公开(公告)号：US20130139524A1

公开(公告)日：2013-06-06

申请号：US13692394

申请日：2012-12-03

申请人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunseok CHO

发明人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunseok CHO

IPC分类号： F25B21/02

CPC分类号： F25B21/02 ,  F25B2321/0212 ,  F25B2700/2107 ,  H01L35/32 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/12044 ,  H01L2924/00014 ,  H01L2924/00

摘要： Provided are thermoelectric cooling packages and thermal management methods thereof. The method may include measuring a temperature of the thermoelectric cooling package including a semiconductor chip and a thermoelectric cooler, comparing the temperature of the thermoelectric cooling package with a target temperature, operating the thermoelectric cooler when the temperature of the thermoelectric cooling package is higher than the target temperature, and stopping the operation of the thermoelectric cooler when the temperature of the thermoelectric cooling package becomes lower than the target temperature.

摘要翻译： 提供热电冷却封装及其热管理方法。 该方法可以包括测量包括半导体芯片和热电冷却器的热电冷却封装的温度，将热电冷却封装的温度与目标温度进行比较，当热电冷却封装的温度高于 目标温度，并且当热电冷却封装的温度变得低于目标温度时，停止热电冷却器的操作。

公开(公告)号：US20130091348A1

公开(公告)日：2013-04-11

申请号：US13617619

申请日：2012-09-14

申请人： Heungkyu KWON ,  Jae Choon KIM ,  Eunseok CHO ,  Jichul KIM

发明人： Heungkyu KWON ,  Jae Choon KIM ,  Eunseok CHO ,  Jichul KIM

IPC分类号： G06F9/06

CPC分类号： G06F1/206 ,  G01J5/10 ,  G05B15/02

摘要： A surface temperature management method of mobile device is provided. The method includes sensing a temperature of an application processor in an operation mode of the mobile device; and controlling the application processor using the sensed temperature and a surface temperature management table to manage a surface temperature of a target part of the mobile device. The surface temperature management table includes information related to the temperature of the application processor corresponding to the surface temperature of the target part in the operation mode.

摘要翻译： 提供了移动设备的表面温度管理方法。 该方法包括在移动设备的操作模式中感测应用处理器的温度; 以及使用感测到的温度来控制应用处理器和表面温度管理表以管理移动设备的目标部分的表面温度。 表面温度管理表包括与操作模式中的目标部件的表面温度相对应的与应用处理器的温度有关的信息。

公开(公告)号：US20130021768A1

公开(公告)日：2013-01-24

申请号：US13535967

申请日：2012-06-28

申请人： Jichul KIM ,  Jae Choon KIM ,  Young-deuk KIM ,  Eunseok CHO

发明人： Jichul KIM ,  Jae Choon KIM ,  Young-deuk KIM ,  Eunseok CHO

IPC分类号： H01L23/495 ,  H05K7/04

CPC分类号： H01L23/4985 ,  H01L23/36 ,  H01L23/3736 ,  H01L2224/16225

摘要： Chip-on-film packages are provided. A chip-on-film package includes a film substrate having a first surface and a second surface opposite to each other, a semiconductor chip on the first surface, and a thermal deformation member adjacent to the second surface. The thermal deformation member has a construction that causes its shape to transform according to a temperature. Related devices and device assembles are also provided.

摘要翻译： 提供片上胶卷包装。 片上胶片包装包括具有彼此相对的第一表面和第二表面的膜基材，第一表面上的半导体芯片和与第二表面相邻的热变形部件。 热变形构件具有使其形状根据温度变形的结构。 还提供了相关的设备和设备组件。

公开(公告)号：US20140247859A1

公开(公告)日：2014-09-04

申请号：US14136787

申请日：2013-12-20

申请人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunho JUNG

发明人： Jae Choon KIM ,  Jichul KIM ,  Jin-Kwon BAE ,  Eunho JUNG

IPC分类号： G01K7/01

CPC分类号： G01K7/42 ,  G01K3/06 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014

摘要： A semiconductor package includes a first package including a first substrate and a first semiconductor chip mounted on the first substrate and a second package facing and spaced apart from the first package. The second package includes a second substrate on which a second semiconductor chip is mounted. The semiconductor package also includes a connection structure electrically connecting the first and second packages to each other, a first temperature sensor connected to the first substrate, a second temperature sensor connected to the first semiconductor chip, and a third temperature sensor connected to the second semiconductor chip.

摘要翻译： 半导体封装包括第一封装，第一封装包括第一衬底和安装在第一衬底上的第一半导体芯片以及与第一封装相对并间隔开的第二封装。 第二封装包括其上安装有第二半导体芯片的第二基板。 半导体封装还包括将第一和第二封装彼此电连接的连接结构，连接到第一衬底的第一温度传感器，连接到第一半导体芯片的第二温度传感器和连接到第二半导体的第三温度传感器 芯片。

公开(公告)号：US20140239434A1

公开(公告)日：2014-08-28

申请号：US14134580

申请日：2013-12-19

申请人： Jae Choon KIM ,  Jin-Kwon BAE ,  Eunho JUNG

发明人： Jae Choon KIM ,  Jin-Kwon BAE ,  Eunho JUNG

IPC分类号： H01L23/34

CPC分类号： H01L23/34 ,  H01L23/3675 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49866 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/17181 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/00014 ,  H01L2924/00

摘要： According to example embodiments, a semiconductor package may include a first package substrate, a first semiconductor chip on the first package substrate, and a thermistor array film on the first semiconductor chip. The thermistor array film may include a variable resistive film that covers the first semiconductor chip, and an array of electrode patterns that are connected to the variable resistive film. The array of electrode patterns may be connected to at least one of the upper and lower surfaces of the variable resistive film.

摘要翻译： 根据示例性实施例，半导体封装可以包括第一封装衬底，第一封装衬底上的第一半导体芯片和第一半导体芯片上的热敏电阻阵列膜。 热敏电阻阵列膜可以包括覆盖第一半导体芯片的可变电阻膜和连接到可变电阻膜的电极图案阵列。 电极图案的阵列可以连接到可变电阻膜的上表面和下表面中的至少一个。

公开(公告)号：US20170207205A1

公开(公告)日：2017-07-20

申请号：US15406925

申请日：2017-01-16

申请人： Jichul KIM ,  Jae Choon KIM ,  Hansung RYU ,  KyongSoon CHO ,  YoungSang CHO ,  Yeo-Hoon YOON

发明人： Jichul KIM ,  Jae Choon KIM ,  Hansung RYU ,  KyongSoon CHO ,  YoungSang CHO ,  Yeo-Hoon YOON

IPC分类号： H01L25/10 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L21/48 ,  H01L23/538

CPC分类号： H01L25/105 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/04105 ,  H01L2224/08146 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/83005 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/1432 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/45099

摘要： A semiconductor package is provided which includes a redistribution substrate, an interconnect substrate on the redistribution substrate, a metal layer on the semiconductor chip, a semiconductor chip on the redistribution substrate and in the hole of the interconnect substrate, and a mold layer in a gap between the semiconductor chip and the interconnect substrate. The interconnect substrate includes a hole penetrating thereinside. The interconnect substrate includes base layers and a conductive member extending through the base layers. A top surface of the interconnect substrate is positioned either above or below the level of the top surface of the metal layer.

公开(公告)号：US20160204080A1

公开(公告)日：2016-07-14

申请号：US14958928

申请日：2015-12-03

申请人： Jae Choon KIM ,  Donghan KIM ,  Jikho SONG ,  Mitsuo UMEMOTO ,  Inho CHOI

发明人： Jae Choon KIM ,  Donghan KIM ,  Jikho SONG ,  Mitsuo UMEMOTO ,  Inho CHOI

IPC分类号： H01L25/065 ,  H01L25/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/367 ,  H01L23/31

CPC分类号： H01L25/50 ,  H01L23/3128 ,  H01L23/367 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/20 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/92 ,  H01L25/105 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2225/1076 ,  H01L2225/1094 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1438 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a first protrusion extending beyond a perimeter of the semiconductor chip and extending towards the connection pillar.

摘要翻译： 一种半导体封装，包括：半导体芯片; 与所述半导体芯片相邻配置的连接柱; 设置在半导体芯片上的第一散热层; 以及设置在所述第一散热层上的第二散热层，所述第二散热层包括延伸超过所述半导体芯片的周边并朝向所述连接柱延伸的第一突起。