公开(公告)号：US20240363379A1

公开(公告)日：2024-10-31

申请号：US18768356

申请日：2024-07-10

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Tzu-Chin Huang

IPC分类号： H01L21/673 ,  H01L21/677 ,  H01L21/68

CPC分类号： H01L21/67386 ,  H01L21/67775 ,  H01L21/681 ,  G05B2219/39024 ,  G05B2219/39527

摘要： A calibration pod for calibrating a robotic wafer pod handling apparatus includes a pod body configured for handling by the robotic pod handling apparatus, at least one laser disposed on a bottom of the pod body, and a power module disposed on or in the pod body and operatively connected to power the at least one laser. In a manufacturing method, the pod body comprises a wafer carrier for carrying a cassette of semiconductor wafers, which has a bottom with a plurality of holes for aligning placement of the wafer carrier in a load port of a semiconductor device fabrication facility. The at least one laser here includes a plurality of lasers corresponding to the plurality of holes in the bottom of the wafer carrier, and each laser is mounted in a respective hole of the bottom of the wafer carrier.

公开(公告)号：US12131935B2

公开(公告)日：2024-10-29

申请号：US17380180

申请日：2021-07-20

申请人： HON. PRECISION, INC.

发明人： Yuan-Long Chang ,  Ting Wei Chou

IPC分类号： H01L21/68 ,  G01R31/28 ,  H01L21/67

CPC分类号： H01L21/681 ,  G01R31/2891 ,  G01R31/2893 ,  H01L21/67271

摘要： The present invention reveals an alignment platform for aligning electronic component precisely to the operation position during testing or hot pressing processes. The alignment platform makes a rotor to rotate by a driving apparatus. The rotor has an eccentric axle to where a connecting member is disposed. The connecting member is moved by the eccentric axle, driving an active plate to move. The eccentric axle, the driving apparatus, the connecting member, and the active plate are configured to move under control in a micro or nano meter scale. Thus, precisely alignment of electronic component can be achieved. Floating mechanism of electronic component transmission apparatus or electronic component handler may be dismissed for lowering cost and prolonging lifetime.

公开(公告)号：US12131922B1

公开(公告)日：2024-10-29

申请号：US17089585

申请日：2020-11-04

申请人： Apple Inc.

发明人： Andreas Bibl ,  John A. Higginson ,  Patrick J. Czarnota ,  Paul A. Parks ,  Nile A. Light

IPC分类号： H01L21/68 ,  B65G47/90 ,  H01L21/67 ,  H01L21/683 ,  B25J7/00 ,  B25J9/00 ,  B25J15/00

CPC分类号： H01L21/67144 ,  B65G47/90 ,  H01L21/68 ,  H01L21/681 ,  H01L21/6831 ,  B25J7/00 ,  B25J9/0015 ,  B25J15/0085

摘要： A micro device transfer tool and methods of operation in which the micro device transfer tool includes an articulating transfer head assembly capable of six degrees of motion. A miniatured camera assembly may be secured near the point of contact for the articulating transfer head assembly to aid in system alignment. In an embodiment, an encoder system is included for alignment of a micro pick up array and target substrate using complementary concentric grating patterns. In an embodiment a miniaturized position sensor design is included for sensing position of various system components during alignment or pick and place processes.

公开(公告)号：US12125849B2

公开(公告)日：2024-10-22

申请号：US18142064

申请日：2023-05-02

申请人： Semiconductor Energy Laboratory Co., Ltd.

发明人： Shunpei Yamazaki ,  Hajime Kimura

IPC分类号： H01L23/522 ,  H01L21/48 ,  H01L21/56 ,  H01L21/66 ,  H01L21/68 ,  H01L21/768 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L23/528 ,  H01L23/532 ,  H01L25/065 ,  H01L27/088 ,  H10B41/27 ,  H10B43/27

CPC分类号： H01L27/088 ,  H01L21/76846 ,  H10B41/27 ,  H10B43/27

摘要： A semiconductor device with large memory capacity is provided. A semiconductor device includes first to fourth insulators, a first conductor, a second conductor, and a first semiconductor, and the first semiconductor includes a first surface and a second surface. A first side surface of the first conductor is included on the first surface of the first semiconductor, and a first side surface of the first insulator is included on a second side surface of the first conductor. The second insulator is included in a region including a second side surface and a top surface of the first insulator, a top surface of the first conductor, and the second surface of the first semiconductor. The third insulator is included on a formation surface of the second insulator, and the fourth insulator is included on a formation surface of the third insulator. The second conductor is included in a region overlapping the second surface of the first semiconductor in a region where the fourth insulator is formed. The third insulator has a function of accumulating charge. A tunnel current is induced between the second surface of the first semiconductor and the third insulator with the second insulator therebetween by supply of a potential to the second conductor.

公开(公告)号：US20240347470A1

公开(公告)日：2024-10-17

申请号：US18465982

申请日：2023-09-13

申请人： SK hynix Inc.

发明人： Byung Ho LEE

IPC分类号： H01L23/544 ,  H01L21/68

CPC分类号： H01L23/544 ,  H01L21/682 ,  H01L2223/54426

摘要： A bonding structure may include a first wafer, a second wafer, at least one first alignment key and a second alignment key. The first wafer may include first bonding pads. The second wafer may include second bonding wafers bonded to the first bonding pads. The first alignment key may be provided to the first wafer. The first alignment key may have a temporary magnetism by an induced current. The second alignment key may be provided to the second wafer. The second alignment key may correspond to the first alignment key.

公开(公告)号：US12115683B2

公开(公告)日：2024-10-15

申请号：US18355355

申请日：2023-07-19

申请人： Applied Materials, Inc.

发明人： Nicholas Michael Bergantz ,  Damon K. Cox ,  Alexander Berger

IPC分类号： B25J9/16 ,  B65G47/90 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/687 ,  B25J11/00 ,  B25J13/08

CPC分类号： B25J9/1692 ,  B65G47/905 ,  H01L21/67167 ,  H01L21/67196 ,  H01L21/67259 ,  H01L21/67706 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/68 ,  H01L21/68707 ,  B25J9/1697 ,  B25J11/0095 ,  B25J13/08

摘要： A first robot arm places a calibration object into a load lock that separates a factory interface from a transfer chamber using a first taught position. A second robot arm retrieves the calibration object from the load lock using a second taught position. A controller determines, using a sensor, a first offset amount between a calibration object center of the calibration object and a pocket center of the second robot arm. The controller determines a characteristic error value that represents a misalignment between the first taught position of the first robot arm and the second taught position of the second robot arm based on the first offset amount. The first robot arm or the second robot arm uses the first characteristic error value to compensate for the misalignment for objects transferred between the first robot arm and the second robot arm via the load lock.

公开(公告)号：US12112962B2

公开(公告)日：2024-10-08

申请号：US17599535

申请日：2020-08-20

申请人： SHINKAWA LTD.

发明人： Kohei Seyama

IPC分类号： H01L21/67 ,  G03F7/00 ,  H01L21/02 ,  H01L21/60 ,  H01L21/68

CPC分类号： H01L21/67259 ,  G03F7/70433 ,  G03F7/70691 ,  H01L21/02 ,  H01L21/60 ,  H01L21/681

摘要： An arrangement apparatus includes a stage, an arrangement part, and a control part. The stage supports a substrate. The arrangement part holds a die and arranges multiple dies on the substrate supported by the stage. The control part has a map data indicating arrangement positions of the dies and generated based on a positional relationship among patterns formed by an exposure apparatus, and controls, based on the map data, relative positions between the stage and the arrangement part when arranging the dies on the substrate.

公开(公告)号：US20240332447A1

公开(公告)日：2024-10-03

申请号：US18695344

申请日：2021-10-18

申请人： LG ELECTRONICS INC.

发明人： Junghun RHO ,  Imdeok JUNG ,  Bongwoon CHOI

IPC分类号： H01L33/00 ,  H01L21/67 ,  H01L21/68 ,  H01L23/00 ,  H01L25/075

CPC分类号： H01L33/00 ,  H01L21/67121 ,  H01L21/68 ,  H01L24/97 ,  H01L25/0753

摘要： The assembly apparatus comprises: a main frame; a magnet head arranged on the main frame so that a semiconductor light-emitting element is self-assembled on a panel; and a vibration isolator arranged on the main frame to offset vibration of the magnet head, wherein the magnet head comprises a magnet plate assembly, which includes a magnet applying an attractive force to the semiconductor light-emitting element, and the vibration isolator comprises a weight positioned on the magnet plate assembly and may minimize the transmission, to the main frame, of vibration generated by the magnet head.

公开(公告)号：US20240332094A1

公开(公告)日：2024-10-03

申请号：US18620287

申请日：2024-03-28

申请人： Prosemi Co., Ltd.

发明人： Wen-Shian CHEN

IPC分类号： H01L21/66 ,  H01L21/67 ,  H01L21/68

CPC分类号： H01L22/20 ,  H01L21/67092 ,  H01L21/67098 ,  H01L21/67248 ,  H01L21/681

摘要： A method for compensating a manufacturing error in a semiconductor process is implemented using a system that includes at least one temperature controller. The method includes: generating a reading signal associated with a location of an alignment symbol on a substrate; generating a difference signal based on the reading signal, the difference signal indicating a difference between the location of the alignment symbol and a location of a reference alignment symbol, the reference alignment symbol being on another substrate; and generating a temperature controlling signal based on the difference signal, the temperature controlling signal controlling operation of the temperature controller to control one of a temperature of an affecting part of the substrate, a temperature of an affecting part of the another substrate, and a combination thereof. Then, a lamination process is implemented to bond the substrate and the another substrate together.

公开(公告)号：US20240314941A1

公开(公告)日：2024-09-19

申请号：US18672618

申请日：2024-05-23

申请人： Kateeva, Inc.

发明人： Eliyahu Vronsky ,  Karl Mathia ,  Alexander Sou-Kang Ko

IPC分类号： H05K3/46 ,  B05C5/02 ,  B05D5/12 ,  B41J2/01 ,  B41J3/407 ,  B41J13/00 ,  B41J29/393 ,  H01L21/67 ,  H01L21/677 ,  H01L21/68 ,  H01L21/683 ,  H10K71/13 ,  H10K99/00

CPC分类号： H05K3/4644 ,  B05C5/0208 ,  B05D5/12 ,  B41J3/407 ,  B41J13/0027 ,  B41J29/393 ,  H05K3/4679 ,  H10K99/00 ,  B41J2/01 ,  H01L21/67 ,  H01L21/6715 ,  H01L21/6776 ,  H01L21/67784 ,  H01L21/68 ,  H01L21/683 ,  H05K2203/0104 ,  H05K2203/013 ,  H05K2203/0736 ,  H05K2203/166 ,  H10K71/135

摘要： A printer deposits material onto a substrate as part of a manufacturing process for an electronic product; at least one transported component experiences error, which affects the deposition. This error is mitigated using transducers that equalize position of the component, e.g., to provide an “ideal” conveyance path, thereby permitting precise droplet placement notwithstanding the error. In one embodiment, an optical guide (e.g., using a laser) is used to define a desired path; sensors mounted to the component dynamically detect deviation from this path, with this deviation then being used to drive the transducers to immediately counteract the deviation. This error correction scheme can be applied to correct for more than type of transport error, for example, to correct for error in a substrate transport path, a printhead transport path and/or split-axis transport non-orthogonality.