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公开(公告)号：US10244623B2
公开(公告)日：2019-03-26
申请号：US15196280
申请日：2016-06-29
Applicant: FLEXTRONICS AP, LLC
Inventor： Anwar Mohammed , Weifeng Liu , Murad Kurwa
IPC: B33Y10/00 , B33Y80/00 , H05K1/02 , H05K1/09 , H05K3/00 , H05K3/12 , H05K3/20 , B29C65/72 , B29L31/34
Abstract: A method and apparatus for forming a circuit on an uneven two-dimensional (2-D) or three-dimensional (3-D) surface of an object is described. An amount of electrically conductive material to form a circuit between two points on the object is determined. The determined amount of electrically conductive material is deposited on a first surface of a stretchable substrate. The stretchable substrate with the deposited electrically conductive material is applied to the object to form a circuit between two points on the object.
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2.发明授权公开(公告)号：US10201080B2
公开(公告)日：2019-02-05
申请号：US14574944
申请日：2014-12-18
Applicant: FLEXTRONICS AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Murad Kurwa
IPC: H05K1/00 , H05K1/03 , H05K1/11 , H05K1/09 , H05K1/18 , H05K3/10 , H05K3/32 , H02K1/18 , H05K9/00 , H05K1/02 , H05K3/42
Abstract: An electronic module assembly and method of assembling an electronic module to a conductive fabric are provided. An electronic module assembly comprises a non-conductive fabric and a conductive fabric covering at least part of a first side of the non-conductive fabric. An electronics module is disposed on the conductive fabric, and a portion of the electronics module includes a wall defining a through hole. A fastener passing through the through hole and passing through the conductive fabric is configured to electronically couple the electronics module to the conductive fabric.
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公开(公告)号：US09684864B1
公开(公告)日：2017-06-20
申请号：US14615309
申请日：2015-02-05
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
IPC: G06K19/06 , G06K19/077
CPC classification number: G06K19/07779 , G06K19/027
Abstract: An RFID device assembly is fabricated by positioning an electrically conductive wire onto a fabric as a pattern that forms an antenna, and securing the wire to the fabric by stitching a non-electrically conductive thread over the wire and to the fabric. The two ends of the electrically conductive wire are positioned for coupling to antenna contact pads on an RFID device. The RFID device is attached to the fabric either before or after the electrically conductive wire is secured to the fabric by the stitched non-electrically conductive thread.
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公开(公告)号：US09674949B1
公开(公告)日：2017-06-06
申请号：US14266700
申请日：2014-04-30
Applicant: FLEXTRONICS AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed
CPC classification number: H05K1/0283 , H05K1/028 , H05K1/09 , H05K1/11 , H05K1/118 , H05K1/145 , H05K2201/0137 , H05K2201/0162 , H05K2201/032 , H05K2201/05 , H05K2201/10287
Abstract: A stretchable wire assembly includes a metal wire coupled between two elastic substrates. The two elastic substrates are selectively coupled together, and the metal wire is attached to one or both elastic substrates at select locations. The form of the metal wire is such that when the elastic substrates are in a relaxed, or non-stretched, state the metal wire forms a tortuous path, such as a waveform, along the coupled elastic substrates. The tortuous path of the metal wire provides slack such that as the elastic substrates are stretched the slack is taken up. Once released, the elastic substrates move from the stretched position to the relaxed, non-stretched position, and slack is reintroduced into the metal wire in the form of the original tortuous path.
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5.发明授权公开(公告)号：US09510649B1
公开(公告)日：2016-12-06
申请号：US14803788
申请日：2015-07-20
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Murad Kurwa , Anwar Mohammed , Zhen Feng
CPC classification number: A44B17/0064 , A41D1/005 , A44B17/0005 , A44B17/0041 , H01R43/16
Abstract: A disconnectable snap button connection for connecting electronic devices to fabrics, the disconnectable snap button connection and a method for making the same is described herein. The disconnectable snap button connection includes a component, a piece of conductive material, a piece of non-conductive material; wherein the piece of conductive material is attached to the piece of non-conductive material, a male portion of the disconnectable snap button, wherein the male portion of the disconnectable snap button is attached to the component, and a female portion of the disconnectable snap button, wherein the female portion of the disconnectable snap button is attached to the piece of conductive material. When the male portion of the disconnectable snap button is inserted into the female portion of the disconnectable snap button, a connection is made between the component and the piece of conductive material.
Abstract translation: 本文描述了用于将电子设备连接到织物的可断开的按钮连接，可断开的按扣连接及其制造方法。 可拆卸的按钮连接包括部件，一块导电材料，一块非导电材料; 其中所述导电材料片附接到所述非导电材料片，所述可断开扣扣的凸形部分，其中所述可断开扣扣的凸形部分附接到所述部件，并且所述可断开扣扣的阴部分 ，其中所述可拆卸按扣的阴部附接到所述导电材料片。 当可拆卸按扣的凸形部分插入到可拆卸按扣的凹形部分中时，在部件和导电材料片之间形成连接。
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Patent Agency Ranking
公开(公告)号：US09872383B1
公开(公告)日：2018-01-16
申请号：US14266636
申请日：2014-04-30
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Anwar Mohammed , Zhen Feng
CPC classification number: H01M6/40 , A41D1/002 , A41D1/005 , D05B17/00 , H01M2/08 , H01M6/12 , H01M10/0436 , H01R4/00 , H01R4/02 , H01R4/029 , H01R43/005 , H01R43/02 , H01R43/0235 , H05K1/0271 , H05K1/0296 , H05K1/0298 , H05K1/0306 , H05K1/0366 , H05K1/0373 , H05K1/038 , H05K1/0393 , H05K1/09 , H05K1/11 , H05K1/111 , H05K1/112 , H05K1/115 , H05K1/18 , H05K1/181 , H05K1/189 , H05K3/284 , H05K3/30 , H05K3/305 , H05K3/32 , H05K3/4015 , H05K3/42 , H05K3/4644 , H05K7/02 , H05K9/009 , H05K13/04 , H05K2201/0154 , H05K2201/0158 , H05K2201/0162 , H05K2201/0287 , H05K2201/05 , H05K2201/09418 , H05K2201/09818
Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire cloths, one electrically conductive wire cloth coupled to one electrical connection point on an electronic component. The electrically conductive wire cloth is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire cloth.
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公开(公告)号：US09801277B1
公开(公告)日：2017-10-24
申请号：US14455772
申请日：2014-08-08
Applicant: Flextronics AP, LLC
Inventor： Weifeng Liu , Zhen Feng , Anwar Mohammed , David Geiger , Murad Kurwa
CPC classification number: H05K1/14 , H01R12/52 , H05K1/0271 , H05K3/0085 , H05K3/241 , H05K3/303 , H05K3/3426 , H05K3/3436 , H05K3/4015 , H05K2201/04 , H05K2201/068 , H05K2201/10734 , H05K2201/10946 , H05K2201/10984 , H05K2201/2045 , H05K2203/0338 , H05K2203/0723
Abstract: A compliant interconnect with a cylindrical bellows structure is configured to reduce a stress between a substrate and a PCB board. The stress can be caused by a CTE (coefficient of thermal expansion) mismatch, a physical movement, or a combination thereof. The compliant interconnect can be solder to and/or immobilized on one or more coupling structure. Alternatively, the compliant interconnect can include an instant swapping structure (such as a socket) that makes the upgrade of the electronic components easier.
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公开(公告)号：US09661756B1
公开(公告)日：2017-05-23
申请号：US14455642
申请日：2014-08-08
Applicant: Flextronics AP, LLC
Inventor： Jennifer Nguyen , David Geiger , Anwar Mohammed , Murad Kurwa
CPC classification number: H05K3/244 , G06K19/07754 , H01L23/5386 , H01L24/65 , H01L25/00 , H01L2924/38 , H01M6/40 , H04B1/3816 , H05K1/097 , H05K1/111 , H05K3/30 , H05K3/40
Abstract: Embodiments of the present invention relate to nano-copper pillar interconnects. Nano-copper material is a mixture of nano-copper particles and one or more organic fluxes. In some embodiments, the one or more organic fluxes include organic solvents that help bind the nano-copper particles together and allow the nano-copper material to be printable. The nano-copper material is applied onto bond pads on a printed circuit board (PCB) via a printing process, a dipping process or the like, to form nano-copper covered PCB bond pads. A component can thereafter be coupled with the PCB at the nano-copper covered PCB bond pads. What is left when the solvents evaporate are nano-copper pillar interconnects that form, coupling the component with the PCB bond pads. The nano-copper pillar interconnects are of pure copper.
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公开(公告)号：US09609738B1
公开(公告)日：2017-03-28
申请号：US14560807
申请日：2014-12-04
Applicant: Flextronics AP, LLC
Inventor： Dennis Willie , Richard Loi , David Geiger , Anwar Mohammed , Murad Kurwa , Hector Rene Marin Hernandez
CPC classification number: H05K1/0201 , H01L23/373 , H05K1/0203 , H05K1/0204 , H05K1/115 , H05K1/181 , H05K3/3494 , H05K7/20209 , H05K7/2039 , H05K2201/0323 , H05K2201/06 , H05K2201/062 , H05K2201/10371 , H05K2203/304
Abstract: A formed graphite sheet is shaped and sized as a protective shield positioned over an electronic component coupled to a PCB. The formed graphite sheet is used to protect a body of the electronic component from heat applied during the assembly of the electronic component to the PCB, such as the heating steps used in SMT and through-hole technology. The formed graphite sheet is shaped to selective direct impinging heat. The heat can be directly away from the entire electronic component. Alternatively, the heat can be selectively directed away from some portions of the electronic component and toward other portions of the electronic component.
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10.发明授权Fast cure conductive epoxy attach methodology for high speed automated processes 有权快速固化导电环氧树脂附着方法用于高速自动化工艺公开(公告)号：US09566764B1
公开(公告)日：2017-02-14
申请号：US14579631
申请日：2014-12-22
Applicant: Flextronics AP, LLC
Inventor： Anwar Mohammed , Weifeng Liu , David Geiger , Dennis Willie , Gervasio Mutarelli , Murad Kurwa
CPC classification number: B32B7/14 , B32B7/12 , B32B9/005 , B32B9/04 , B32B9/045 , B32B27/08 , B32B37/06 , B32B37/1207 , B32B37/18 , B32B2255/26 , B32B2307/202 , B32B2309/02 , B32B2363/00 , B32B2457/00 , B32B2457/08 , F16B11/006 , H05K3/305 , H05K3/321 , H05K3/36
Abstract: Two substrates are mechanically and electrically coupled together using a combination of a fast cure electrically non-conductive epoxy for mechanical attachment and a slow cure electrically conductive epoxy for electrical interconnects. The two epoxies are selectively applied between the two substrates as a stack, and the stack is subjected to a temperature that is sufficient to cure the fast cure electrically non-conductive epoxy in a short period of time but does not damage the substrates or components coupled thereto. In some applications, the temperature is less than 100 degrees Celsius and the time period is less than 5 seconds. The stack is removed from the heat and the slow cure electrically conductive epoxy continues to cure over a longer second period of time, such as a few hours to a day.
Abstract translation: 使用用于机械附接的快速固化非导电环氧树脂和用于电互连的缓慢固化导电环氧树脂的组合将两个基底机械和电耦合在一起。 两个环氧树脂作为叠层选择性地施加在两个基板之间，并且堆叠体经历足够的温度以在短时间段内固化快速固化的非导电环氧树脂，但不会损坏耦合的基板或部件 到此。 在一些应用中，温度低于100摄氏度，时间段小于5秒。 堆叠从热量中除去，慢固化导电环氧树脂在更长的第二时间段内继续固化，例如几小时至一天。
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