公开(公告)号：US09966356B2

公开(公告)日：2018-05-08

申请号：US15489958

申请日：2017-04-18

Applicant: The Goverment of the United States of America, as represented by the Secretary of the Navy

Inventor： Scott A. Mathews ,  Iyoel Beniam ,  Alberto Piqué

IPC: H01L21/44 ,  H01L23/00 ,  H01L21/48 ,  H01L21/768

CPC classification number: H01L24/48 ,  H01L21/4828 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/29147 ,  H01L2224/43001 ,  H01L2224/435 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48101 ,  H01L2224/4814 ,  H01L2224/48472 ,  H01L2224/85039 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

公开(公告)号：US20140061910A1

公开(公告)日：2014-03-06

申请号：US13601746

申请日：2012-08-31

Applicant: CHU-CHUNG LEE ,  VIKAS R. SHETH

Inventor： CHU-CHUNG LEE ,  VIKAS R. SHETH

IPC: H01L21/768 ,  H01L23/49

CPC classification number: H01L24/05 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/05647 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48463 ,  H01L2224/48647 ,  H01L2224/48847 ,  H01L2224/85031 ,  H01L2224/85039 ,  H01L2224/85205 ,  H01L2224/85375 ,  H01L2924/12042 ,  H01L2924/20306 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method of making a semiconductor device can comprise forming a copper bond pad on an integrated circuit device; forming a first passivation layer on the integrated circuit device and the copper bond pad; forming a second passivation layer on the first passivation layer; forming a mask over the first and second passivation layers around the copper bond pad; etching the second passivation layer over the copper bond pad; and cleaning the first passivation layer over the copper bond pad. At least a portion of the first passivation layer remains over the copper bond pad after the etching the second passivation layer. A thickness of the first passivation layer over the copper bond pad is selected to protect the copper bond pad from oxidation and to allow wire bonding to the copper bond pad through the first passivation layer.

Abstract translation: 制造半导体器件的方法可以包括在集成电路器件上形成铜焊盘; 在集成电路器件和铜接合焊盘上形成第一钝化层; 在所述第一钝化层上形成第二钝化层; 在铜接合焊盘周围的第一钝化层和第二钝化层上形成掩模; 在铜焊盘上蚀刻第二钝化层; 以及在所述铜接合焊盘上清洁所述第一钝化层。 在蚀刻第二钝化层之后，第一钝化层的至少一部分保留在铜接合焊盘上。 选择铜接合焊盘上的第一钝化层的厚度以保护铜结合焊盘免于氧化，并允许通过第一钝化层引线键合至铜键合焊盘。

公开(公告)号：US20140151905A1

公开(公告)日：2014-06-05

申请号：US13693481

申请日：2012-12-04

Applicant: INFINEON TECHNOLOGIES AG

Inventor： Michael Sternad ,  Rainer Pelzer

IPC: H01R43/02 ,  G02B19/00 ,  H01L23/498

CPC classification number: H01R43/02 ,  B23K26/22 ,  B23K2101/38 ,  G02B19/0028 ,  G02B19/0047 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48463 ,  H01L2224/48465 ,  H01L2224/48647 ,  H01L2224/48747 ,  H01L2224/48847 ,  H01L2224/78263 ,  H01L2224/78301 ,  H01L2224/85039 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2924/12042 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076 ,  H01L2924/00

Abstract: A device includes a tube extending in a longitudinal direction and a hollow channel arranged in the tube. An end part of the tube is formed such that first electromagnetic radiation paths extending in the tube and outside of the hollow channel in the longitudinal direction are focused in a first focus.

Abstract translation: 一种装置包括沿纵向延伸的管和布置在管中的中空通道。 管的端部形成为使得沿着纵向方向在管中延伸到中空通道外部的第一电磁辐射路径被聚焦在第一焦点中。

公开(公告)号：US20090029542A1

公开(公告)日：2009-01-29

申请号：US12240372

申请日：2008-09-29

Applicant: Willmar E. SUBIDO ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

Inventor： Willmar E. SUBIDO ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

IPC: H01L21/44

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K26/0006 ,  B23K26/22 ,  B23K26/352 ,  B23K28/02 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85014 ,  H01L2224/85016 ,  H01L2224/85039 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.

Abstract translation: 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺，氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后，使自由空气球与调节的接合表面接触以形成焊缝。

公开(公告)号：US20180240772A1

公开(公告)日：2018-08-23

申请号：US15962736

申请日：2018-04-25

Applicant: The Government of the United States of America, as represented by the Secretary of the Navy

Inventor： Scott A. Mathews ,  Iyoel Beniam ,  Alberto Piqué

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/48

CPC classification number: H01L24/48 ,  H01L21/4828 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/29147 ,  H01L2224/43001 ,  H01L2224/435 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48101 ,  H01L2224/4814 ,  H01L2224/48472 ,  H01L2224/85039 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: An electronic device made from the method of providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, laser bending the shaped metallic interconnects; and transferring the shaped metallic interconnects onto a receiving substrate or device.

公开(公告)号：US20170103902A1

公开(公告)日：2017-04-13

申请号：US15178930

申请日：2016-06-10

Applicant: The Government of the United States of America, as represented by the Secretary of the Navy

Inventor： Scott A. Mathews ,  Iyoel Beniam ,  Alberto Piqué

IPC: H01L21/48 ,  H01L23/00 ,  H01L21/768

CPC classification number: H01L24/48 ,  H01L21/4828 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/29147 ,  H01L2224/43001 ,  H01L2224/435 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48101 ,  H01L2224/4814 ,  H01L2224/48472 ,  H01L2224/85039 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

公开(公告)号：US09685349B2

公开(公告)日：2017-06-20

申请号：US15178930

申请日：2016-06-10

Applicant: The United States of America, as represented by the Secretary of the Navy

Inventor： Scott A. Mathews ,  Iyoel Beniam ,  Alberto Piqué

IPC: H01L21/44 ,  H01L21/48 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L24/48 ,  H01L21/4828 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/29147 ,  H01L2224/43001 ,  H01L2224/435 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48101 ,  H01L2224/4814 ,  H01L2224/48472 ,  H01L2224/85039 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.

公开(公告)号：US07476597B2

公开(公告)日：2009-01-13

申请号：US11456404

申请日：2006-07-10

Applicant: Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

Inventor： Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

IPC: H01L21/322 ,  H01L21/44 ,  H01L21/00

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K26/0006 ,  B23K26/22 ,  B23K26/352 ,  B23K28/02 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85014 ,  H01L2224/85016 ,  H01L2224/85039 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.

Abstract translation: 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺，氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后，使自由空气球与调节的接合表面接触以形成焊缝。

公开(公告)号：US20080009129A1

公开(公告)日：2008-01-10

申请号：US11456404

申请日：2006-07-10

Applicant: Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

Inventor： Willmar E. Subido ,  Edgardo Hortaleza ,  Stuart M. Jacobsen

IPC: H01L21/44

CPC classification number: H01L24/85 ,  B23K20/007 ,  B23K26/0006 ,  B23K26/22 ,  B23K26/352 ,  B23K28/02 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/48505 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/78268 ,  H01L2224/78301 ,  H01L2224/85014 ,  H01L2224/85016 ,  H01L2224/85039 ,  H01L2224/85045 ,  H01L2224/85205 ,  H01L2224/85214 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The invention provides methods and systems for laser assisted wirebonding. One or more conditioning laser pulses are used to prepare a bonding surface for wirebonding by removing impurities such as residues from manufacturing processes, oxides, or irregularities on the bonding surface. Subsequently, a free air ball is brought into contact with the conditioned bonding surface to form a weld.

Abstract translation: 本发明提供了用于激光辅助引线键合的方法和系统。 使用一个或多个调理激光脉冲来通过去除粘合表面上的制造工艺，氧化物或不规则物的残留物等杂质来制备用于引线接合的接合表面。 随后，使自由空气球与调节的接合表面接触以形成焊缝。

公开(公告)号：US20170221851A1

公开(公告)日：2017-08-03

申请号：US15489958

申请日：2017-04-18

Applicant: The Government of the United States of America, as represented by the Secretary of the Navy

Inventor： Scott A. Mathews ,  Iyoel Beniam ,  Alberto Piqué

IPC: H01L23/00 ,  H01L21/768 ,  H01L21/48

CPC classification number: H01L24/48 ,  H01L21/4828 ,  H01L21/76885 ,  H01L24/05 ,  H01L24/43 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/29147 ,  H01L2224/43001 ,  H01L2224/435 ,  H01L2224/45012 ,  H01L2224/45014 ,  H01L2224/45147 ,  H01L2224/4805 ,  H01L2224/48101 ,  H01L2224/4814 ,  H01L2224/48472 ,  H01L2224/85039 ,  H01L2224/8584 ,  H01L2224/8585 ,  H01L2924/00014 ,  H01L2224/05599 ,  H01L2224/85399

Abstract: A method of forming and transferring shaped metallic interconnects, comprising providing a donor substrate comprising an array of metallic interconnects, using a laser system to prepare the metallic interconnects, forming shaped metallic interconnects, and transferring the shaped metallic interconnect to an electrical device. An electronic device made from the method of providing a donor ribbon, wherein the donor ribbon comprises an array of metal structures and a release layer on a donor substrate, providing a stencil to the metal structures on the donor substrate, applying a laser pulse through the donor substrate to the metal structures, and directing the metal structures to an electronic device.