公开(公告)号：US20240234001A1

公开(公告)日：2024-07-11

申请号：US18558667

申请日：2022-05-03

申请人： EnaChip inc.

发明人： Trifon Liakopoulos ,  Amrit Panda

IPC分类号： H01F17/00 ,  H01F10/14 ,  H01F41/26 ,  H01F41/34

CPC分类号： H01F17/0006 ,  H01F10/14 ,  H01F41/26 ,  H01F41/34 ,  H01F2017/0066

摘要： A micromagnetic device and method of forming the same. In one embodiment, the micromagnetic device includes a seed layer formed over a substrate, and a patterned insulating layer and a patterned protective layer formed over the seed layer providing a first exposed section of the seed layer. The micromagnetic device also includes a first electroplated layer segment electroplated over the first exposed section of the seed layer and laterally over sections of the patterned insulating layer and the patterned protective layer.

公开(公告)号：US20230085159A1

公开(公告)日：2023-03-16

申请号：US17945756

申请日：2022-09-15

申请人： Weinberg Medical Physics Inc

发明人： Irving N. WEINBERG ,  Sahar JAFARI CHAMKAVI ,  Lamar Odell MAIR ,  Oleg UDALOV

IPC分类号： H01F41/26 ,  C25D1/00

摘要： An apparatus and method of fabricating magnetic structures utilizing nanocomposites to build bulk magnetic materials, with controlled magnetic alignments are provided. The method includes application of an editing tool, such as a laser, for patterning an editable structure that mounted on an electrically conductive substrate and filling the pattern with solid materials to create the magnetic structures.

公开(公告)号：US20200381151A1

公开(公告)日：2020-12-03

申请号：US16999042

申请日：2020-08-20

申请人： Shenzhen Sunlord Electronics Co., Ltd.

发明人： Shengcheng XIA ,  Gengxin XIAO ,  Xinshu YU

IPC分类号： H01F1/153 ,  H01F17/04 ,  H01F41/26 ,  H01F41/22 ,  H01F41/02

摘要： An integrally-molded inductor comprises a coil having an insulation coating layer and a magnetic material integrally molded with the coil by compression molding, with electrodes, which are exposed outside the magnetic material, formed at two ends of the coil, wherein the insulation coating layer of the coil comprises a non-conductive inorganic particle component and a resin component which are uniformly mixed, the inorganic particle component and the resin component being in a ratio by weight percentage of 70%:30% to 90%:10%. According to the integrally-molded inductor and a method for manufacturing same, the pressure resistance of the integrally-molded inductor is improved, and the electrical properties and reliability of the inductor product are improved.

公开(公告)号：US20200005997A1

公开(公告)日：2020-01-02

申请号：US16020897

申请日：2018-06-27

申请人： Lawrence Livermore National Security, LLC

发明人： Scott K. Mccall ,  Sarah Baker ,  Joshua Kuntz ,  Jonathan R. I. Lee ,  Christine A. Orme ,  Marcus A. Worsley ,  Alexander A. Baker ,  Matthew A. Worthington

IPC分类号： H01F41/26 ,  C25D13/12 ,  C25D13/02 ,  H01F7/02

摘要： In one embodiment, a magnet includes a plurality of layers, each layer having a microstructure of sintered particles. The particles in at least one of the layers are characterized as having preferentially aligned magnetic orientations in a first direction.

公开(公告)号：US20180096764A1

公开(公告)日：2018-04-05

申请号：US15283350

申请日：2016-10-01

申请人： Intel Corporation

发明人： Donald S. GARDNER ,  Gerhard SCHROM ,  Edward A. BURTON

IPC分类号： H01F1/147 ,  H01F27/255 ,  H01F10/06 ,  H01F27/28 ,  H01F41/04 ,  H01F41/16 ,  H01F41/26 ,  H01F41/32 ,  H05K3/00 ,  H01L23/64 ,  H01L49/02 ,  H01L25/18

CPC分类号： H01F1/14733 ,  H01F10/06 ,  H01F17/0006 ,  H01F27/255 ,  H01F27/2804 ,  H01F27/365 ,  H01F41/041 ,  H01F41/046 ,  H01F41/16 ,  H01F41/18 ,  H01F41/26 ,  H01F41/32 ,  H01F2017/0066 ,  H01L23/552 ,  H01L23/645 ,  H01L25/18 ,  H01L28/10 ,  H05K1/165 ,  H05K3/0085 ,  H05K2201/086 ,  H05K2201/09236

摘要： Embodiments are generally directed to hybrid magnetic material structures for electronic devices and circuits. An embodiment of an inductor includes a first layer of magnetic film material applied on a substrate, one or more conductors placed on the first layer of magnetic film material, and a second layer of magnetic particles, wherein the magnetic particles are suspended in an insulating medium.

公开(公告)号：US09865673B2

公开(公告)日：2018-01-09

申请号：US14666624

申请日：2015-03-24

申请人： International Business Machines Corporation

发明人： Hariklia Deligianni ,  William J. Gallagher ,  Andrew J. Kellock ,  Eugene J. O'Sullivan ,  Lubomyr T. Romankiw ,  Naigang Wang

IPC分类号： H01F27/00 ,  H01L49/02 ,  H01L21/288 ,  H01F5/00 ,  H01F1/04 ,  H01F27/24 ,  H01F27/28 ,  H01F41/04 ,  C23C18/16 ,  H01L23/522 ,  H01F41/26

CPC分类号： H01L28/10 ,  C23C18/16 ,  C23C18/1605 ,  C23C18/165 ,  C23C18/1651 ,  C23C18/1673 ,  C23C18/168 ,  C23C18/1694 ,  C23C18/1696 ,  C23C18/1831 ,  C23C18/50 ,  H01F1/04 ,  H01F5/00 ,  H01F27/00 ,  H01F27/24 ,  H01F27/28 ,  H01F41/046 ,  H01F41/26 ,  H01L21/288 ,  H01L21/2885 ,  H01L23/5227

摘要： An on-chip magnetic structure includes a magnetic material comprising cobalt in a range from about 80 to about 90 atomic % (at. %) based on the total number of atoms of the magnetic material, tungsten in a range from about 4 to about 9 at. % based on the total number of atoms of the magnetic material, phosphorous in a range from about 7 to about 15 at. % based on the total number of atoms of the magnetic material, and palladium substantially dispersed throughout the magnetic material.

公开(公告)号：US20170330657A1

公开(公告)日：2017-11-16

申请号：US15664647

申请日：2017-07-31

申请人： University of Florida Research Foundation, Incorporated

发明人： David P. Arnold ,  Jennifer S. Andrew

IPC分类号： H01F1/057 ,  B22F3/02 ,  H01F41/26 ,  H01F41/00 ,  H01F10/00 ,  H01F1/147 ,  H01F1/055 ,  H01F1/047 ,  H01L21/288 ,  C25D7/00 ,  C23C18/31 ,  C23C18/16 ,  B22F3/26 ,  H01L49/02 ,  H01F1/00

CPC分类号： H01F1/0576 ,  B22F3/02 ,  B22F3/26 ,  B22F2998/10 ,  C22C1/1036 ,  C22C32/00 ,  C22C33/02 ,  C22C2202/02 ,  C23C18/1637 ,  C23C18/1644 ,  C23C18/1648 ,  C23C18/31 ,  C23C18/50 ,  C25D5/00 ,  C25D7/00 ,  C25D7/001 ,  H01F1/0054 ,  H01F1/047 ,  H01F1/0556 ,  H01F1/14733 ,  H01F10/007 ,  H01F41/005 ,  H01F41/26 ,  H01L21/2885 ,  H01L28/10

摘要： Nanocomposite magnetic materials, methods of manufacturing nanocomposite magnetic materials, and magnetic devices and systems using these nanocomposite magnetic materials are described. A nanocomposite magnetic material can be formed using an electro-infiltration process where nanomaterials (synthesized with tailored size, shape, magnetic properties, and surface chemistries) are infiltrated by electroplated magnetic metals after consolidating the nanomaterials into porous microstructures on planar substrates. The nanomaterials may be considered the inclusion phase, and the magnetic metals may be considered the matrix phase of the multi-phase nanocomposite.

公开(公告)号：US6063512A

公开(公告)日：2000-05-16

申请号：US006484

申请日：1998-01-13

申请人： Tetsuya Osaka ,  Madoka Takai ,  Hiroaki Tachibana

发明人： Tetsuya Osaka ,  Madoka Takai ,  Hiroaki Tachibana

IPC分类号： C23C14/14 ,  C22C38/00 ,  C25D3/56 ,  G11B5/00 ,  G11B5/31 ,  G11B5/39 ,  G11B5/667 ,  H01F10/16 ,  H01F41/26 ,  G11B5/66

CPC分类号： G11B5/3967 ,  G11B5/00 ,  G11B5/3109 ,  G11B5/3113 ,  H01F10/16 ,  H01F41/26 ,  G11B2005/0005 ,  H01F10/265 ,  Y10S428/90 ,  Y10T428/115

摘要： A soft magnetic thin film for magnetic head has high saturation magnetization and at the same time high resistivity. There are provided a method of manufacturing the soft magnetic thin film and a magnetic head and a magnetic storage unit which use the soft magnetic thin film. At least one of lower and upper soft magnetic layers of magnetic head which define a magnetic circuit is formed of a soft magnetic thin film having as a main constituent a Co--Ni--Fe alloy consisting of 30 to 90 at % Co, less than 40 at % Ni and less than 40 at % Fe and containing at least S by 0.5 to 4 at %. The soft magnetic thin film is formed from a Co--Ni--Fe alloy plating solution containing metal salts of Co, Ni and Fe and additionally containing a sulfur system organic compound through electrodeposition process.

摘要翻译： 用于磁头的软磁薄膜具有高饱和磁化强度，同时具有高电阻率。 提供了制造软磁性薄膜的方法以及使用该软磁性薄膜的磁头和磁性存储单元。 限定磁路的磁头的下软磁层和上磁软层中的至少一个由作为主要成分的Co-Ni-Fe合金的软磁性薄膜形成，Co-Ni-Fe合金由30〜90at％的Co，小于40 ％Ni和小于40原子％Fe，并且至少含有0.5至4原子％的S。 软磁性薄膜由含有Co，Ni和Fe的金属盐的Co-Ni-Fe合金电镀溶液形成，并通过电沉积工艺另外含有硫系有机化合物。

公开(公告)号：US5612146A

公开(公告)日：1997-03-18

申请号：US611017

申请日：1996-03-05

申请人： Nobuyuki Komura ,  Yuuji Omata

发明人： Nobuyuki Komura ,  Yuuji Omata

IPC分类号： G11B5/31 ,  H01F10/12 ,  H01F10/32 ,  H01F41/26 ,  G11B5/66

CPC分类号： B82Y25/00 ,  G11B5/31 ,  G11B5/3113 ,  G11B5/3163 ,  H01F10/324 ,  H01F41/26 ,  Y10S428/90 ,  Y10T428/1129 ,  Y10T428/12806 ,  Y10T428/12826 ,  Y10T428/12847 ,  Y10T428/12854 ,  Y10T428/12931

摘要： A soft-magnetic multilayer thin film produced by electroplating, wherein an anode-dissolution process is effected by intermittently applying a reverse d.c. bias current with respect to the plating-forward current. Involving the anode-dissolution process allows the formation of a re-dissolution effect layer differing in crystal structure from the plated film layer. A soft-magnetic multilayer thin film characterized by having a multilayer film structure which comprises a plated layer and a re-dissolution effect layer laminated to each other and which the plated layer is at least magnetically isolated. Further, a method of manufacturing a soft-magnetic multilayer thin film having a multilayer film structure magnetically isolated only through plating, which is offered by introducing the anode-dissolution process. In a thin-film magnetic head produced by using a soft-magnetic multilayer thin film, the soft-magnetic multilayer thin film serves as at least one of an upper magnetic core layer and a lower magnetic core layer.

摘要翻译： 通过电镀制造的软磁性多层薄膜，其中阳极溶解过程通过间歇地施加反向直流电来实现。 相对于电镀正向电流的偏置电流。 涉及阳极溶解过程允许形成晶体结构与镀膜层不同的再溶解效应层。 一种软磁性多层薄膜，其特征在于具有多层膜结构，该多层膜结构包括彼此层压的镀层和再溶解效应层，并且镀层至少是磁性分离的。 此外，通过引入阳极溶解工艺提供了一种制造具有通过电镀磁隔离的多层膜结构的软磁性多层薄膜的方法。 在通过使用软磁性多层薄膜制造的薄膜磁头中，软磁性多层薄膜用作上磁芯层和下磁芯层中的至少一个。

公开(公告)号：US5435903A

公开(公告)日：1995-07-25

申请号：US974668

申请日：1992-11-12

申请人： Masaharu Oda ,  Hidehiko Ohashi ,  Kensuke Kamada

发明人： Masaharu Oda ,  Hidehiko Ohashi ,  Kensuke Kamada

IPC分类号： C25D3/56 ,  H01F10/13 ,  H01F41/26 ,  H05K3/24 ,  H05K9/00 ,  C25D1/04

CPC分类号： H05K9/0084 ,  C25D3/562 ,  H01F10/132 ,  H01F10/265 ,  H01F41/26 ,  H05K3/24 ,  H05K3/244 ,  H05K9/0088 ,  H05K2201/0281 ,  H05K2201/0323

摘要： A thin amorphous alloy of cobalt, iron and phosphorus having good workability and the ability to be used as a soft magnetic material is formed by electrolytic deposition. The electrolytic bath has a pH of 1.0 to 2.2 and contains at least a divalent cobalt ion, a divalent iron ion, and phosphorous acid and/or a phosphite. The amorphous alloy contains at least 69 atomic percent cobalt, 2 to 30 atomic percent phosphorus and the iron/(cobalt+iron) atomic ratio is from 0.001 to 0.1. The alloy may be deposited on a working electrode having a chrome-plated surface with a center line average roughness of less than 1 .mu.m and may be peeled from the electrode to obtain a tape-shaped or foil-shaped product.

摘要翻译： 通过电解沉积形成具有良好可加工性和用作软磁性材料的能力的钴，铁和磷的薄无定形合金。 电解液的pH值为1.0〜2.2，至少含有二价钴离子，二价铁离子，亚磷酸和/或亚磷酸盐。 非晶合金含有至少69原子％的钴，2〜30原子％的磷，铁（钴+铁）原子比为0.001〜0.1。 该合金可以沉积在具有中心线平均粗糙度小于1μm的镀铬表面的工作电极上，并且可以从电极剥离以获得带状或箔状产品。