摘要:
The present disclosure is directed to non-corrosive cleaning compositions that are useful primarily for removing residues (e.g., plasma etch and/or plasma ashing residues) and/or metal oxides from a semiconductor substrate as an intermediate step in a multistep manufacturing process.
摘要:
A solvent composition comprising 1,1,1,2,2,3,3,4,4,5,5,6,6-tridecafluorohexane (R52-13), trans-1,2-dichloroethylene (tDCE) and a C1-3 alcohol, wherein the content of R52-13 is from 25.0 to 75.0% (by mass, and the same applies hereinafter), the content of tDCE is from 15.0 to 74.9% and the content of the C1-3 alcohol is from 0.1 to 10.0%, to the total amount of R52-13, tDCE and the C1-3 alcohol. This solvent composition can remove oils and greases and flux with a high cleaning performance.
摘要翻译:包含1,1,1,2,2,3,3,4,4,5,5,6,6-十三氟己烷(R52-13),反式-1,2-二氯乙烯(tDCE)和C 1-3%醇,其中R52-13的含量为25.0〜75.0%(以质量计,以下相同),tDCE的含量为15.0〜74.9%,含量为 C 1-3醇为0.1至10.0%,相对于R 52-13,t DCE和C 1-3-3醇的总量。 该溶剂组合物可以以高清洁性能去除油和润滑脂和助熔剂。
摘要:
Compositions of the invention include: (a) a solvent having a hydrophilic-lipophilic balance (HLB) value of 5 to 7; and (b) a solubilizing agent having the formula: where R is aryl, cycloaryl, heteroaryl or hetercyclyl; R1 is a bond, (C1-C7)alkyl, substituted (C1-C7)alkyl, (C1-C7)alkoxy, substituted (C1-C7)alkoxy, (C2-C7)alkenyl or substituted (C2-C7)alkenyl; and Z+ is hydrogen, Na, K, NR′4 where R′ is defined herein. Further compositions include: (a) a solvent having a (HLB) value of 5 to 7; and (b) a solubilizing agent having the formula: where R2 is a bond, (C1-C7)alkyl, substituted (C1-C7)alkyl, (C1-C7)alkoxy, substituted (C1-C7)alkoxy, (C2-C7)alkenyl or substituted (C2-C7)alkenyl; and Z+ is hydrogen, Na, K, NR′4 where R′ is defined herein. The compositions are useful in providing stable single phase aqueous solutions when combined with water.
摘要:
A method of cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware without corroding or damaging the equipment parts and surfaces in the event of wafer breakage and non-wafer breakage is described. A solution includes an alkyldione peroxide, a stabilizing agent, and alcohols is used to oxidize the metal and form soluble complexes which are removed by the cleaning solution. Also, a alkyldione peroxide solution for cleaning elemental copper, cobalt, or nickel from the surface of equipment hardware in the event of wafer breakage and non-wafer breakage is provided.
摘要:
The invention concerns amphiphilic compounds of general formula (I), in which R.sup.1 and R.sup.3 each represent a C.sub.1 -C.sub.22 hydrocarbon residue, R.sup.2 is a spacer and X and Y are functional groups. The proposed compounds have at least two hydrophilic and at least two hydrophobic groups based on dicarboxylic acid diamides. The amphiphilic compounds according to the invention are mostly surface-active and are especially suitable for use as emulsifiers, demulsifies, detergents, dispergents and hydrotropic agents in industry and households, for example, in the treatment of metals, ore processing, surface finishing, washing, cleaning, cosmetics, medicine and food processing and preparation.
摘要:
Compositions used to remove traces of water and/or organic solvents and/or oils from the component surfaces, comprising:i) hydrofluoropolyethers having the general formula:HF.sub.2 CO (CF.sub.2 O).sub.n (CF.sub.2 CF.sub.2 O).sub.m CF.sub.2 Hii) fluorinated additive having a structure selected from the following:T--OR.sub.f (CFY)--L (I)L--CF.sub.2 OR.sub.f CF.sub.2 --L (II)with L.dbd.X--CH.sub.2 CH.sub.2 (OCH.sub.2 CH.sub.2).sub.n.spsb.o Bwherein X.dbd.CH.sub.2 O, CH.sub.2 NR", CONR", CH.sub.2 OCH.sub.2 CH.sub.2 NR", CH.sub.2 OCOCH.sub.2 O;n.sup.o =0-50; B.dbd.NHC(CH.sub.2 OH).sub.3, CH.sub.2 O(CH.sub.2 OH).sub.3 ;with R".dbd.H, alkyl C.sub.1-3 ; Y.dbd.CF.sub.3 or F; T is selected from --CF.sub.3, --C.sub.2 F.sub.5, --C.sub.3 F.sub.7, ClCF.sub.2 CF(CF.sub.3)--, CF.sub.3 CFClCF.sub.2 --, ClCF.sub.2 CF.sub.2 --, ClCF.sub.2 --; R.sub.f is a (per)fluoroalkane and/or (per)fluoro-polyether chain.
摘要:
The invention provides azeotrope-like compositions consisting essentially of R.sub.f OC.sub.2 H.sub.5, where R.sub.f is a branched or straight chain perfluoroalkyl group having 4 carbon atoms, and an organic solvent selected from the group consisting of: straight chain, branched chain and cyclic alkanes having 6 to 8 carbon atoms; esters having 4 carbon atoms; ketones having 4 carbon atoms; disiloxanes having 6 carbon atoms; cyclic and acyclic ethers having 4 to 6 carbon atoms; chlorinated alkanes having 3 to 4 carbon atoms and chlorinated alkenes having 2 carbon atoms. The compositions are useful for cleaning, as solvents or carriers for coating and as heat transfer materials.
摘要:
A non-flammable water-repellent/oil repellent composition containing a fluorine containing-polymer and a solvent containing at least 40% by weight of a non-flammable perfluoro organic compound.
摘要:
An alkaline degreasing solution containing 0.01 to 3 g/l of alkali silicate calculated as Si concentration, and 0.01 to 10 g/l of a nonionic surfactant having an HLB value (=20.times.Mw/M, where Mw represents the weight of a hydrophilic group part and M represents the molecular weight of the surfactant) of 5 to 11 and a structure being expressed in the following general formula (I), with a pH value of at least 9.5:R--O--(EO).sub.m (AO).sub.n H (I)where R represents alkyl group, EO represents ethylene oxide group, AO represents alkylene oxide group (propylene oxide group and/or butylene oxide group), m represents an addition molar number of EO which is an integer of 3 to 7, n represents an addition molar number of AO which is an integer of 1 to 6, and m and n satisfy the relation of n
摘要:
A cleaning agent for removing a residue of soldering flux, which essentially consists of mono-, di-, or tri-alkylene glycol mono branched C.sub.3 -C.sub.5 alkyl ether, which can remove with high safety both ionic residues and resinous materials contained in a soldering flux, which remain on the surface of a soldered electronic substrate. The cleaning agent of the present invention does not adversely affect the insulation and materials used in an electronic device.