公开(公告)号：US09661743B1

公开(公告)日：2017-05-23

申请号：US14565247

申请日：2014-12-09

Applicant: Multek Technologies Ltd.

Inventor： Mark Bergman ,  Joan K. Vrtis

IPC: H05K1/00 ,  H05K1/02 ,  H05K3/46 ,  H05K1/03 ,  H05K1/09

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A flexible circuit board includes a center “rigid” section, such as a printed circuit stack, and an adjoining flexible multi-layer body that are fabricated from a common interconnect layer. A transition material is included at the interface between the center rigid section and the flexible multi-layer body to minimize ripping and cracking of the interconnect layer. The transition material can also be added at stress areas not related to the interface. The transition material is attached at the interface and stress areas of the flexible circuit board in order to strengthen the flexible circuit board in general and in particular the transition material included therein. The transition material layer is formed and deposited at one or more locations on or within the flexible circuit board in order to minimize, reduce, if not prevent cracking and ripping of the flexible circuit board as it is bent, flexed and/or twisted.

公开(公告)号：US08804344B2

公开(公告)日：2014-08-12

申请号：US13267801

申请日：2011-10-06

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K7/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其被模制成包括装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路。

公开(公告)号：US20140069706A1

公开(公告)日：2014-03-13

申请号：US14119295

申请日：2012-01-12

Applicant: Tomoyuki Unno ,  Kazuyoshi Inami ,  Kosuke Yasooka

Inventor： Tomoyuki Unno ,  Kazuyoshi Inami ,  Kosuke Yasooka

IPC: H05K1/11

CPC classification number: H05K1/115 ,  H01L23/49822 ,  H01L23/66 ,  H01L2223/6622 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01P5/028 ,  H01P5/085 ,  H05K1/0216 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/18 ,  H05K2201/09818 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In a multilayer substrate, a quasi-coaxial line is formed as a structure for transmitting a high-frequency signal generated by a mounted high-frequency device from an uppermost layer to a lowermost layer to externally output and for transmitting an externally input high-frequency signal from the lowermost layer to the high-frequency device. The quasi-coaxial line has: a central conductor being a vertical through hole via that connects between a metal pattern formed on an upper surface of the uppermost layer and a metal pattern formed on a lower surface of the lowermost layer; and outer conductors being a plurality of interlayer vias that are circularly arranged around the central conductor and connect between two or more layers. Whole or a part of the vertical through hole via is substituted by a capacitor structure formed of conductor pads facing each other without any via.

Abstract translation: 在多层基板中，形成准同轴线作为用于将由安装的高频装置产生的高频信号从最上层发送到最外层的结构，以外部输出并传输外部输入的高频 信号从最下层到高频器件。 准同轴线具有：中心导体，其是垂直通孔，其连接在形成在最上层的上表面上的金属图案和形成在最下层的下表面上的金属图案之间; 而外部导体是围绕中心导体圆周布置并在两层或更多层之间连接的多个层间通孔。 垂直通孔通孔的整体或一部分由不具有通孔的彼此相对的导体焊盘形成的电容器结构代替。

公开(公告)号：US09763326B1

公开(公告)日：2017-09-12

申请号：US14304029

申请日：2014-06-13

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/03 ,  A41D1/00 ,  H05K3/30

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.

公开(公告)号：US20160242290A1

公开(公告)日：2016-08-18

申请号：US15041104

申请日：2016-02-11

Applicant: Yazaki Corporation

Inventor： Akemi MAEBASHI ,  Pharima AKANITSUK

IPC: H05K1/18

CPC classification number: H05K3/3447 ,  H05K2201/09818 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.

Abstract translation: 电子元件单元和线束设有汇流条板。 汇流条板设置有内置在树脂材料中的金属汇流条，并且包括安装在安装表面上的继电器的端子被焊接在其中的通孔。 通孔设有贯穿母线的汇流条通孔，以及穿过树脂材料形成为比母线通孔大的树脂材料通孔，露出该母线的表面 母线。 当汇流条通孔的内径被定义为r并且树脂材料通孔的内径被定义为R时，满足1.5r≤R。

公开(公告)号：US09119291B2

公开(公告)日：2015-08-25

申请号：US14452808

申请日：2014-08-06

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K1/00 ,  H05K5/00 ,  H05K5/02 ,  B29C45/14 ,  H05K1/18 ,  H05K3/30 ,  H05K1/02 ,  F21V8/00 ,  D06F39/00

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

公开(公告)号：US20120314349A1

公开(公告)日：2012-12-13

申请号：US13267802

申请日：2011-10-06

Applicant: Scott Moncrieff

Inventor： Scott Moncrieff

IPC: H05K7/00 ,  B32B38/00 ,  H02G1/14

CPC classification number: H05K5/0017 ,  B29C45/14467 ,  B29C45/14639 ,  B29C45/14688 ,  B29C2045/14532 ,  D06F39/005 ,  G02B6/0001 ,  H05K1/0298 ,  H05K1/16 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/284 ,  H05K3/30 ,  H05K5/0243 ,  H05K2201/09818 ,  H05K2201/10507 ,  Y10T29/49004

Abstract: Provided are systems and methods for a control assembly including: a first film that is in-molded that includes decorative graphics, a front surface and a rear surface; and a second film molded to the rear surface of the first film having a printed circuit that includes sensors, control circuits and interconnects and a front and rear surface; and an internal connector.

Abstract translation: 提供了一种用于控制组件的系统和方法，包括：第一膜，其包含装饰图形，前表面和后表面; 以及模制到第一膜的后表面的第二膜，其具有包括传感器，控制电路和互连件以及前表面和后表面的印刷电路; 和内部连接器。

公开(公告)号：US09872383B1

公开(公告)日：2018-01-16

申请号：US14266636

申请日：2014-04-30

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/00 ,  H05K1/03 ,  H01R4/00 ,  D05B17/00 ,  H01R4/02 ,  H01R43/02 ,  H05K1/18 ,  H05K9/00

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.

公开(公告)号：US20170243049A1

公开(公告)日：2017-08-24

申请号：US15477084

申请日：2017-04-01

Applicant: SHENZHEN HUIDING TECHNOLOGY CO., LTD.

Inventor： Haoxiang DONG

IPC: G06K9/00 ,  A61B5/00 ,  H05K3/28 ,  H01L27/146 ,  H01L31/18 ,  H01L23/31 ,  H01L23/00 ,  H01L31/0203 ,  H05K3/06

CPC classification number: G06K9/00053 ,  A61B5/02416 ,  A61B5/0531 ,  A61B5/1172 ,  A61B5/14551 ,  A61B2562/04 ,  A61B2562/12 ,  A61B2562/166 ,  A61B2562/242 ,  A61B2562/247 ,  G06K9/0002 ,  G06K9/00114 ,  H01L27/14618 ,  H01L31/0203 ,  H01L31/18 ,  H01L2924/15 ,  H05K3/067 ,  H05K3/284 ,  H05K2201/09818

Abstract: A package structure, an electronic device and a method for manufacturing the package structure are presented. The package structure comprises: a substrate (100), a sensing module (200) disposed on an upper surface of the substrate (100) and electrically connected to the substrate (100), and a package colloid (300) disposed on the upper surface of the substrate (100) and coating at least one portion of the sensing module (200), wherein the sensing module (200) comprises a capacitive sensor (210) and an optical sensor (220), and the package colloid (300) comprises at least one portion of a photic zone (310) disposed corresponding to the optical sensor (220). Thus, the capacitive sensor and the optical sensor can be packaged in one package structure, so as to improve the degree of integration of the package structure and save the package space.

公开(公告)号：US09699919B2

公开(公告)日：2017-07-04

申请号：US15041104

申请日：2016-02-11

Applicant: Yazaki Corporation

Inventor： Akemi Maebashi ,  Pharima Akanitsuk

IPC: H05K1/14 ,  H05K3/34

CPC classification number: H05K3/3447 ,  H05K2201/09818 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09845 ,  H05K2201/10272

Abstract: An electronic component unit and a wire harness are provided with a bus bar plate. The bus bar plate is provided with a metallic bus bar that is built in a resin material, and including a through-hole in which a terminal of a relay mounted on a mounting surface is soldered. The through-hole is provided with a bus bar through-hole which penetrates the bus bar, and a resin material through-hole which penetrates the resin material and is formed to be larger than the bus bar through-hole to expose the surface of the bus bar. When an inner diameter of the bus bar through-hole is defined as r and an inner diameter of the resin material through-hole is defined as R, 1.5r≦R is satisfied.