公开(公告)号：US09779965B2

公开(公告)日：2017-10-03

申请号：US15456767

申请日：2017-03-13

申请人： Kulicke and Soffa Industries, Inc.

发明人： Robert N. Chylak ,  Dominick A. DeAngelis ,  Horst Clauberg

IPC分类号： H01L21/449 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065 ,  H01L21/762 ,  H01L21/60

CPC分类号： H01L21/449 ,  H01L21/76251 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/75 ,  H01L24/81 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2021/60195 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/136 ,  H01L2224/13687 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75343 ,  H01L2224/75348 ,  H01L2224/75349 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81355 ,  H01L2224/81409 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/81906 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20301 ,  H01L2924/20302 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/8121 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/81 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0503 ,  H01L2924/01013 ,  H01L2924/0504 ,  H01L2924/0105 ,  H01L2924/0502 ,  H01L2924/0103 ,  H01L2924/0494 ,  H01L2924/0104 ,  H01L2924/0495 ,  H01L2924/01023 ,  H01L2924/0496 ,  H01L2924/01024 ,  H01L2924/05 ,  H01L2924/01028 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0542 ,  H01L2924/0534 ,  H01L2924/0535 ,  H01L2924/0536 ,  H01L2924/054 ,  H01L2924/0463 ,  H01L2924/0464 ,  H01L2924/0462 ,  H01L2924/0454 ,  H01L2924/0455 ,  H01L2924/0456 ,  H01L2924/046 ,  H01L2924/01105

摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.

公开(公告)号：US20170186627A1

公开(公告)日：2017-06-29

申请号：US15456767

申请日：2017-03-13

申请人： Kulicke and Soffa Industries, Inc.

发明人： Robert N. Chylak ,  Dominick A. DeAngelis ,  Horst Clauberg

IPC分类号： H01L21/449 ,  H01L21/762 ,  H01L25/00 ,  H01L25/065 ,  H01L23/00

CPC分类号： H01L21/449 ,  H01L21/76251 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/75 ,  H01L24/81 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2021/60195 ,  H01L2224/1134 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/136 ,  H01L2224/13687 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75301 ,  H01L2224/75343 ,  H01L2224/75348 ,  H01L2224/75349 ,  H01L2224/75744 ,  H01L2224/75745 ,  H01L2224/759 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81201 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/81207 ,  H01L2224/81355 ,  H01L2224/81409 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/81906 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20102 ,  H01L2924/20103 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/20107 ,  H01L2924/20301 ,  H01L2924/20302 ,  H01L2924/20303 ,  H01L2924/20304 ,  H01L2924/20305 ,  H01L2924/20306 ,  H01L2924/20307 ,  H01L2924/01029 ,  H01L2924/01014 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/8121 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/81 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/0503 ,  H01L2924/01013 ,  H01L2924/0504 ,  H01L2924/0105 ,  H01L2924/0502 ,  H01L2924/0103 ,  H01L2924/0494 ,  H01L2924/0104 ,  H01L2924/0495 ,  H01L2924/01023 ,  H01L2924/0496 ,  H01L2924/01024 ,  H01L2924/05 ,  H01L2924/01028 ,  H01L2924/0543 ,  H01L2924/0544 ,  H01L2924/0542 ,  H01L2924/0534 ,  H01L2924/0535 ,  H01L2924/0536 ,  H01L2924/054 ,  H01L2924/0463 ,  H01L2924/0464 ,  H01L2924/0462 ,  H01L2924/0454 ,  H01L2924/0455 ,  H01L2924/0456 ,  H01L2924/046 ,  H01L2924/01105

摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.