公开(公告)号：WO2008052459A1

公开(公告)日：2008-05-08

申请号：PCT/CN2007/070799

申请日：2007-09-27

申请人： HONG KONG APPLIED SCIENCE AND TECHNOLOGY RESEARCH INSTITUTE CO. LTD ,  SHUY, Geoffrey Wen-Tai ,  WU, Enboa ,  LU, Ming

发明人： SHUY, Geoffrey Wen-Tai ,  WU, Enboa ,  LU, Ming

IPC分类号： H01L33/00 ,  H01L27/15

CPC分类号： H01L27/156 ,  H01L33/385 ,  H01L33/62 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/49113

摘要： A light source includes a light emitting diode (LED) module (100) having a continuous substrate (104), a layer of n-type semiconductor material formed above the substrate, and a layer of p-type semiconductor material formed above the n-type semiconductor materials. The p-type and n-type semiconductor materials are selected to emit light at the p-n junction when an electric current flows through the p-n junction. The LED module (100) includes a plurality of electric contacts (112) connected to the p-type semiconductor material, and at least one electric contact (118) connected to the n-type semiconductor material. The electric contacts are configured to pass electric current through a plurality of regions in the p-n junction such that the plurality of regions have higher electric current densities and emit light brighter than areas outside of the plurality of regions.

摘要翻译： 光源包括具有连续衬底（104）的发光二极管（LED）模块（100），形成在衬底上方的n型半导体材料层以及形成在正极上的p型半导体材料层， 型半导体材料。 当电流流过p-n结时，选择p型和n型半导体材料在p-n结处发光。 LED模块（100）包括连接到p型半导体材料的多个电触点（112）和连接到n型半导体材料的至少一个电触头（118）。 电触点被配置为使电流通过p-n结中的多个区域，使得多个区域具有较高的电流密度并且发射比多个区域外的区域更亮的光。

公开(公告)号：WO2007114057A1

公开(公告)日：2007-10-11

申请号：PCT/JP2007/055819

申请日：2007-03-22

申请人： 松下電器産業株式会社 ,  前田 栄作 ,  安藤 仁 ,  金田 甚作 ,  前島 明広 ,  松永 弘樹

发明人： 前田 栄作 ,  安藤 仁 ,  金田 甚作 ,  前島 明広 ,  松永 弘樹

IPC分类号： H01L21/60 ,  G09G3/20 ,  G09G3/28

CPC分类号： H01L24/06 ,  H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/4813 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/4917 ,  H01L2224/49175 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： In a semiconductor integrated circuit device, temperature increase of a bonding wire can be suppressed even when conductive leads are short-circuited each other, and reliability of the semiconductor integrated circuit device is improved. The conductive leads of a resin package for supplying a power supply section of a semiconductor integrated circuit chip with power from an external power supply are connected with the bonding pads of the semiconductor integrated circuit chip by a plurality of bonding wires. Furthermore, the conductive leads connected to a GND for supplying the power supply section of the semiconductor integrated circuit chip with a grounding potential are connected with the bonding pads of the semiconductor integrated circuit chip by a plurality of bonding wires.

摘要翻译： 在半导体集成电路器件中，即使导电线彼此短路，也可以抑制接合线的温度升高，提高半导体集成电路器件的可靠性。 用于向外部电源供电的半导体集成电路芯片的电源部分的树脂封装的导电引线通过多根接合线与半导体集成电路芯片的接合焊盘连接。 此外，连接到用于向半导体集成电路芯片的电源部分提供接地电位的GND的导电引线通过多个接合线与半导体集成电路芯片的接合焊盘连接。

公开(公告)号：WO2007098402A2

公开(公告)日：2007-08-30

申请号：PCT/US2007/062308

申请日：2007-02-16

申请人： EASIC CORPORATION ,  MIHELCIC, Stan, J. ,  LEVINTHAL, Adam ,  COOKE, Laurence, H.

发明人： MIHELCIC, Stan, J. ,  LEVINTHAL, Adam ,  COOKE, Laurence, H.

IPC分类号： H01L23/02

CPC分类号： H01L23/50 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A configurable logic array composed of: a multiplicity of logic cells, each containing look-up tables, a multiplicity of customizable I/O cells, each containing a multiplicity of pads; and a customizable via connection layer for customizing the cells and interconnect between them, may be constructed to include the option of customizing the I/O cells to act as power or ground pins. Assigning custom power and ground pins may depend on the types of I/O cells and package bonding options.

摘要翻译： 一个可配置的逻辑阵列，由以下组成：多个逻辑单元，每个包含查找表，多个可定制I / O单元，每个单元包含多个焊盘; 并且可以构造用于定制单元和它们之间的互连的可定制的通孔连接层，以包括定制I / O单元以用作电源或接地引脚的选项。 分配定制电源和接地引脚可能取决于I / O单元的类型和封装绑定选项。

公开(公告)号：WO2006096794A8

公开(公告)日：2007-06-28

申请号：PCT/US2006008335

申请日：2006-03-07

申请人： LUMINUS DEVICES INC ,  ERCHAK ALEXEI A ,  LIM MICHAEL ,  KARLICEK ROBERT F JR ,  BROWN MICHAEL GREGORY ,  VENEZIA JO A

发明人： ERCHAK ALEXEI A ,  LIM MICHAEL ,  KARLICEK ROBERT F JR ,  BROWN MICHAEL GREGORY ,  VENEZIA JO A

IPC分类号： G02F1/13357

CPC分类号： G02B6/0073 ,  G02B6/0018 ,  G02B6/4298 ,  G02F1/133615 ,  H01L2224/48091 ,  H01L2224/49113 ,  H01L2224/73265 ,  H04N9/315 ,  H04N9/3152 ,  H01L2924/00014

摘要： A system including a panel (2212), a light emitting device (2202), and an optical component (2208) disposed in an optical path (2206, 2210) from the light emitting device (2202) to the edge (2211) of the panel (2212). The optical component (2208) includes an aperture, wherein a ratio of the area of the surface of the light emitting device (2202) to the area of the aperture is from about 0.5 to about 1.1.

摘要翻译： 一种系统，包括设置在从发光装置（2202）到光源（2202）的边缘（2211）的光路（2206,2210）中的面板（2212），发光装置（2202）和光学部件（2208） 面板（2212）。 光学元件（2208）包括孔径，其中发光器件（2202）的表面的面积与孔径的面积之比为约0.5至约1.1。

公开(公告)号：WO2007022399A2

公开(公告)日：2007-02-22

申请号：PCT/US2006032244

申请日：2006-08-15

申请人： TEXAS INSTRUMENTS INC ,  LANGE BERNHARD P

发明人： LANGE BERNHARD P

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/49548 ,  H01L23/645 ,  H01L23/66 ,  H01L24/05 ,  H01L24/06 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/85 ,  H01L2223/6611 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2224/49431 ,  H01L2224/49433 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/2065 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012

摘要： A device comprising a semiconductor chip (110) having a side edge (111) and a plurality of metal bond pads (120, 121) near the edge; the pads are aligned to form rows (130, 131) parallel to the edge. The device further includes a leadframe (100) having leads oriented with one end towards the chip edge and spaced from it by a gap (150); the chip is attached to the leadframe. Ends of selected leads are connected by a metal cross bar (160) parallel to the chip edge. Substantially parallel bond wires (170) are crossing the gap to connect each chip pad either to the crossbar or to a non-selected lead end. In a preferred lead arrangement, the selected leads alternate with non-selected leads.

摘要翻译： 一种器件，包括具有侧边缘（111）和靠近边缘的多个金属接合焊盘（120,121）的半导体芯片（110） 衬垫对齐以形成平行于边缘的行（130,131）。 所述装置还包括引线框架（100），所述引线框架（100）具有一端朝向所述芯片边缘定向的引线，并且通过间隙（150）与所述引线框架间隔开。 芯片连接到引线框。 所选导线的端部通过平行于芯片边缘的金属横杆（160）连接。 基本平行的接合线（170）正在穿过间隙以将每个芯片焊盘连接到横杆或未选择的引线端。 在优选的引线装置中，所选择的引线与未选择的引线交替。

公开(公告)号：WO2005022599A3

公开(公告)日：2006-11-02

申请号：PCT/US2004027855

申请日：2004-08-27

申请人： GCT SEMICONDUCTOR INC ,  KOO YIDO ,  HUH HYUNGKI ,  LEE KANG YOON ,  LEE JEONG-WOO ,  PARK JOONBAE ,  LEE KYEONGHO

发明人： KOO YIDO ,  HUH HYUNGKI ,  LEE KANG YOON ,  LEE JEONG-WOO ,  PARK JOONBAE ,  LEE KYEONGHO

IPC分类号： H01L29/00 ,  H01L20060101 ,  H01L23/02 ,  H01L23/38 ,  H01L23/498 ,  H01L23/52 ,  H01L23/64 ,  H01L29/40 ,  H03B5/12

CPC分类号： H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/6611 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H03B5/1215 ,  H03B5/1228 ,  H03B5/1265 ,  H01L2224/45099 ,  H01L2224/05599

摘要： An integrated circuit package includes an inductance loop formed from a connection of bonding wires and one or more input/output (I/O) package pins. In one embodiment, the inductance loop is formed from a first wire which connects a bonding pad on the integrated circuit chip to an I/O pin of the package and a second wire which connects the same bonding pad to the same pin. By forming the inductor loop within the limits of the integrated circuit package, a substantial reduction in space requirements is realized, which, in turn, promotes miniaturization.

摘要翻译： 集成电路封装包括由接合线和一个或多个输入/输出（I / O）封装引脚的连接形成的电感环路。 在一个实施例中，电感环由将集成电路芯片上的焊盘连接到封装的I / O引脚的第一布线和将相同的焊盘连接到同一引脚的第二布线形成。 通过在集成电路封装的极限内形成电感器回路，实现了空间要求的显着降低，这反过来促进了小型化。

公开(公告)号：WO2006096671A2

公开(公告)日：2006-09-14

申请号：PCT/US2006/007996

申请日：2006-03-07

申请人： LUMINUS DEVICES, INC. ,  ERCHAK, Alexei, A. ,  LIM, Michael ,  KARLICEK, Robert, F., Jr. ,  BROWN, Michael, Gregory ,  VENEZIA, Jo, A.

发明人： ERCHAK, Alexei, A. ,  LIM, Michael ,  KARLICEK, Robert, F., Jr. ,  BROWN, Michael, Gregory ,  VENEZIA, Jo, A.

IPC分类号： H01L31/12

CPC分类号： G02B6/0073 ,  G02B6/0018 ,  G02B6/4298 ,  G02F1/133615 ,  H01L2224/48091 ,  H01L2224/49113 ,  H01L2224/73265 ,  H04N9/315 ,  H04N9/3152 ,  H01L2924/00014

摘要： Light-emitting devices, and related components, processes, systems and methods are disclosed.

摘要翻译：

披露了发光器件及相关部件，工艺，系统和方法。

公开(公告)号：WO2005023131A3

公开(公告)日：2005-05-12

申请号：PCT/US2004029334

申请日：2004-09-09

申请人： PROCTER & GAMBLE ,  PINYAYEV ALEKSEY MIKHAILOVICH ,  GHOSH CHANCHAL KUMAR ,  CHAN JOHN GEOFFREY ,  PING WANG

发明人： PINYAYEV ALEKSEY MIKHAILOVICH ,  GHOSH CHANCHAL KUMAR ,  CHAN JOHN GEOFFREY ,  PING WANG

IPC分类号： A46B15/00 ,  A61C1/08 ,  A61C17/22 ,  A61C17/34 ,  A61C19/06 ,  A61N5/06 ,  H01L25/075

CPC分类号： A61C17/222 ,  A46B15/0002 ,  A46B15/0036 ,  A46B2200/1066 ,  A61C1/088 ,  A61C17/22 ,  A61C17/3436 ,  A61C17/349 ,  A61C19/063 ,  A61C19/066 ,  A61N5/0601 ,  A61N5/062 ,  A61N2005/0606 ,  A61N2005/0651 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

摘要： An illuminated electric toothbrush comprising a light emitting diode emitting light having a flux density of at least about 30 mW/cm . An illuminated electric toothbrush having this level of flux density can result in an oral care benefit such as whitening. When this toothbrush is used within the oral cavity the heat generated by the toothbrush remains low enough that the surface temperature of the teeth remains below about 43 °C. The flux density of at least about 30 MW/CM can be achieved by overpowering the light emitting diode, by using a light emitting diode having at least about two dices, and by providing a pulsed or non-continuous current to the LED which results in a pulsing or non-continuous light.

摘要翻译： 一种发光的电动牙刷，包括发射具有至少约30mW / cm 2的通量密度的光的发光二极管。 具有这种通量密度水平的照明电动牙刷可以导致口腔护理益处，例如美白。 当这种牙刷在口腔内使用时，由牙刷产生的热量保持足够低，使得牙齿的表面温度保持在约43℃以下。 至少约30MW / CM 2的通量密度可以通过使发光二极管功率过大，通过使用具有至少约两个骰子的发光二极管以及通过向LED提供脉冲或不连续电流来实现 这导致脉冲或不连续的光。

公开(公告)号：WO2005023143A2

公开(公告)日：2005-03-17

申请号：PCT/US2004/029335

申请日：2004-09-09

申请人： THE PROCTER & GAMBLE COMPANY ,  GHOSH, Chanchal, Kumar ,  MAJETI, Satyanarayana ,  PINYAYEV, Aleksey, Mikhailovich ,  CHAN, John, Geoffrey ,  WILLEY, Alan, David

发明人： GHOSH, Chanchal, Kumar ,  MAJETI, Satyanarayana ,  PINYAYEV, Aleksey, Mikhailovich ,  CHAN, John, Geoffrey ,  WILLEY, Alan, David

IPC分类号： A61C17/22

CPC分类号： A61C17/222 ,  A46B15/0002 ,  A46B15/0036 ,  A46B2200/1066 ,  A61C1/088 ,  A61C17/22 ,  A61C17/3436 ,  A61C17/349 ,  A61C19/063 ,  A61C19/066 ,  A61N5/0601 ,  A61N5/062 ,  A61N2005/0606 ,  A61N2005/0651 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

摘要： Disclosed is a method for providing an oral care benefit by combining the use of an oral care composition with an electric toothbrush having an electrically powered element disposed thereon. In particular methods are described for using an electric toothbrush comprising a light emitting element, with oral care compositions to provide tooth whitening and stain removal.

摘要翻译： 公开了一种通过将口腔护理组合物与其上设置有电动元件的电动牙刷组合使用来提供口腔护理益处的方法。 描述了使用包含发光元件的电动牙刷的具体方法，以及用于提供牙齿增白和去污的口腔护理组合物。

公开(公告)号：WO2005023131A2

公开(公告)日：2005-03-17

申请号：PCT/US2004/029334

申请日：2004-09-09

申请人： THE PROCTER & GAMBLE COMPANY ,  PINYAYEV, Aleksey, Mikhailovich ,  GHOSH, Chanchal, Kumar ,  CHAN, John, Geoffrey ,  PING, Wang

发明人： PINYAYEV, Aleksey, Mikhailovich ,  GHOSH, Chanchal, Kumar ,  CHAN, John, Geoffrey ,  PING, Wang

IPC分类号： A61C

CPC分类号： A61C17/222 ,  A46B15/0002 ,  A46B15/0036 ,  A46B2200/1066 ,  A61C1/088 ,  A61C17/22 ,  A61C17/3436 ,  A61C17/349 ,  A61C19/063 ,  A61C19/066 ,  A61N5/0601 ,  A61N5/062 ,  A61N2005/0606 ,  A61N2005/0651 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49113 ,  H01L2924/00014

摘要： An illuminated electric toothbrush comprising a light emitting diode emitting light having a flux density of at least about 30 mW/cm 2 . An illuminated electric toothbrush having this level of flux density can result in an oral care benefit such as whitening. When this toothbrush is used within the oral cavity the heat generated by the toothbrush remains low enough that the surface temperature of the teeth remains below about 43 °C. The flux density of at least about 30 MW/CM 2 can be achieved by overpowering the light emitting diode, by using a light emitting diode having at least about two dices, and by providing a pulsed or non-continuous current to the LED which results in a pulsing or non-continuous light.

摘要翻译： 一种照明电动牙刷，其包括发射具有至少约30mW / cm 2的通量密度的光的发光二极管。 具有这种通量密度水平的照明电动牙刷可导致口腔护理益处，例如美白。 当牙刷在口腔内使用时，由牙刷产生的热量保持足够低，使得牙齿的表面温度保持在约43℃以下。 至少约30MW / CM 2的通量密度可以通过使用具有至少约两个骰子的发光二极管来强化发光二极管，并通过向LED提供脉冲或非连续电流来实现 这导致脉冲或非连续光。