摘要:
A molding machine 1 which molds two sheets of disc substrates on which the information is recorded simultaneously, a cooling mechanism 3 for cooling each of the disc substrates, first movably mounting means 2 for movably mounting the disc substrate from the molding machine onto the cooling mechanism, and a second movably mounting means 4 for mounting each of the disc substrates onto a receiving portion of the turn table 5 are provided. In addition, a film forming device 8 for receiving sequentially each of the disc substrates from this movably mounting means 6 and forming a reflective film on one of the surfaces of each of the received disc substrates on which the information is recorded; a turn table 10 having a plurality of receiving portions on which the disc substrates are mounted and which rotates intermittently through each constant angle; a reversing mechanism 11 which reverses 180 degrees each of the disc substrates; and an overlapping mechanism for overlapping the reversed disc substrates over the other disc substrates are provided. Furthermore, spinners 15, 16 for rotating the overlapped two sheets of disc substrates and a curing device 23 which radiates ultra-violet rays onto the disc substrates which are rotated by the spinners to cure the liquid adhesive. According to the above-described structure, an optical disc which is compact, is fast in a production speed, and has a high quality can be achieved.
摘要:
To improve the reliability, operating speed, size of equipment and economy, a disk coating system for forming a coating on a disk such as a compact disk is arranged to transfer disks to and from a pair of spinners with first and second disk transfer mechanisms. The coating system further has an intermittently rotating turntable, an apparatus for supplying a coating material to each disk on the turntable at a predetermined position, and a system for curing a coating layer on each disk. The spinners for removing an excess amount of the coating material are placed between the turntable and the curing system. The first transfer mechanism is for transferring disks from the turntable to the spinners, and the second transfer mechanism is for transferring disks from the spinners to the curing system. The two spinners are substantially equidistant from a predetermined disk position on the turntable. The first transfer mechanism has two arms extending in two directions diverging from a pivot at a predetermined angle. With both arms, this transfer mechanism can transfer disks from the predetermined disk position on the turntable alternately to the first and second spinners at a high speed.
摘要:
An electro-optical inspection apparatus prevents adhesion of dust or particles to a sample surface, wherein a stage on which a sample is placed is disposed inside a vacuum chamber that can be evacuated, and a dust collecting electrode is disposed to surround a periphery of the sample. The dust collecting electrode is applied with a voltage having the same polarity as a voltage applied to the sample and an absolute value that is the same or larger than an absolute value of the voltage. Because dust or particles adhere to the dust collecting electrode, adhesion of the dust or particles to the sample surface can be reduced. Instead of using the dust collecting electrode, it is possible to form a recess on a wall of the vacuum chamber, or to dispose on the wall a metal plate having a mesh structure to which a predetermined voltage is applied.
摘要:
An inspection device for inspecting a surface of an inspection object using a beam includes a beam generator capable of generating one of either charge particles or an electromagnetic wave as a beam, a primary optical system capable of guiding and irradiating the beam to the inspection object supported within a working chamber, a secondary optical system capable of including a first movable numerical aperture and a first detector which detects secondary charge particles generated from the inspection object, the secondary charge particles passing through the first movable numerical aperture, an image processing system capable of forming an image based on the secondary charge particles detected by the first detector; and a second detector arranged between the first movable numerical aperture and the first detector and which detects a location and shape at a cross over location of the secondary charge particles generated from the inspection object.
摘要:
A compact mass spectrometer apparatus is presented to enable accurate qualitative and quantitative analyses of target ions. The apparatus can operate in a relatively poor vacuum in the range of 10.sup.-2 to 10.sup.-3 torr compared with the conventional requirement of 10.sup.-6 to 10.sup.-8 torr while providing precision results with lesser number of electrodes than the conventional mass spectrometer. The separation of the ionic species is achieved through two effects: flight time differentials produced by varying mass/charge ratios of the sample ions; as well as high frequency resonance separation by synchronizing the injection of ions with high frequency electric field applied to an electrode system having equi-potential space and high frequency space. The resulting dispersion in the wide energy spectra of the sample ions serves to accurately identify the sample ions both qualitatively and quantitatively. The spectra dispersion is achieved by modulating the ion beam with application of suitable magnitude and phase angle of the high frequency voltage, and allowing only those ions having the maximum kinetic energy to pass through to a collector electrode. The analyses are based on measurements of the maximum ion current flowing in the collector electrode.
摘要:
A substrate surface inspection method inspects for a defect on a substrate including a plurality of materials on a surface thereof. The inspection method comprises: irradiating the surface of the substrate with an electron beam, a landing energy of the electron beam set such that a contrast between at least two types of materials of the plurality of materials is within a predetermined range; detecting electrons generated by the substrate to acquire a surface image of the substrate, with a pattern formed thereon from the at least two types of materials eliminated or weakened; and detecting the defect from the acquired surface image by detecting as the defect an object image having a contrast by which the object image can be distinguished from a background image in the surface image. Defects present on the substrate surface can be detected easily and precisely by using a cell inspection.
摘要:
Provided is a defect inspection apparatus and an inspection (or evaluation) method with highly improved accuracy, which would not be provided by the prior art, in the defect inspection apparatus used in a manufacturing process of a semiconductor device.Provided is a method for inspecting a sample surface with a projection type electron beam inspection apparatus, comprising the steps of: forming such an irradiation area on the sample surface by an electron beam generated from an electron gun 21 that has approximately a circular or elliptical shape of a size larger than a pattern on the sample surface; irradiating the electron beam substantially onto a center of the pattern on the sample surface; and forming an image on an electron detection plane of a detector from secondary electrons emanating from the sample surface in response to the irradiation of the electron beam for inspecting the sample surface.
摘要:
There are provided a semiconductor device having a pattern which allows electric failures to be sensitively detected at high speeds, and a method of testing the same. In one embodiment, the semiconductor device comprises a pair of row wires including a plurality of first wires arranged in a first layer at predetermined intervals in a row direction, where the first wires have ends connected to second wires arranged in a second layer at a predetermined intervals through vias, and the first wire and second wire are at the same potential. In the pair of row wires, a first wire positioned at a right end of one row wire is connected to a first conductor, and a first wire positioned at a left end in the other row wire is connected to a second conductor. By sequentially scanning the first conductor and second conductor using an electron beam, a change in the amount of emitted secondary electrons due to a difference in potential between these conductors is detected to detect electric anomalies.
摘要:
The electron beam apparatus is provided with a stage for mounting a sample thereon, a primary optical system for generating an electron beam having an irradiation area and irradiating the electron beam onto the sample, a secondary optical system for detecting electrons which have been generated through the irradiation of the electron beam onto the sample and have acquired structural information of the sample and acquiring an image of the sample about a viewing area and an irradiation area changing section for changing the position of the irradiation area with respect to the viewing area.
摘要:
A technique capable of improving the ability to observe a specimen using an electron beam in an energy region which has not been conventionally given attention is provided. This specimen observation method comprises: irradiating the specimen with an electron beam; detecting electrons to be observed which have been generated and have obtained information on the specimen by the electron beam irradiation; and generating an image of the specimen from the detected electrons to be observed. The electron beam irradiation comprises irradiating the specimen with the electron beam with a landing energy set in a transition region between a secondary emission electron region in which secondary emission electrons are detected and a mirror electron region in which mirror electrons are detected, thereby causing the secondary emission electrons and the mirror electrons to be mixed as the electrons to be observed. The detection of the electrons to be observed comprises performing the detection in a state where the secondary emission electrons and the mirror electrons are mixed. Observation and inspection can be quickly carried out for a fine foreign material and pattern of 100 nm or less.