公开(公告)号：US20240363821A1

公开(公告)日：2024-10-31

申请号：US18648434

申请日：2024-04-28

申请人： FOSHAN NATIONSTAR OPTOELECTRONICS CO., LTD.

发明人： Kuai QIN ,  Shaojia XIE ,  Bin CAI ,  Hongwen CHEN ,  Zhuang PENG ,  Kailiang FAN

IPC分类号： H01L33/62 ,  H01L25/075

CPC分类号： H01L33/62 ,  H01L25/0753

摘要： An LED display device array includes a substrate, at least two display units disposed on the upper surface of the substrate, and pin assemblies disposed on the lower surface of the substrate and in one-to-one correspondence with the at least two display units, a cutting line is disposed on the substrate between any two adjacent pin assemblies. Each of the pin assemblies includes at least two pins, and the at least two pins are a first pin and a second pin separately. A first pin in a pin assembly is misaligned with a second pin in an adjacent pin assembly, and the first pin and the second pin are connected to each other by a connecting wire. The connecting wire has a linear connecting segment, and the connecting segment of the connecting wire intersects with the cutting line and is perpendicular to the cutting line.

公开(公告)号：US20240363808A1

公开(公告)日：2024-10-31

申请号：US18575748

申请日：2022-06-30

申请人： ams-OSRAM International GmbH

发明人： Michael Zitzlsperger ,  Rainer Huber ,  Thomas Klafta ,  Stephan Janka

IPC分类号： H01L33/48 ,  H01L25/075 ,  H01L33/62

CPC分类号： H01L33/486 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/0066

摘要： In an embodiment an optoelectronic semiconductor device includes a carrier comprising a mounting side and an attachment side opposite the mounting side, a plurality of separate, metallic lead frame parts and a potting body mechanically holding together the lead frame parts, and a plurality of optoelectronic semiconductor chips mounted on the mounting side, wherein the lead frame parts project beyond the potting body at the mounting side, wherein at least some of the lead frame parts have a double-layered design so that the lead frame parts together form a support layer on the attachment side and a mounting layer on the mounting side, wherein the support layer is embedded in the potting body and the mounting layer extends at least partially onto the potting body.

公开(公告)号：US20240363597A1

公开(公告)日：2024-10-31

申请号：US18620226

申请日：2024-03-28

申请人： LG Display Co., Ltd.

发明人： Jeong Jo Lee ,  Han Seok Kim

IPC分类号： H01L25/075 ,  G06F1/16

CPC分类号： H01L25/0753 ,  G06F1/1656

摘要： A display device includes a display panel; a cover bottom disposed on a rear surface of the display panel; a plate bottom disposed to be in contact with the display panel at an opening of the cover bottom; a circuit board; a flexible film configured to connect the display panel and the circuit board through the opening; and at least one rib disposed between the plate bottom and the circuit board, wherein the circuit board is spaced apart from the plate bottom by the rib.

公开(公告)号：US20240363585A1

公开(公告)日：2024-10-31

申请号：US18768802

申请日：2024-07-10

申请人： VueReal Inc.

发明人： Gholamreza Chaji

IPC分类号： H01L23/00 ,  H01L21/66 ,  H01L21/683 ,  H01L25/075 ,  H01L33/00 ,  H01L33/06 ,  H01L33/08 ,  H01L33/12 ,  H01L33/62 ,  H05K13/04

CPC分类号： H01L24/97 ,  H01L21/6835 ,  H01L22/20 ,  H01L24/80 ,  H01L24/95 ,  H01L33/0093 ,  H01L33/08 ,  H01L33/12 ,  H01L33/62 ,  H05K13/046 ,  H01L22/14 ,  H01L25/0753 ,  H01L33/0095 ,  H01L33/06 ,  H01L2221/68309 ,  H01L2221/68322 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/80006 ,  H01L2224/80132 ,  H01L2224/95001

摘要： This invention relates to integrating pixelated micro-devices into a system substrate. Defined are methods of transferring a plurality of micro-devices into a receiver substrate where a plurality of micro-devices is arranged in one or more cartridges that are aligned and bonded to a template. Further, defining the transfer process, the micro-devices may be selected, identified as defective and a transfer adjustment made based on defective micro-devices.

公开(公告)号：US12132161B2

公开(公告)日：2024-10-29

申请号：US18150673

申请日：2023-01-05

申请人： LUMILEDS LLC

发明人： Tze Yang Hin ,  Seng Huat Lau ,  Hideo Kageyama

IPC分类号： H01L33/62 ,  H01L25/075 ,  H01L33/48 ,  H01L33/56 ,  H01L33/64

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/64

摘要： Light-emitting devices are described herein. A device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening on a top surface of the packaging substrate. The metal inlay is thermally coupled to the bottom surface of the hybridized device. The device also includes conductive contacts on the top surface of the packaging substrate and conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate.

公开(公告)号：US12132030B2

公开(公告)日：2024-10-29

申请号：US17051258

申请日：2020-08-04

申请人： Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.

发明人： Lixuan Chen ,  Xin Zhang

IPC分类号： H01L25/075

CPC分类号： H01L25/0753

摘要： An LED display panel is provided by the present application. Two adjacent LED devices located on both ends of a first splicing seam have a first splicing distance therebetween, and the first splicing distance is defined as D1+ΔA1. A first region is disposed with a plurality of first LED devices thereon. A pitch between at least portions of two adjacent first LED devices gradually decreases from an end close to the first splicing seam to an end away from the first splicing seam in the first region in a first direction, and a pitch between any two adjacent first LED devices is less than the first splicing distance and greater than a first target pitch.

公开(公告)号：US12131961B2

公开(公告)日：2024-10-29

申请号：US17739220

申请日：2022-05-09

申请人： PlayNitride Display Co., Ltd.

发明人： Cheng-Cian Lin

IPC分类号： H01L21/66 ,  G01B11/00 ,  H01L21/67 ,  H01L25/075

CPC分类号： H01L22/22 ,  G01B11/00 ,  H01L21/67011 ,  H01L21/67288 ,  H01L25/0753

摘要： Micro device optical inspection and repairing equipment adopting an adhesion device is provided. The micro device optical inspection and repairing equipment includes a carrying stage, an optical inspection module and at least one adhesion device. The optical inspection module is arranged corresponding to the carrying stage so as to capture image information and obtain a position coordinate from the image information. The adhesion device includes a main body and an adhesive portion. The adhesive portion is connected to the main body. The adhesion device can move to a target position of the carrying stage according to the position coordinate. The main body is adapted to drive the adhesive portion to move to the target position along a moving axis. An optical inspection and repairing method adopting the micro device optical inspection and repairing equipment is also provided.

公开(公告)号：US20240355977A1

公开(公告)日：2024-10-24

申请号：US18759998

申请日：2024-06-30

申请人： JADE BIRD DISPLAY (SHANGHAI) LIMITED

发明人： Jian GUO ,  Huiwen XU

IPC分类号： H01L33/60 ,  G03B21/20 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64

CPC分类号： H01L33/60 ,  G03B21/2013 ,  G03B21/2033 ,  G03B21/2073 ,  H01L25/0753 ,  H01L33/62 ,  H01L33/644

摘要： Disclosed herein are a micro LED structure and a micro LED projector. The micro LED structure comprises: a mesa structure and a reflective structure; wherein, the rays emitted from the sidewall of the mesa structure can be reflected by the reflective structure toward outside. The present disclosure can control the chief ray angle of the micro LED structure and reduce the loss of the light emitting from the sidewall of the mesa structure.

公开(公告)号：US20240355969A1

公开(公告)日：2024-10-24

申请号：US18572868

申请日：2021-12-30

申请人： XIAMEN EXTREMELY PQ DISPLAY TECHNOLOGY CO., LTD.

发明人： Yong FAN

IPC分类号： H01L33/44 ,  H01L25/075 ,  H01L33/00 ,  H01L33/50 ,  H01L33/60

CPC分类号： H01L33/44 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/507 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

摘要： A display panel and a manufacturing method thereof are provided. In the present application, a light-absorbing layer is provided in a display substrate, and a plurality of light-emitting devices is correspondingly disposed in a plurality of hollow areas on the light-absorbing layer. Meanwhile, a color filter and a color conversion layer in a color filter substrate are disposed correspondingly with the light-emitting devices. The problem of poor display performance caused by light crosstalk between adjacent pixels is avoided, and the display effect of the display panel is improved.

公开(公告)号：US20240355966A1

公开(公告)日：2024-10-24

申请号：US18039295

申请日：2023-04-18

申请人： Wuhan China Star Optoelectronics Technology Co., Ltd.

发明人： Ze ZHANG ,  Lei ZHU

IPC分类号： H01L33/24 ,  H01L25/075 ,  H01L33/08

CPC分类号： H01L33/24 ,  H01L25/0753 ,  H01L33/08

摘要： The present disclosure discloses a backlight module, a display module, and a splicing display device. The backlight module includes a central light-emitting area and an edge light-emitting area disposed at a side of the central light-emitting area along a first direction; the central light-emitting area is provided with a plurality of first light-emitting units, and the edge light-emitting area is provided with a plurality of second light-emitting units; a direction from a center to an edge of the backlight module is defined as the first direction, and a distance between adjacent two first light-emitting units is greater than a distance between adjacent two second light-emitting units in the first direction.