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公开(公告)号：US20170186627A1
公开(公告)日：2017-06-29
申请号：US15456767
申请日：2017-03-13
IPC分类号： H01L21/449 , H01L21/762 , H01L25/00 , H01L25/065 , H01L23/00
CPC分类号： H01L21/449 , H01L21/76251 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/75 , H01L24/81 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2021/60195 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13187 , H01L2224/136 , H01L2224/13687 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/48091 , H01L2224/48225 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/81121 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81355 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81801 , H01L2224/81895 , H01L2224/81906 , H01L2224/94 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/00014 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19107 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/01029 , H01L2924/01014 , H01L2924/00012 , H01L2924/014 , H01L2224/8121 , H01L2924/00 , H01L2224/45099 , H01L2224/81 , H01L2924/04941 , H01L2924/04953 , H01L2924/0503 , H01L2924/01013 , H01L2924/0504 , H01L2924/0105 , H01L2924/0502 , H01L2924/0103 , H01L2924/0494 , H01L2924/0104 , H01L2924/0495 , H01L2924/01023 , H01L2924/0496 , H01L2924/01024 , H01L2924/05 , H01L2924/01028 , H01L2924/0543 , H01L2924/0544 , H01L2924/0542 , H01L2924/0534 , H01L2924/0535 , H01L2924/0536 , H01L2924/054 , H01L2924/0463 , H01L2924/0464 , H01L2924/0462 , H01L2924/0454 , H01L2924/0455 , H01L2924/0456 , H01L2924/046 , H01L2924/01105
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures. A bonding surface of at least one of the first conductive structures and the second conductive structures includes a frangible coating.
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公开(公告)号：US20150097285A1
公开(公告)日：2015-04-09
申请号：US14505609
申请日：2014-10-03
IPC分类号： H01L23/00
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/75 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/818 , H01L2224/81801 , H01L2224/81895 , H01L2224/81906 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/00014 , H01L2924/01029 , H01L2924/01014 , H01L2924/00012 , H01L2924/014 , H01L2224/8121 , H01L2924/00
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
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公开(公告)号：US09780065B2
公开(公告)日：2017-10-03
申请号：US15458381
申请日：2017-03-14
IPC分类号： H01L23/00 , H01L25/00 , H01L25/065
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13019 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29387 , H01L2224/32013 , H01L2224/32105 , H01L2224/32106 , H01L2224/32145 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/7565 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/7598 , H01L2224/75981 , H01L2224/81005 , H01L2224/8109 , H01L2224/8112 , H01L2224/81121 , H01L2224/81192 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/8121 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81801 , H01L2224/81906 , H01L2224/81907 , H01L2224/83005 , H01L2224/83102 , H01L2224/83104 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/00012 , H01L2924/00014 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19107 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/01029 , H01L2924/01014 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/05432 , H01L2224/81895
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.
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公开(公告)号：US09362247B2
公开(公告)日：2016-06-07
申请号：US14822164
申请日：2015-08-10
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/75 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/818 , H01L2224/81801 , H01L2224/81895 , H01L2224/81906 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/00014 , H01L2924/01029 , H01L2924/01014 , H01L2924/00012 , H01L2924/014 , H01L2224/8121 , H01L2924/00
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
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公开(公告)号：US20180026006A1
公开(公告)日：2018-01-25
申请号：US15722747
申请日：2017-10-02
IPC分类号： H01L23/00 , H01L25/03 , H01L25/065 , H01L25/00 , H01L25/10
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/48 , H01L24/73 , H01L24/75 , H01L24/83 , H01L24/94 , H01L24/97 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13019 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/2919 , H01L2224/29191 , H01L2224/2929 , H01L2224/29387 , H01L2224/32013 , H01L2224/32105 , H01L2224/32106 , H01L2224/32145 , H01L2224/48091 , H01L2224/48106 , H01L2224/48225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/7565 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/7598 , H01L2224/75981 , H01L2224/81005 , H01L2224/8109 , H01L2224/8112 , H01L2224/81121 , H01L2224/81192 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/8121 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/81801 , H01L2224/81906 , H01L2224/81907 , H01L2224/83005 , H01L2224/83102 , H01L2224/83104 , H01L2224/83192 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2224/94 , H01L2224/95 , H01L2224/97 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/00012 , H01L2924/00014 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/181 , H01L2924/19107 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/01029 , H01L2924/01014 , H01L2924/014 , H01L2924/00 , H01L2224/45099 , H01L2224/81 , H01L2224/83 , H01L2924/05442 , H01L2924/05432 , H01L2224/81895
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element; (b) ultrasonically forming tack bonds between ones of the first conductive structures and respective ones of the second conductive structures; and (c) forming completed bonds between the first conductive structures and the second conductive structures.
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公开(公告)号：US09633981B2
公开(公告)日：2017-04-25
申请号：US15147015
申请日：2016-05-05
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/75 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/818 , H01L2224/81801 , H01L2224/81895 , H01L2224/81906 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/00014 , H01L2924/01029 , H01L2924/01014 , H01L2924/00012 , H01L2924/014 , H01L2224/8121 , H01L2924/00
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
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公开(公告)号：US09905530B2
公开(公告)日：2018-02-27
申请号：US15449466
申请日：2017-03-03
IPC分类号： H01L23/00 , H01L25/00 , H01L25/10 , H01L25/065
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/75 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/818 , H01L2224/81801 , H01L2224/81895 , H01L2224/81906 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/00014 , H01L2924/01029 , H01L2924/01014 , H01L2924/00012 , H01L2924/014 , H01L2224/8121 , H01L2924/00
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
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公开(公告)号：US20170365569A1
公开(公告)日：2017-12-21
申请号：US15635189
申请日：2017-06-27
发明人： Frank Kriebel
IPC分类号： H01L23/00 , H01L23/538 , H01L23/498 , H01L21/48
CPC分类号： H01L24/11 , H01L21/4825 , H01L21/4853 , H01L23/49811 , H01L23/4985 , H01L23/5387 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/15 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/742 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L24/95 , H01L2223/6677 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/0401 , H01L2224/05552 , H01L2224/05553 , H01L2224/05554 , H01L2224/05567 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/0566 , H01L2224/05664 , H01L2224/05666 , H01L2224/05669 , H01L2224/05671 , H01L2224/1145 , H01L2224/11452 , H01L2224/11462 , H01L2224/11464 , H01L2224/1161 , H01L2224/11622 , H01L2224/1182 , H01L2224/13006 , H01L2224/13011 , H01L2224/13012 , H01L2224/13017 , H01L2224/13019 , H01L2224/13022 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13599 , H01L2224/16113 , H01L2224/16145 , H01L2224/16227 , H01L2224/16265 , H01L2224/2731 , H01L2224/27418 , H01L2224/278 , H01L2224/2919 , H01L2224/32225 , H01L2224/32245 , H01L2224/32265 , H01L2224/73104 , H01L2224/73204 , H01L2224/75348 , H01L2224/75349 , H01L2224/81005 , H01L2224/81014 , H01L2224/8112 , H01L2224/81191 , H01L2224/81193 , H01L2224/81206 , H01L2224/81345 , H01L2224/81385 , H01L2224/814 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/8149 , H01L2224/8181 , H01L2224/81898 , H01L2224/81907 , H01L2224/83191 , H01L2224/83192 , H01L2224/83874 , H01L2224/9211 , H01L2224/92125 , H01L2224/94 , H01L2224/95 , H01L2924/00014 , H01L2924/014 , H01L2924/206 , H01L2924/2064 , Y10T29/49018 , Y10T29/4913 , H01L2924/00012 , H01L2924/01028 , H01L2924/01029 , H01L2924/01074 , H01L2924/01082 , H01L2924/0105 , H01L2924/01047 , H01L2224/03 , H01L2224/27 , H01L2224/81 , H01L2224/83 , H01L2224/16225 , H01L2924/00
摘要： Contact bumps between a contact pad and a substrate can include a rough surface that can mate with the material of the substrate of which may be flexible. The rough surface can enhance the bonding strength of the contacts, for example, against shear and tension forces, especially for flexible systems such as smart label and may be formed via roller or other methods.
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公开(公告)号：US20160254252A1
公开(公告)日：2016-09-01
申请号：US15147015
申请日：2016-05-05
IPC分类号： H01L25/065 , H01L23/00
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/75 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/818 , H01L2224/81801 , H01L2224/81895 , H01L2224/81906 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/00014 , H01L2924/01029 , H01L2924/01014 , H01L2924/00012 , H01L2924/014 , H01L2224/8121 , H01L2924/00
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
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公开(公告)号：US20180182733A1
公开(公告)日：2018-06-28
申请号：US15905408
申请日：2018-02-26
IPC分类号： H01L23/00 , H01L25/065 , H01L25/10 , H01L25/00
CPC分类号： H01L24/81 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/48 , H01L24/75 , H01L25/03 , H01L25/0657 , H01L25/105 , H01L25/50 , H01L2224/1134 , H01L2224/1145 , H01L2224/11462 , H01L2224/13082 , H01L2224/131 , H01L2224/13109 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13624 , H01L2224/16148 , H01L2224/16225 , H01L2224/16238 , H01L2224/48091 , H01L2224/48225 , H01L2224/48227 , H01L2224/75251 , H01L2224/75252 , H01L2224/75301 , H01L2224/75343 , H01L2224/75348 , H01L2224/75349 , H01L2224/75744 , H01L2224/75745 , H01L2224/759 , H01L2224/8112 , H01L2224/81121 , H01L2224/81193 , H01L2224/81201 , H01L2224/81203 , H01L2224/81205 , H01L2224/81207 , H01L2224/81409 , H01L2224/81424 , H01L2224/81439 , H01L2224/81444 , H01L2224/81447 , H01L2224/818 , H01L2224/81801 , H01L2224/81895 , H01L2224/81906 , H01L2225/06513 , H01L2225/1023 , H01L2225/1058 , H01L2924/01047 , H01L2924/01049 , H01L2924/01079 , H01L2924/01082 , H01L2924/15311 , H01L2924/181 , H01L2924/20102 , H01L2924/20103 , H01L2924/20104 , H01L2924/20105 , H01L2924/20106 , H01L2924/20107 , H01L2924/20301 , H01L2924/20302 , H01L2924/20303 , H01L2924/20304 , H01L2924/20305 , H01L2924/20306 , H01L2924/20307 , H01L2924/00014 , H01L2924/01029 , H01L2924/01014 , H01L2924/00012 , H01L2924/014 , H01L2224/8121 , H01L2924/00
摘要： A method of ultrasonically bonding semiconductor elements includes the steps of: (a) aligning surfaces of a plurality of first conductive structures of a first semiconductor element to respective surfaces of a plurality of second conductive structures of a second semiconductor element, wherein the surfaces of each of the plurality of first conductive structures and the plurality of second conductive structures include aluminum; and (b) ultrasonically bonding ones of the first conductive structures to respective ones of the second conductive structures.
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