CURABLE RESIN COMPOSITION AND CURED PRODUCT
    9.
    发明公开

    公开(公告)号:US20240317916A1

    公开(公告)日:2024-09-26

    申请号:US18577915

    申请日:2022-06-30

    申请人: DIC CORPORATION

    摘要: An object is to provide a curable resin composition that can provide its cured product with excellent heat resistance (a high glass transition temperature) and dielectric properties (low dielectric properties) and the cured product. Specifically, provided is a curable resin composition containing a curable resin (A) having a structure represented by General Formula (1) below and a curable resin (B1) having a structure represented by General Formula (2-1) below and/or a curable compound (B2) represented by General Formula (2-2) below:




    in General Formula (1) above, the details of the substituents and the number of the substituents are as described in the present specification.




    in General Formulae (2-1) and (2-2) above, the details of the substituents and the number of the substituents are as described in the present specification.