公开(公告)号：US20240351863A1

公开(公告)日：2024-10-24

申请号：US18710198

申请日：2022-11-16

申请人： MERIDIAN INNOVATION PTE LTD.

发明人： Wan Chia Ang ,  Piotr KROPELNICKI

IPC分类号： B81B7/00 ,  B81C1/00 ,  G01J5/02 ,  G01J5/22 ,  H01L23/522

CPC分类号： B81B7/008 ,  B81C1/00246 ,  G01J5/0215 ,  G01J5/024 ,  G01J5/22 ,  H01L23/5226 ,  B81C2203/0735

摘要： A CMOS-MEMS integrated device and a method for forming such a device are disclosed. The integrated device includes a double released MEMS infrared sensor. The double released MEMS sensor is a free-standing sensor over a lower sensor cavity which is etched into the substrate of the device. The free-spending MEMS sensor is devoid of a support dielectric membrane which supports the MEMS sensor, resulting in the MEMS sensor being suspended over the lower sensor cavity. The support dielectric is removed by a second release process. The second release process may also remove a protective dielectric layer over the MEMS sensor. The MEMS sensor without the protective dielectric layer enhances sensor sensitivity. In other cases, the free-standing MEMS sensor may include an absorber thereover. The absorber enhances sensor sensitivity.

公开(公告)号：US20240351860A1

公开(公告)日：2024-10-24

申请号：US18631659

申请日：2024-04-10

申请人： Atomic Machines, Inc.

发明人： William A. Boettcher ,  Jeffrey A. Holden ,  Klaus R. Zietlow

IPC分类号： B81B3/00 ,  B81C1/00 ,  H01F7/16

CPC分类号： B81B3/0091 ,  B81C1/00706 ,  H01F7/1615 ,  B81B2201/038 ,  B81B2203/019 ,  B81B2203/053 ,  H01F7/16 ,  H01F2007/1669 ,  H01F2007/1692

摘要： Introduced here is an electromechanical actuator that includes a stator assembly with a chamber partially defined therethrough along a central longitudinal axis and a plunger assembly that is situated in the chamber and, in operation, moves along the central longitudinal axis between different positions. The stator assembly can include a pair of contacts that have an opening therebetween and a trinity of ferromagnetic layers with coils situated therebetween. The plunger assembly can include a magnet. When current is applied to the coils, the trinity of ferromagnetic layers become magnetically polarized, thereby dictating the motion of the plunger assembly by magnetically attracting or repelling the magnet included in the plunger assembly. The plunger assembly may be stabilized by a flexure flexibly connecting the stator assembly and plunger assembly.

公开(公告)号：US20240351859A1

公开(公告)日：2024-10-24

申请号：US18763094

申请日：2024-07-03

申请人： WUHAN NEURACOM TECHNOLOGY DEVELOPMENT CO., LTD.

发明人： Li HUANG ,  Cheng HUANG ,  Zhanfeng MA ,  Yaqin WANG ,  Chunshui WANG ,  Jianfei GAO

IPC分类号： B81B3/00 ,  B81C1/00

CPC分类号： B81B3/0067 ,  B81C1/00349 ,  B81B2203/0392 ,  B81B2207/07

摘要： Disclosed are a connection line structure and a forming method thereof. The connection line structure includes a passivation layer, a metal layer, and a protective layer, the metal layer is arranged on the passivation layer, and the protective layer is arranged on the metal layer. In the present application, a simple single-layer wiring design may be utilized, and a multi-layer three-dimensional wiring design may also be utilized to implement high speed transmission, a MEMS process allows for design of a connection line in a straight or bent layout, a connection line of a bent layout is flexible, and better compatibility is achieved.

公开(公告)号：US20240338062A1

公开(公告)日：2024-10-10

申请号：US18630893

申请日：2024-04-09

申请人： Frore Systems Inc.

发明人： Prabhu Sathyamurthy ,  Shekhar Halakatti ,  Woo Sung Chung ,  Ji Hoon Kim ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy

IPC分类号： G06F1/20 ,  B81B3/00 ,  H05K7/20

CPC分类号： G06F1/20 ,  B81B3/0081 ,  B81B2201/036 ,  B81B2203/0118 ,  B81B2207/11 ,  H05K7/20154 ,  H05K7/20272

摘要： A mini personal computer (PC) is described. The mini PC includes a housing, at least one heat-generating structure coupled with the housing, and a cooling system. The cooling system includes at least one active cooling cell. The heat-generating structure(s) are coupled with the cooling system. The active cooling cell(s) are configured to utilize vibrational motion to drive a fluid for transferring heat from the heat-generating structure(s). The cooling system is coupled with and contained by the housing.

公开(公告)号：US20240337491A1

公开(公告)日：2024-10-10

申请号：US18616295

申请日：2024-03-26

申请人： Robert Bosch GmbH

发明人： Antonios Nikas

IPC分类号： G01C19/5755 ,  B81B7/00 ,  G01P15/097

CPC分类号： G01C19/5755 ,  B81B7/008 ,  G01P15/097 ,  B81B2201/0242

摘要： A resonant sensor system and a method for operating the resonant sensor system. The resonant sensor system includes: a drive circuit configured to generate an analog drive signal to drive an oscillatable seismic element of the MEMS gyroscope; a detection circuit coupled to the drive circuit and the oscillatable seismic element, wherein the detection circuit is configured to detect an analog signal from a motion of the oscillatable seismic element, wherein the analog signal includes an analog rotation-rate signal component and an analog quadrature signal component; and a digital processing arrangement having at least one digital-to-analog converter and a further digital-to-analog converter.

公开(公告)号：US20240336476A1

公开(公告)日：2024-10-10

申请号：US18297949

申请日：2023-04-10

申请人： Saudi Arabian Oil Company ,  King Abdullah University of Science and Technology

发明人： Nadeem Qaiser ,  Maha Nour ,  Vincent Tung

IPC分类号： B81B7/00 ,  H05B3/26 ,  H05B6/44

CPC分类号： B81B7/0096 ,  H05B3/26 ,  H05B6/44 ,  H05B2203/003

摘要： Example methods and devices for improving uniformity of temperature distribution of a microheater or a microheater array are disclosed. One example method includes determining that a temperature of a first coil segment of multiple coil segments of a microheater is lower than a temperature of a second coil segment of the multiple coil segments, where the first coil segment is closer to an edge of the microheater than the second coil segment, and the microheater is a heating component of a microelectromechanical systems (MEMS) based device. A resistance of the first coil segment is increased through a reduction of a width of the first coil segment. After the reduction of the width of the first coil segment, a width of the second coil segment is adjusted based on a difference between the temperature of the first coil segment and the temperature of the second coil segment.

公开(公告)号：US20240336475A1

公开(公告)日：2024-10-10

申请号：US18630881

申请日：2024-04-09

申请人： Frore Systems Inc.

发明人： Prabhu Sathyamurthy ,  Nilesh Sudhir Hasabnis ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy

IPC分类号： B81B3/00 ,  G08B3/10 ,  H04N7/18 ,  H05K7/20

CPC分类号： B81B3/0081 ,  G08B3/1008 ,  H04N7/186 ,  B81B2201/036 ,  B81B2203/0118 ,  B81B2207/11 ,  H05K7/20154 ,  H05K7/20272

摘要： A doorbell system is disclosed. The doorbell system includes a housing, a heat-generating structure, and a cooling system. The housing is configured to be coupled to a structure. The heat-generating structure and cooling system are coupled with the housing. The cooling system includes at least one active cooling cell. The heat-generating structure may be thermally coupled with the cooling system. The active cooling cell(s) are configured to utilize vibrational motion to drive a fluid for transferring heat from the heat-generating structure. The cooling system is coupled with and contained by the housing.

公开(公告)号：US20240327204A1

公开(公告)日：2024-10-03

申请号：US18307017

申请日：2023-04-26

申请人： Merry Electronics(Shenzhen) Co., Ltd.

发明人： Yueh-Kang Lee ,  Hua-Ju Shih ,  Jia Yin Wu

IPC分类号： B81B7/02 ,  H04R19/04

CPC分类号： B81B7/02 ,  H04R19/04 ,  B81B2201/0257 ,  B81B2203/0353 ,  H04R2201/003

摘要： A directional microelectromechanical systems (MEMS) microphone, including a first layer, a second layer, and a third layer stacked in sequence and multiple adhesive members formed between the first layer, the second layer, and the third layer, is provided. The adhesive members include an outer adhesive member disposed surrounding a periphery of the first layer, the second layer, and the third layer and an inner adhesive member disposed within a range surrounded by the outer adhesive member. The outer adhesive member and the inner adhesive member form at least two slits between the first layer, the second layer, and the third layer. An external sound is transmitted to a sound sensing element after passing through two receiving holes of the directional MEMS microphone respectively along two paths. One of the two paths passes through the at least two slits.

公开(公告)号：US20240327199A1

公开(公告)日：2024-10-03

申请号：US18614435

申请日：2024-03-22

申请人： STMicroelectronics International N.V.

发明人： Paola CARULLI ,  Patrick FEDELI ,  Luca Giuseppe FALORNI ,  Federico MORELLI

IPC分类号： H02K33/00 ,  B81B3/00

CPC分类号： B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0242

摘要： Microelectromechanical device comprising a supporting body, containing semiconductor material and a movable mass, constrained to the supporting body with a relative degree of freedom with respect to at least one motion direction, within a range of admissible positions. The device also comprises stopper elements, operable by the movable mass due to movements along the at least one motion direction and configured to apply stop forces to opposite sides of the movable mass, transversely to the at least one motion direction, when the movable mass reaches a respective endpoint of the range of admissible positions, so as to prevent the movable mass from exceeding the respective endpoint.

公开(公告)号：US12101932B2

公开(公告)日：2024-09-24

申请号：US17450729

申请日：2021-10-13

申请人： Micron Technology, Inc.

发明人： Erwin E. Yu ,  Surendranath C. Eruvuru ,  Yoshiaki Fukuzumi ,  Tomoko Ogura Iwasaki

IPC分类号： H10B41/41 ,  B81B7/02 ,  G11C7/10 ,  G11C16/24 ,  H10B41/20 ,  H10B43/20 ,  H10B43/40

CPC分类号： H10B41/41 ,  B81B7/02 ,  G11C7/1012 ,  G11C16/24 ,  H10B41/20 ,  H10B43/20 ,  H10B43/40 ,  B81B2201/07

摘要： A microelectronic device comprises a stack structure, first digit lines, second digit lines, and multiplexer devices. The stack structure comprises an access line region comprising a lower group of conductive structures, and a select gate region overlying the access line region and comprising an upper group of conductive structures. The first digit lines are coupled to strings of memory cells, and the second digit lines are coupled to additional strings of memory cells. The second digit lines are horizontally offset from the first digit lines in a first direction and are substantially horizontally aligned with the first digit lines in a second direction. The multiplexer devices are coupled to page buffer devices, the first digit lines, and the second digit lines. The multiplexer devices comprise transistors in electrical communication with the upper group of conductive structures. Additional microelectronic devices, memory devices, and electronic systems are also described.