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    COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING
    1.
    发明公开
    COMPRESSION GAP CONTROL FOR PAD-BASED CHEMICAL BUFF POST CMP CLEANING 审中-公开

    公开(公告)号：US20240316598A1

    公开(公告)日：2024-09-26

    申请号：US18123746

    申请日：2023-03-20

    申请人： Applied Materials, Inc.

    发明人： Clinton P. SAKATA

    IPC分类号： B08B1/00 ,  B08B1/02 ,  B08B13/00 ,  B24B37/20

    CPC分类号： B08B1/10 ,  B08B1/20 ,  B08B13/00 ,  B24B37/20 ,  H01L21/67219

    摘要： Embodiments of the disclosure include an apparatus and method of cleaning a substrate. A method of cleaning a substrate, includes rotating, a substrate table by first motor, delivering a fluid to a surface of a substrate positioned on a supporting surface of the substrate table of a cleaning module, rotating a cleaning pad at a cleaning speed, and sensing an initial torque value generated by a second motor with a controller, lowering the cleaning pad with a lift actuator assembly until the controller senses a contact torque generated by the second motor. The contact torque is when a pad processing surface of the cleaning pad contacts a surface of the substrate at a contact point. The method includes translating the cleaning pad a cleaning distance towards the substrate by a command from the controller. The cleaning pad is compressed by the translation of the cleaning pad the cleaning distance. The pad processing surface of the cleaning pad is then translated across the substrate supporting surface.

    CONDITIONING APPARATUS
    3.
    发明公开
    CONDITIONING APPARATUS 审中-公开

    公开(公告)号：US20240269798A1

    公开(公告)日：2024-08-15

    申请号：US18402471

    申请日：2024-01-02

    申请人： Samsung Electronics Co., Ltd.

    发明人： Hyuntae Lee ,  Domin Kim ,  Sungyong Park ,  Jubong Lee ,  Jaemin Jung ,  Hoseop Choi

    IPC分类号： B24B37/20

    CPC分类号： B24B37/20

    摘要： A conditioning apparatus includes an arm configured to be rotated by an actuator, a gimbaling part disposed at one end of the arm and disposed such that a lower end thereof protrudes outwardly of the arm and an abrasive disc is installed thereon, a frame unit connected to the gimbaling part, a rotation driving unit connected to the gimbaling part and configured to transfer driving force for rotating the abrasive disc, a load applying unit connected to the frame unit and configured to elevate the frame unit, and a universal joint connecting the gimbaling part to the rotation driving unit, wherein the universal joint separates a center of gravity of the rotation driving unit from a center of gravity of the gimbaling part.

    POLISHING PAD WITH ENDPOINT DETECTION WINDOW
    4.
    发明公开
    POLISHING PAD WITH ENDPOINT DETECTION WINDOW 审中-公开

    公开(公告)号：US20240253177A1

    公开(公告)日：2024-08-01

    申请号：US18404519

    申请日：2024-01-04

    申请人： Rohm and Haas Electronic Materials CMP Holdings, Inc.

    发明人： Yu-Chung SU ,  Lee Melbourne COOK ,  Hyunjin KIM

    IPC分类号： B24B37/20

    CPC分类号： B24B37/205

    摘要： A polishing pad for chemical mechanical polishing comprises a polishing layer having a top polishing surface, a sub-pad located opposite from the top polishing surface, the sub-pad comprising a sub-pad material and having a bottom sub-pad surface defining a bottom surface of the polishing pad, and a window for transmitting a signal wave through the polishing pad to a substrate to be polished and back through the polishing pad for endpoint detection, the window having a top window surface, a bottom window surface, and side edges, wherein the top window surface is recessed from the top polishing surface, the bottom window surface is substantially coplanar with the bottom sub-pad surface, and the side edges are in contact with the polishing material and the sub-pad material.

    POLISHING HEAD, AND POLISHING TREATMENT DEVICE
    5.
    发明公开
    POLISHING HEAD, AND POLISHING TREATMENT DEVICE 审中-公开

    公开(公告)号：US20240082983A1

    公开(公告)日：2024-03-14

    申请号：US18550884

    申请日：2022-03-14

    申请人： MICRO ENGINEERING, INC.

    发明人： Akio KOMURA ,  Takafumi KUWANO ,  Hajime TOMIZAWA

    IPC分类号： B24B37/20 ,  B24B37/32

    CPC分类号： B24B37/20 ,  B24B37/32

    摘要： A polishing head includes a head housing having a first flange part that extends outward from an upper position of a circumferential surface of a cylindrical body and a second flange part that extends outward from a lower position of the circumferential surface, a membrane support ring that is sized to surround an outer circumference of the second flange part and has a third flange part that is formed at an upper end part thereof and located between the first flange part and the second flange part, a membrane that covers a lower end-side opening part of the membrane support ring and holds the wafer with a backing film pasted to a front surface thereof interposed therebetween, a retainer ring formed in a shape to surround an outer circumference of the substrate, and driving means that integrally horizontally rotates the head housing, the membrane support ring, and the retainer ring.

    Substrate processing apparatus
    7.
    发明授权
    Substrate processing apparatus 有权

    公开(公告)号：US11883922B2

    公开(公告)日：2024-01-30

    申请号：US16201546

    申请日：2018-11-27

    申请人： EBARA CORPORATION

    发明人： Yuki Watanabe ,  Keita Yagi

    IPC分类号： B24B37/005 ,  B24B37/32 ,  B24B37/013 ,  B24B37/20

    CPC分类号： B24B37/005 ,  B24B37/013 ,  B24B37/205 ,  B24B37/32

    摘要： A substrate processing apparatus includes a polishing head defining plural pressure chambers D1 to D5 for pressing a wafer W on a polishing pad 42, a pressure control unit performing pressure feedback control by individually controlling pressures in the pressure chambers D1 to D5, a film thickness measurement unit measuring a film thickness distribution of the wafer W being polished, a storage unit storing multiple pieces of information on a preset pressure of the pressure chambers D1 to D5, and a response characteristic acquisition unit changing the preset pressure every time a predetermined condition is satisfied during polishing of the wafer W, measuring a polishing rate applied to the wafer W, and acquiring a response characteristic of the polishing of the wafer W. The response characteristic indicates responsiveness of the polishing of the wafer W to the pressure feedback. The response characteristic is acquired based on the obtained polishing rates.

    POLISHING PAD CONDITIONING SYSTEM AND METHOD OF USING
    8.
    发明公开
    POLISHING PAD CONDITIONING SYSTEM AND METHOD OF USING 审中-公开

    公开(公告)号：US20240009801A1

    公开(公告)日：2024-01-11

    申请号：US18358804

    申请日：2023-07-25

    申请人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. ,  TSMC NANJING COMPANY, LIMITED

    发明人： Wen Yen KUNG

    IPC分类号： B24B53/017 ,  B24B37/20 ,  B24B53/013

    CPC分类号： B24B53/017 ,  B24B37/20 ,  B24B53/013

    摘要： A method of conditioning a polishing pad includes conditioning the polishing pad using a conditioner. The method includes detecting a roughness of the polishing pad following the conditioning. The method further includes tracking a number of iterations of the conditioning of the polishing pad. The method further includes outputting a signal for replacing the polishing pad in response to the number of iterations reaching an iteration limit. The method further includes repeating the conditioning in response to the detected roughness of the polishing pad being outside of a threshold roughness range and the number of iterations failing to reach the iteration limit.