METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR LASERS, AND SEMICONDUCTOR LASER

    公开(公告)号:US20230420908A1

    公开(公告)日:2023-12-28

    申请号:US18251890

    申请日:2021-10-14

    Inventor: Sven GERHARD

    CPC classification number: H01S5/0203 H01S5/22 H01S5/1014

    Abstract: A method for producing a plurality of semiconductor lasers is specified, including the steps of: a) providing a substrate having a semiconductor layer sequence and having a plurality of component regions, each component region having at least one resonator region and being delimited perpendicular to the resonator region by singulation lines in the transverse direction and being delimited parallel to the resonator region by singulation lines in the longitudinal direction; b) forming recesses which overlap with the singulation lines in the transverse direction, using a dry-chemical etching method; c) wet-chemical etching of the side faces of the recesses for the purpose of forming resonator surfaces; and d) singulating the substrate along the singulation lines in the transverse direction and in the longitudinal direction. Additionally, a semiconductor laser is specified.

    METHOD FOR PRODUCING AT LEAST ONE LASER CHIP, AND LASER CHIP

    公开(公告)号:US20240372331A1

    公开(公告)日:2024-11-07

    申请号:US18686032

    申请日:2022-08-26

    Abstract: A method for producing at least one laser chip is specified, the method including the steps of growing a semiconductor layer sequence having an active zone on a substrate, removing part of the substrate, part of the active zone and part of the semiconductor layer sequence by dry-chemical etching, thereby forming at least one side edge extending, at least in places, transversely or perpendicularly to the main plane of extent of the substrate, and removing part of the substrate, part of the active zone and part of the semiconductor layer sequence at the side edge by wet-chemical etching, the active zone being designed to emit laser radiation. A laser chip is additionally specified.

    COMPONENT HAVING AN INTEGRATED CONVERTER LAYER AND METHOD FOR PRODUCING A COMPONENT

    公开(公告)号:US20250007237A1

    公开(公告)日:2025-01-02

    申请号:US18708730

    申请日:2022-11-04

    Abstract: The invention relates to a component including a semiconductor body and at least one converter layer, wherein the semiconductor body includes at least one active region having an active zone, the active zone being designed to produce electromagnetic radiation. The semiconductor body has at least one vertical recess. A side wall of the recess is formed by a vertically extending facet of the active region, said facet being a radiation passage surface of the active region. The converter layer covers the recess in a top view or at least partly fills the recess. The invention also relates to a method for producing a component.

    METHOD FOR PRODUCING A PLURALITY OF SEMICONDUCTOR LASERS AND SEMICONDUCTOR LASER

    公开(公告)号:US20240047935A1

    公开(公告)日:2024-02-08

    申请号:US18546148

    申请日:2022-01-27

    CPC classification number: H01S5/0203 H01S5/22 H01S5/10

    Abstract: The invention relates to a method for producing a plurality of semiconductor lasers, including the steps of: a) providing a substrate having a semiconductor layer sequence and having a plurality of component regions, each component region having at least one resonator region and being delimited perpendicular to the resonator region by singulation lines in the transverse direction and being delimited parallel to the resonator region by singulation lines in the longitudinal direction; b) forming recesses which overlap with the singulation lines in the transverse direction, using a dry-chemical etching method, wherein, when the substrate is seen from above, the recesses have in each case at least one transition, at which a first section of a side face of the recess and a second section of the side face of the recess form an angle of more than 180° in the recess; c) wet-chemical etching of the side faces of the recesses for the purpose of forming resonator surfaces; and d) singulating the substrate along the singulation lines in the transverse direction and in the longitudinal direction. Additionally, a semiconductor laser is specified.

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