Patent search ap:("Invensas Corporation") AND inv:"Willmar Subido" Page 1

1.

发明申请
WIRE BOND WIRES FOR INTERFERENCE SHIELDING 有权

公开(公告)号：US20170117231A1

公开(公告)日：2017-04-27

申请号：US15344990

申请日：2016-11-07

Applicant: Invensas Corporation

Inventor： Abiola Awujoola , Zhuowen Sun , Wael Zohni , Ashok S. Prabhu , Willmar Subido

IPC: H01L23/552 , H01L23/498 , H01L25/065 , H01L23/00

CPC classification number: H01L23/552 , H01L23/49811 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/04042 , H01L2224/1134 , H01L2224/12105 , H01L2224/13076 , H01L2224/13082 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/17051 , H01L2224/17181 , H01L2224/215 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/48105 , H01L2224/48227 , H01L2224/48472 , H01L2224/4942 , H01L2224/73204 , H01L2224/73207 , H01L2224/73227 , H01L2224/73253 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/85444 , H01L2224/85455 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1052 , H01L2924/00014 , H01L2924/01322 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2224/45099 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/05599

Abstract: Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.

2.

发明授权
Wafer-level packaging using wire bond wires in place of a redistribution layer 有权
Title translation: 使用引线接合线代替再分布层的晶片级封装

公开(公告)号：US09502372B1

公开(公告)日：2016-11-22

申请号：US14701049

申请日：2015-04-30

Applicant: Invensas Corporation

Inventor： Rajesh Katkar , Tu Tam Vu , Bongsub Lee , Kyong-Mo Bang , Xuan Li , Long Huynh , Gabriel Z. Guevara , Akash Agrawal , Willmar Subido , Laura Wills Mirkarimi

IPC: H01L23/00 , H01L23/31 , H01L25/065 , H01L21/56 , H01L21/78

CPC classification number: H01L24/49 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/78 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/48 , H01L24/85 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/4801 , H01L2224/48235 , H01L2224/484 , H01L2224/4845 , H01L2224/49171 , H01L2224/49173 , H01L2224/49177 , H01L2224/73217 , H01L2224/73267 , H01L2224/85005 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/18162 , H01L2924/2064 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/85399

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract translation: 一种装置一般涉及微电子封装。在这种装置中，微电子管芯具有第一表面，与第一表面相对的第二表面和第一表面和第二表面之间的侧壁表面。多个具有近端的引线接合线被耦合到微电子管芯的第一表面或第二表面，多个引线接合线的远端分别远离第一表面或第二表面微电子模具。多个引线接合线的一部分在微电子管芯的周边外延伸到扇出（“FO”）区域中。成型材料覆盖第一表面，侧壁表面以及多个引线接合线从微电子管芯的第一表面到模制材料的外表面的部分。

3.

发明授权
Wire bond wires for interference shielding 有权
Title translation: 接线用于干扰屏蔽

公开(公告)号：US09490222B1

公开(公告)日：2016-11-08

申请号：US14880967

申请日：2015-10-12

Applicant: Invensas Corporation

Inventor： Abiola Awujoola , Zhuowen Sun , Wael Zohni , Ashok S. Prabhu , Willmar Subido

IPC: H01L23/552 , H01L23/00

CPC classification number: H01L23/552 , H01L23/49811 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/04042 , H01L2224/1134 , H01L2224/12105 , H01L2224/13076 , H01L2224/13082 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/17051 , H01L2224/17181 , H01L2224/215 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/48105 , H01L2224/48227 , H01L2224/48472 , H01L2224/4942 , H01L2224/73204 , H01L2224/73207 , H01L2224/73227 , H01L2224/73253 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/85444 , H01L2224/85455 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1052 , H01L2924/00014 , H01L2924/01322 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2224/45099 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/05599

Abstract: Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.

Abstract translation: 公开了一般涉及具有防止干扰的微电子封装的装置。在其装置中，基板具有与上表面相对的上表面和下表面，并具有接地平面。第一微电子器件耦合到衬底的上表面。引线接合线耦合到接地平面，用于对其进行干涉并延伸离开衬底的上表面。引线接合线的第一部分被定位成相对于干涉为第一微电子器件提供屏蔽区域。导线接合线的第二部分不定位成提供屏蔽区域。第二微电子器件耦合到衬底并且位于屏蔽区域外部。导电表面在用于覆盖屏蔽区域的引线接合线的第一部分之上。

4.

发明授权
Wire bond wires for interference shielding 有权

公开(公告)号：US10559537B2

公开(公告)日：2020-02-11

申请号：US16127110

申请日：2018-09-10

Applicant: Invensas Corporation

Inventor： Abiola Awujoola , Zhuowen Sun , Wael Zohni , Ashok S. Prabhu , Willmar Subido

IPC: H01L23/552 , H01L23/00 , H01L23/498 , H01L25/10 , H01L25/03 , H01L25/065

Abstract: Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.

5.

发明申请
Wire Bond Wires for Interference Shielding 审中-公开

公开(公告)号：US20180061774A1

公开(公告)日：2018-03-01

申请号：US15804122

申请日：2017-11-06

Applicant: Invensas Corporation

Inventor： Abiola Awujoola , Zhuowen Sun , Wael Zohni , Ashok S. Prabhu , Willmar Subido

IPC: H01L23/552 , H01L23/00 , H01L25/065 , H01L25/10 , H01L23/498

CPC classification number: H01L23/552 , H01L23/49811 , H01L24/06 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/105 , H01L2224/04042 , H01L2224/1134 , H01L2224/12105 , H01L2224/13076 , H01L2224/13082 , H01L2224/131 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/17051 , H01L2224/17181 , H01L2224/215 , H01L2224/2919 , H01L2224/32225 , H01L2224/45015 , H01L2224/48105 , H01L2224/48227 , H01L2224/48472 , H01L2224/4942 , H01L2224/73204 , H01L2224/73207 , H01L2224/73227 , H01L2224/73253 , H01L2224/73259 , H01L2224/73265 , H01L2224/73267 , H01L2224/85444 , H01L2224/85455 , H01L2225/06513 , H01L2225/06517 , H01L2225/1023 , H01L2225/1052 , H01L2924/00014 , H01L2924/01322 , H01L2924/1205 , H01L2924/1206 , H01L2924/1207 , H01L2924/181 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , H01L2224/45099 , H01L2924/2075 , H01L2924/20751 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/00012 , H01L2924/014 , H01L2924/00 , H01L2224/05599

Abstract: Apparatuses relating generally to a microelectronic package having protection from interference are disclosed. In an apparatus thereof, a substrate has an upper surface and a lower surface opposite the upper surface and has a ground plane. A first microelectronic device is coupled to the upper surface of the substrate. Wire bond wires are coupled to the ground plane for conducting the interference thereto and extending away from the upper surface of the substrate. A first portion of the wire bond wires is positioned to provide a shielding region for the first microelectronic device with respect to the interference. A second portion of the wire bond wires is not positioned to provide the shielding region. A second microelectronic device is coupled to the substrate and located outside of the shielding region. A conductive surface is over the first portion of the wire bond wires for covering the shielding region.

6.

发明授权
Ball bonding metal wire bond wires to metal pads 有权

公开(公告)号：US09761554B2

公开(公告)日：2017-09-12

申请号：US14796745

申请日：2015-07-10

Applicant: Invensas Corporation

Inventor： Willmar Subido , Reynaldo Co , Wael Zohni , Ashok S. Prabhu

IPC: H01L23/48 , H01L23/52 , H01L23/49 , H01L23/00

CPC classification number: H01L24/48 , H01L24/45 , H01L24/81 , H01L24/85 , H01L2224/05124 , H01L2224/05147 , H01L2224/05155 , H01L2224/05624 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/45147 , H01L2224/45565 , H01L2224/45572 , H01L2224/45616 , H01L2224/45644 , H01L2224/48227 , H01L2224/48229 , H01L2224/4845 , H01L2224/48471 , H01L2224/48479 , H01L2224/48507 , H01L2224/78301 , H01L2224/81815 , H01L2224/8501 , H01L2224/85014 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2224/85447 , H01L2924/00014 , H01L2924/14 , H01L2924/15747 , H01L2924/20105 , H01L2224/45015 , H01L2924/207 , H01L2924/01008 , H01L2224/45664

Abstract: An apparatus, and methods therefor, relates generally to an integrated circuit package. In such an apparatus, a platform substrate has a copper pad. An integrated circuit die is coupled to the platform substrate. A wire bond wire couples a contact of the integrated circuit die and the copper pad. A first end of the wire bond wire is ball bonded with a ball bond for direct contact with an upper surface of the copper pad. A second end of the wire bond wire is stitch bonded with a stitch bond to the contact.

7.

发明申请
WAFER-LEVEL PACKAGING USING WIRE BOND WIRES IN PLACE OF A REDISTRIBUTION LAYER 有权
Title translation: 在重新分配层的位置使用线束焊接的水平包装

公开(公告)号：US20170069591A1

公开(公告)日：2017-03-09

申请号：US15357553

申请日：2016-11-21

Applicant: Invensas Corporation

Inventor： Rajesh Katkar , Tu Tam Vu , Bongsub Lee , Kyong-Mo Bang , Xuan Li , Long Huynh , Gabriel Z. Guevara , Akash Agrawal , Willmar Subido , Laura Wills Mirkarimi

IPC: H01L23/00 , H01L25/065 , H01L21/78 , H01L25/10 , H01L23/31 , H01L21/56

CPC classification number: H01L24/49 , H01L21/486 , H01L21/561 , H01L21/565 , H01L21/568 , H01L21/78 , H01L23/3114 , H01L23/49816 , H01L23/49827 , H01L23/5389 , H01L24/19 , H01L24/20 , H01L24/48 , H01L24/85 , H01L24/96 , H01L24/97 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/04105 , H01L2224/12105 , H01L2224/32145 , H01L2224/32225 , H01L2224/33181 , H01L2224/4801 , H01L2224/48235 , H01L2224/484 , H01L2224/4845 , H01L2224/49171 , H01L2224/49173 , H01L2224/49177 , H01L2224/73217 , H01L2224/73267 , H01L2224/85005 , H01L2224/92244 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/1035 , H01L2225/1041 , H01L2225/1058 , H01L2924/00014 , H01L2924/10252 , H01L2924/10253 , H01L2924/10271 , H01L2924/10272 , H01L2924/10329 , H01L2924/14 , H01L2924/181 , H01L2924/18162 , H01L2924/2064 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/83 , H01L2924/00 , H01L2224/05599 , H01L2224/85399

Abstract: An apparatus relates generally to a microelectronic package. In such an apparatus, a microelectronic die has a first surface, a second surface opposite the first surface, and a sidewall surface between the first and second surfaces. A plurality of wire bond wires with proximal ends thereof are coupled to either the first surface or the second surface of the microelectronic die with distal ends of the plurality of wire bond wires extending away from either the first surface or the second surface, respectively, of the microelectronic die. A portion of the plurality of wire bond wires extends outside a perimeter of the microelectronic die into a fan-out (“FO”) region. A molding material covers the first surface, the sidewall surface, and portions of the plurality of the wire bond wires from the first surface of the microelectronic die to an outer surface of the molding material.

Abstract translation: 一种装置一般涉及微电子封装。在这种装置中，微电子管芯具有第一表面，与第一表面相对的第二表面和第一表面和第二表面之间的侧壁表面。多个具有近端的引线接合线被耦合到微电子管芯的第一表面或第二表面，多个引线接合线的远端分别远离第一表面或第二表面微电子模具。多个引线接合线的一部分在微电子管芯的周边外延伸到扇出（“FO”）区域中。成型材料覆盖第一表面，侧壁表面以及多个引线接合线从微电子管芯的第一表面到模制材料的外表面的部分。

8.

发明授权
Coupling of side surface contacts to a circuit platform 有权
Title translation: 将侧面触点耦合到电路平台

公开(公告)号：US09530749B2

公开(公告)日：2016-12-27

申请号：US14698684

申请日：2015-04-28

Applicant: Invensas Corporation

Inventor： Reynaldo Co , Willmar Subido , Hoang Nguyen , Marjorie Cara , Wael Zohni , Christopher W. Lattin

IPC: H01L23/02 , H01L23/48 , H01L23/52 , H01L29/40 , H01L21/44 , H01L21/48 , H01L21/50 , H05K1/11 , H05K1/14 , H01L23/00 , B81B7/00 , B81C1/00 , B23K20/00

CPC classification number: H01L24/49 , B81B7/007 , B81B7/0074 , B81B2207/05 , B81C1/00301 , H01L24/48 , H01L24/85 , H01L2224/16225 , H01L2224/48091 , H01L2224/48106 , H01L2224/48227 , H01L2224/4903 , H01L2224/85045 , H01L2224/85203 , H01L2924/00014 , H01L2924/1461 , H01L2224/45099 , H01L2224/45015 , H01L2924/207 , H01L2224/05599

Abstract: An apparatus relates generally to a microelectromechanical system component. In such an apparatus, the microelectromechanical system component has a lower surface, an upper surface, first side surfaces, and second side surfaces. Surface area of the first side surfaces is greater than surface area of the second side surfaces. The microelectromechanical system component has a plurality of wire bond wires attached to and extending away from a first side surface of the first side surfaces. The wire bond wires are self-supporting and cantilevered with respect to the first side surface of the first side surfaces.

Abstract translation: 一种装置一般涉及微机电系统部件。在这种装置中，微机电系统部件具有下表面，上表面，第一侧表面和第二侧表面。第一侧面的表面积大于第二侧面的表面积。微电子机械系统部件具有多个连接到第一侧表面的第一侧表面并且远离第一侧表面的线接合线。线接合线相对于第一侧表面的第一侧表面是自支撑的和悬臂的。