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    Control of adhesive domains
    6.
    发明授权
    Control of adhesive domains 有权

    公开(公告)号：US11198800B2

    公开(公告)日：2021-12-14

    申请号：US16318430

    申请日：2017-07-19

    Applicant: LTS LOHMANN Therapie-Systeme AG ,  DOW SILICONES CORPORATION

    Inventor： Marco Emgenbroich

    IPC: C09J7/38 ,  A61K9/70 ,  C08G77/06 ,  C08G77/20 ,  C08G77/382 ,  C08G77/442 ,  C09J11/06 ,  C09J183/04 ,  C09J183/10

    Abstract: A method of inverting the phase arrangement of the silicone phase and the acrylic phase in a silicone acrylic hybrid composition, the silicone acrylic hybrid composition comprising: a) a silicone acrylic hybrid pressure sensitive adhesive, and b) a solvent, wherein the phase arrangement of the silicone phase and the acrylic phase in the initial silicone acrylic hybrid composition forming a continuous external phase and a discontinuous internal phase is determined by the solvent, comprising the step of adding an activator to the silicone acrylic hybrid composition, wherein the activator a) is liquid at 20° C. and 1013 mbar, b) has a boiling point which is higher than the boiling point of the solvent and/or has a vapor pressure at 20° C. which is lower than the vapor pressure of the solvent contained in the silicone acrylic hybrid composition, and c) provides better dissolution properties for the inner phase of the initial silicone acrylic hybrid composition than the solvent contained in the silicone acrylic hybrid composition.

    TACKIFIED AND FILLED SILICONE ADHESIVE COMPOSITIONS
    7.
    发明申请
    TACKIFIED AND FILLED SILICONE ADHESIVE COMPOSITIONS 有权

    公开(公告)号：US20210238463A1

    公开(公告)日：2021-08-05

    申请号：US17270107

    申请日：2019-08-21

    Applicant: 3M INNOVATIVE PROPERTIES COMPANY

    Inventor： Payam Khodaparast ,  Michael B. Runge ,  Kent C. Hackbarth ,  Sonja S. Mackey ,  David J. Kinning

    IPC: C09J183/04 ,  C09J7/35 ,  C09J7/38 ,  C09J183/10 ,  C09J177/06 ,  C09J175/02

    Abstract: The present disclosure generally relates to adhesive compositions and articles including at least one of polydiorganosiloxane polyoxamide copolymer, silicone polyurea block copolymer, and/or an addition cure silicone, a silicate tackifying resin, and inorganic particle filler. The filler is typically fumed silica. Some embodiments of the adhesive composition include at least one of a polydiorganosiloxane polyoxamide copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in between about 0.1 wt % and about 20 wt %; a silicone polyurea block copolymer, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %; and an addition cure silicone, a silicate tackifying resin in an amount of between about 10 wt % and about 70 wt %, and inorganic particle filler in an amount between about 0.1 wt % and about 20 wt %.

    WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER
    10.
    发明申请
    WAFER PROCESSING LAMINATE AND METHOD FOR PROCESSING WAFER 审中-公开

    公开(公告)号：US20190027391A1

    公开(公告)日：2019-01-24

    申请号：US16138010

    申请日：2018-09-21

    Applicant: SHIN-ETSU CHEMICAL CO., LTD.

    Inventor： Shohei TAGAMI ,  Michihiro SUGO ,  Hideto KATO

    IPC: H01L21/683 ,  H01L21/304 ,  C09J183/04 ,  C09J183/10 ,  C09J183/14 ,  C08G77/04 ,  C08G77/455 ,  C08G77/52

    Abstract: A wafer processing laminate comprising a support, a temporary adhesive material layer laminated on the support, and a wafer stacked on the temporary adhesive material layer, the wafer having a front surface on which a circuit is formed and a back surface to be processed, the temporary adhesive material layer comprising a first temporary adhesive layer composed of a thermoplastic resin layer (A) laminated on the front surface of the wafer and a second temporary adhesive layer composed of a thermosetting resin layer (B) laminated on the first temporary adhesive layer, the thermoplastic resin layer (A) being soluble in a cleaning liquid (D) after processing the wafer, the thermosetting resin layer (B) being insoluble in the cleaning liquid (D) after heat curing and capable of absorbing the cleaning liquid (D) such that the cleaning liquid (D) permeates into the layer (B). This wafer processing laminate allows a wide selection of materials, facilitates separation and collection of a processed wafer, meets requirements on various processes, and can increase productivity of thin wafers.

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