty cycle which changes in accordance with a phase difference between the signal occurring at the third terminal of the oscillator and either the signal applied to the first terminal or the signal occurring at the second terminal. A counter is provided for counting the clock pulses during a time interval when the phase difference pulse signal assumes either a high or a low level.

    摘要翻译: 角速率检测器包括具有施加驱动电压的第一端子的振荡器,在振荡器谐振期间相对于出现在第一端子处的信号具有给定相移的第二端子,以及第三端子 发生具有根据角速率变化的相位的信号的端子。 提供振荡器,用于根据出现在第二端子处的信号产生对应于施加到第一端子的驱动电压的交变信号。 响应于与振荡器的振荡频率对应的信号的倍频器产生具有高于振荡频率的频率的时钟脉冲。 产生相位差脉冲信号,其具有根据在振荡器的第三端子发生的信号与施加到第一端子的信号或在第二端子处发生的信号之间的相位差而改变的占空比。 提供一个计数器,用于在相位差脉冲信号呈现高电平或低电平的时间间隔期间对时钟脉冲进行计数。

    Oscillator unit
    2.
    发明授权
    Oscillator unit 失效
    振荡器单元

    公开(公告)号:US5561400A

    公开(公告)日:1996-10-01

    申请号:US539117

    申请日:1995-10-04

    CPC分类号: G01C19/5691

    摘要: An electrical circuit for reliably starting the oscillation of an oscillator comprising a cylindrical piezoelectric body on which an exciting electrode, a feedback electrode which causes an oscillation, and an electrode for detecting an angular rate are mounted. The electrical circuit includes an exclusive OR gate for detecting a phase difference between an exciting voltage and a voltage developed at the feedback electrode, a circuit for integrating an output voltage from the gate and a band pass filter having its resonant frequency shifted in proportion to a voltage from the integrating circuit. The band pass filter is effective to provide an automatic adjustment of a phase difference of a voltage, which is actually fed back to the exciting electrode, with respect to a voltage developed at the feedback electrode. In this manner, if the natural frequency of the oscillator is offset from a reference value, it is assured that a phase difference between the exciting voltage and the voltage which is actually fed back to the exciting electrode be equal to 360.degree.. The electrical circuit also includes an oscillation starter circuit which increases the gain of a positive feedback loop including the filter for a given time interval immediately after the turn-on of the power.

    摘要翻译: 一种用于可靠地启动包括圆柱形压电体的振荡器的电路,其安装有激励电极,引起振荡的反馈电极和用于检测角速率的电极。 该电路包括用于检测激励电压和在反馈电极产生的电压之间的相位差的异或门,用于对来自栅极的输出电压进行积分的电路和其谐振频率与 积分电路的电压。 带通滤波器有效地提供相对于在反馈电极处产生的电压来实际反馈到激励电极的电压的相位差的自动调节。 以这种方式,如果振荡器的固有频率偏离参考值,则确保激励电压和实际反馈到激励电极的电压之间的相位差等于360°。 电路还包括一个振荡起动电路,其在电源接通之后立即增加包括滤波器在内的给定时间间隔的正反馈回路的增益。

    Process for producing a printed wiring board for mounting electronic components
    3.
    发明授权
    Process for producing a printed wiring board for mounting electronic components 失效
    用于制造用于安装电子部件的印刷线路板的工艺

    公开(公告)号:US07377032B2

    公开(公告)日:2008-05-27

    申请号:US10991921

    申请日:2004-11-18

    IPC分类号: H05K3/02

    摘要: A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.

    摘要翻译: 一种用于安装电子部件的印刷线路板包括绝缘层和形成在绝缘层的一个表面上的布线图案,其中填充的通孔4的一个端部与布线图案连接,另一个端部覆盖有覆盖层 通过施加导电浆料至少覆盖填充的通孔4和绝缘层2之间的边界获得的层9; 可选地,在另一端部形成电镀抗蚀剂7,以至少覆盖填充的通孔4和绝缘层2之间的边界,并且在封装在电镀抗蚀剂7中的填充通孔4的端部被电镀之后被去除 以制造端子层,从而防止诸如镀锡溶液之类的湿处理液体在填充的通孔4和绝缘层2之间泄漏。

    Fixing member
    4.
    发明申请

    公开(公告)号:US20060063401A1

    公开(公告)日:2006-03-23

    申请号:US10946131

    申请日:2004-09-22

    IPC分类号: H05K1/00

    摘要: A fixing member includes a case member provided with at least a substrate supporting member adjusted to support a substrate and integrally provided with a connector, a cap member adjusted to be fixed to the case member, at least an external force transmitting portion extending at the substrate supporting member between the substrate supporting member and the cap member and adjusted to transmit an external force subjected to the connector to the cap member while the case member has been fixed at the cap member.

    Printed wiring board for mounting electronic components, and production process thereof and semiconductor device
    5.
    发明申请
    Printed wiring board for mounting electronic components, and production process thereof and semiconductor device 失效
    用于安装电子部件的印刷线路板及其制造方法以及半导体装置

    公开(公告)号:US20050111205A1

    公开(公告)日:2005-05-26

    申请号:US10991921

    申请日:2004-11-18

    IPC分类号: H05K1/11 H05K3/24 H05K3/40

    摘要: A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.

    摘要翻译: 一种用于安装电子部件的印刷线路板包括绝缘层和形成在绝缘层的一个表面上的布线图案,其中填充的通孔4的一个端部与布线图案连接,另一个端部覆盖有覆盖层 通过施加导电浆料至少覆盖填充的通孔4和绝缘层2之间的边界获得的层9; 可选地,在另一端部形成电镀抗蚀剂7,以至少覆盖填充的通孔4和绝缘层2之间的边界,并且在封装在电镀抗蚀剂7中的填充通孔4的端部被电镀之后被去除 以制造端子层,从而防止诸如镀锡溶液之类的湿处理液体在填充的通孔4和绝缘层2之间泄漏。

    Process for producing a film carrier tape for mounting an electronic part
    6.
    发明申请
    Process for producing a film carrier tape for mounting an electronic part 审中-公开
    用于制造用于安装电子部件的胶片载带的方法

    公开(公告)号:US20070264813A1

    公开(公告)日:2007-11-15

    申请号:US11880764

    申请日:2007-07-24

    IPC分类号: H01L21/60

    摘要: A film carrier tape for mounting an electronic part, comprising an insulating film, a wiring pattern formed on a surface of the insulating film and a solder resist layer formed on the wiring pattern except connecting lead portions of the wiring pattern, wherein the solder resist coating thickness at the edge portion of the solder resist layer is continuously decreased toward the tip of the edge portion. The film carrier tape for mounting an electronic part can be produced by applying a solder resist coating solution onto the wiring pattern using a screen in which opening sizes at the edge portion of a coating solution passing zone are reduced stepwise or continuously or by applying a solder resist coating solution onto the wiring pattern while pressing a film carrier against the screen so as to decrease a coating weight of the solder resist coating solution continuously or stepwise toward the tip of the edge portion of the resulting solder resist layer. A screen for solder resist coating, comprising a gauze having an area in which opening sizes are changed stepwise or continuously.

    摘要翻译: 一种用于安装电子部件的胶片载带,包括绝缘膜,形成在绝缘膜的表面上的布线图案和除了布线图案的连接引线部分之外形成在布线图案上的阻焊层,其中阻焊涂层 阻焊层的边缘部分的厚度朝着边缘部分的尖端连续减小。 用于安装电子部件的胶片载带可以通过使用屏幕涂布阻焊涂层溶液来制造,其中涂布溶液通过区域的边缘部分的开口尺寸逐步或连续地减少或通过施加焊料 在将薄膜载体压靠在屏幕上的同时将涂布溶液涂覆到布线图案上,以便使阻焊涂层溶液的连续或逐步朝向所得阻焊层的边缘部分的末端减小涂层重量。 一种用于阻焊涂层的屏幕,包括具有开口尺寸逐步或连续地改变的区域的纱布。

    Film carrier tape for mounting electronic devices thereon and flexible substrate
    7.
    发明申请
    Film carrier tape for mounting electronic devices thereon and flexible substrate 审中-公开
    用于在其上安装电子装置的薄膜载带和柔性基板

    公开(公告)号:US20060068164A1

    公开(公告)日:2006-03-30

    申请号:US11235139

    申请日:2005-09-27

    申请人: Yutaka Iguchi

    发明人: Yutaka Iguchi

    IPC分类号: B32B3/10

    摘要: The invention provides a film carrier tape for mounting electronic devices thereon and a flexible substrate, which prevent generation of static electricity, thereby enhancing reliability and productivity of a semiconductor chip mounting line. The film carrier tape for mounting electronic devices thereon including a continuous insulating layer; a wiring pattern formed through patterning of a conductor layer and provided on at least a top surface of the insulating layer; a row of sprocket holes provided along each longitudinal edge of the wiring pattern; an electricity-conducting layer provided on the top surface of the insulating layer continuously in the longitudinal direction of the insulating layer; and an antistatic layer formed of an antistatic agent which is provided at least on each longitudinal edge or in an area in the vicinity of each edge of a bottom surface of the insulating layer in the longitudinal direction of the insulating layer, wherein the electricity-conducting layer or the conductor layer electrically connected with the electricity-conducting layer is electrically connected with the antistatic layer through a longitudinal side surface of the tape or through inner peripheral surfaces of the sprocket holes.

    摘要翻译: 本发明提供了一种用于在其上安装电子器件的胶片载带和一种防止产生静电的柔性基板,从而提高半导体芯片安装线的可靠性和生产率。 用于在其上安装其上的电子器件的胶片载带,包括连续的绝缘层; 通过图案化导体层形成并设置在绝缘层的至少顶表面上的布线图案; 沿着布线图案的每个纵向边缘设置的一排链轮孔; 在所述绝缘层的长度方向上连续设置在所述绝缘层的上表面的导电层; 以及由绝缘层的纵向至少设置在绝缘层的下表面的每个边缘的每个边缘的每个纵向边缘或每个边缘附近的区域中的抗静电剂形成的抗静电层,其中导电 与导电层电连接的导体层通过带的纵向侧表面或通过链轮孔的内周表面与抗静电层电连接。

    Method for producing a printed circuit board
    9.
    发明授权
    Method for producing a printed circuit board 有权
    印刷电路板的制造方法

    公开(公告)号:US07523548B2

    公开(公告)日:2009-04-28

    申请号:US10580948

    申请日:2004-12-02

    IPC分类号: H05K3/02 B05D5/12

    摘要: A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.

    摘要翻译: 一种制造印刷电路板的方法包括以下步骤:在绝缘膜的至少一个表面上沉积贱金属以形成贱金属层,并进一步沉积铜或铜合金以形成导电金属层,然后除去表面 通过蚀刻形成布线图案,然后用能够溶解和/或钝化形成基底金属层的金属的处理液对基底金属层进行处理。 所提供的印刷电路板包括绝缘膜和形成在绝缘膜的至少一个表面上的布线图案,布线图案包括沉积在绝缘膜表面上的基底金属层和导电金属层,所述基底金属层用于 形成布线图案比形成布线图案的导电金属层的宽度方向突出。

    Printed Wiring Board, Process For Producing the Same and Semiconductor Device
    10.
    发明申请
    Printed Wiring Board, Process For Producing the Same and Semiconductor Device 审中-公开
    印刷电路板,生产工艺及半导体器件

    公开(公告)号:US20080236872A1

    公开(公告)日:2008-10-02

    申请号:US11632793

    申请日:2005-06-03

    IPC分类号: H05K1/00 H05K3/00

    摘要: The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 μg/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.

    摘要翻译: 本发明的印刷电路板是通过多个蚀刻步骤选择性地蚀刻形成在绝缘膜上的具有基底金属层和导电金属层的基膜而制造的印刷线路板,其中包括导电金属蚀刻步骤和 贱金属蚀刻步骤,以形成布线图形,然后将具有如此形成的布线图案的基底膜与含有还原物质的还原水溶液接触,其中源自印刷布线上的蚀刻溶液的残余金属的量 板不超过0.05毫升/厘米2。 根据本发明,通过使用还原性物质的溶液除去来自蚀刻溶液的金属。 因此,可以缩短生产过程中的水洗步骤,可以防止由于残留金属引起的迁移的发生,并且可以有效地生产具有高可靠性的印刷线路板。