公开(公告)号：US12117244B2

公开(公告)日：2024-10-15

申请号：US18173576

申请日：2023-02-23

申请人： COOLER MASTER CO., LTD.

发明人： Chi-Lung Chen

IPC分类号： F28D15/04 ,  F28D15/02 ,  H01L23/427 ,  H05K7/20

CPC分类号： F28D15/04 ,  F28D15/0233 ,  F28D15/0283 ,  F28D15/046 ,  H01L23/427 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20336

摘要： A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

公开(公告)号：US12107032B2

公开(公告)日：2024-10-01

申请号：US16717493

申请日：2019-12-17

申请人： ABB Schweiz AG

发明人： Colin Tschida ,  Pietro Cairoli ,  Hongrae Kim ,  Francesco Agostini ,  Luca Raciti ,  Davide Leoni

IPC分类号： H01L23/427 ,  H01C1/082 ,  H01C7/12 ,  H01L23/495 ,  H02H9/04 ,  H05K7/20

CPC分类号： H01L23/427 ,  H01C1/082 ,  H01C7/12 ,  H01L23/49562 ,  H02H9/044 ,  H05K7/20172 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20327 ,  H05K7/20336 ,  H05K7/209 ,  H05K7/20909 ,  H05K7/20936

摘要： Cooling arrangements are disclosed for solid state circuit breakers. In one arrangement, a MOV is disposed between two pulsating heat pipes. An IGCT is disposed on the other side of each pulsating heat pipe away from the MOV. In another arrangement, a bus bar is integral with a heat spreader disposed between a pulsating heat pipe and an IGCT.

公开(公告)号：US12094802B2

公开(公告)日：2024-09-17

申请号：US17232461

申请日：2021-04-16

申请人： Delta Electronics (Shanghai) CO., LTD

发明人： Pengkai Ji ,  Shouyu Hong ,  Xin Zou ,  Lanyan Xu

IPC分类号： H01L23/40 ,  H01L23/427 ,  H01L25/18 ,  H05K7/20 ,  H01L23/64

CPC分类号： H01L23/4012 ,  H01L23/427 ,  H01L25/18 ,  H05K7/20445 ,  H01L2023/4087 ,  H01L23/642

摘要： The present disclosure provides a data processing device. The data processing device includes a carrier board, a data processor, a power module, a first heat sink, and a heat transfer plate. The data processor is provided above the carrier board. The power module is provided below the carrier board and supplies power to the data processor through the carrier board. The first heat sink is provided above the carrier board. The heat transfer plate includes a main body portion and a first extension. The main body portion is provided below the power module. The first extension portion extends upward from the main body portion and is connected to the first heat sink.

公开(公告)号：US12089374B2

公开(公告)日：2024-09-10

申请号：US17683228

申请日：2022-02-28

申请人： Frore Systems Inc.

发明人： Prabhu Sathyamurthy ,  Suryaprakash Ganti ,  Seshagiri Rao Madhavapeddy ,  Lumaya Ahmed ,  Shekhar Halakatti

IPC分类号： H05K7/20 ,  B06B1/06 ,  F04B43/04 ,  H01L23/427 ,  H01L23/433 ,  H01L23/46 ,  H10N30/20

CPC分类号： H05K7/2039 ,  B06B1/06 ,  H01L23/427 ,  H01L23/433 ,  H10N30/20

摘要： A cooling system including a heat spreader and a cooling element is described. The heat spreader is thermally coupled with a heat-generating structure. The cooling element is in fluid communication heat spreader. The heat-generating structure is offset from the cooling element. The cooling element undergoes vibrational motion when actuated to drive a fluid toward the heat spreader while not directing the fluid directly at the heat-generating structure.

公开(公告)号：US20240295366A1

公开(公告)日：2024-09-05

申请号：US18662214

申请日：2024-05-13

申请人： Delta Electronics, Inc.

发明人： Shih-Lin HUANG ,  Chiu-Kung CHEN ,  Ting-Yuan WU

IPC分类号： F28D15/04 ,  F28D15/02 ,  F28D21/00 ,  H01L23/427

CPC分类号： F28D15/046 ,  H01L23/427 ,  F28D15/0233 ,  F28D2021/0028

摘要： A vapor chamber is provided. The vapor chamber is adapted to be thermally connected to an electronic element. The vapor chamber includes a first member and a second member. The first member has a first heat transfer coefficient. The first member is connected to the electronic element. The second member has a second heat transfer coefficient. The second member is combined with the first member. The first member is located between the second member and the electronic element. The first heat transfer coefficient is greater than the second heat transfer coefficient.

公开(公告)号：US12068422B2

公开(公告)日：2024-08-20

申请号：US17497874

申请日：2021-10-08

申请人： Simmonds Precision Products, Inc.

发明人： Craig R. Bibeau ,  Jason Graham

IPC分类号： H01L31/024 ,  H01L23/427 ,  H01L23/473

CPC分类号： H01L31/024 ,  H01L23/427 ,  H01L23/473

摘要： In accordance with at least one aspect of this disclosure, a thermal management system for an electronics assembly includes, a reservoir housing a compressible fluid in a compressed state, a throttling orifice disposed in fluid communication with the reservoir and configured to expand the compressible fluid, cooling the compressible fluid, and a heat exchange volume in fluid communication with the throttling orifice to receive cooled compressible fluid from the throttling orifice.

公开(公告)号：US12060301B2

公开(公告)日：2024-08-13

申请号：US16956132

申请日：2018-12-21

申请人： THALES ,  UNIVERSITÉ DE LILLE ,  NANYANG TECHNOLOGICAL UNIVERSITY ,  CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE

发明人： Matthieu Pawlik ,  Edwin Hang Tong Teo ,  Philippe Coquet

IPC分类号： C04B35/583 ,  C04B38/00 ,  C04B41/45 ,  C04B41/53 ,  C04B41/82 ,  C04B41/85 ,  F28D20/02 ,  H01L23/427

CPC分类号： C04B35/583 ,  C04B38/0003 ,  C04B41/4535 ,  C04B41/5353 ,  C04B41/82 ,  C04B41/85 ,  H01L23/427 ,  C04B2237/086 ,  F28D20/023

摘要： The invention relates to a composite material based on boron nitride (BN(C)) in the form of a continuous structure; and a phase change material (PCM) incorporated within said continuous BN(C) structure and is embedded within a polymer layer, a process for manufacturing same, and the components that comprise same.

公开(公告)号：US12040250B2

公开(公告)日：2024-07-16

申请号：US17841202

申请日：2022-06-15

申请人： International Business Machines Corporation

发明人： Terence Hook ,  Brent A. Anderson ,  Anthony I. Chou

IPC分类号： H01L23/427 ,  H01L23/522 ,  H01L27/12

CPC分类号： H01L23/427 ,  H01L23/5226 ,  H01L27/1203

摘要： A heat pipe is provided as an electrically inactive structure to dissipate heat that is generated by vertically stacked field effect transistors (FETs). The heat pipe is present in an electrically inactive device area which is located adjacent to an electrically active device area that includes the vertically stacked FETs. The heat pipe includes at least one vertical interconnect structure that continuously extends between each tier of the vertically stacked FETs.

公开(公告)号：US20240186208A1

公开(公告)日：2024-06-06

申请号：US18470458

申请日：2023-09-20

申请人： ADVANTEST CORPORATION ,  TOKYO INSTITUTE OF TECHNOLOGY

发明人： Shinji SUGATANI ,  Takayuki OHBA

IPC分类号： H01L23/367 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/427 ,  H01L23/544 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/367 ,  H01L21/56 ,  H01L23/291 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/427 ,  H01L23/544 ,  H01L25/0655 ,  H01L25/50 ,  H01L24/13

摘要： Provided is a semiconductor device, comprising: a semiconductor chip where a circuit is formed on a side of a first surface of a chip substrate and a transition structure is integrated on a side of a second surface which is opposite to the first surface of the chip substrate, wherein the transition structure is obtained by causing a ratio of a substrate material of a chip substrate body to be less than a ratio of the substrate material on the side of the first surface and adding a thermal conductive material which has a higher thermal conductivity than the substrate material; and a thermal conductor which is joined to the second surface of the semiconductor chip and has a higher thermal conductivity than the substrate material.

公开(公告)号：US20240186206A1

公开(公告)日：2024-06-06

申请号：US18438450

申请日：2024-02-10

申请人： Intel Corporation

发明人： Satish PRATHABAN ,  Ramaswamy PARTHASARATHY ,  Biswajit PATRA ,  Tongyan ZHAI ,  Jeff KU ,  Min Suet LIM ,  Yi HUANG ,  Kai XIAO ,  Gene F. YOUNG ,  Weimin SHI

IPC分类号： H01L23/367 ,  H01L23/00 ,  H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H05K1/02

CPC分类号： H01L23/367 ,  H01L23/427 ,  H01L25/0655 ,  H01L25/18 ,  H05K1/0203 ,  H05K1/0262 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/1427 ,  H01L2924/15311

摘要： Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.