专利检索 ap:("国际商业机器公司") AND inv:"宋·K·坎" 第 1 页

1.

发明授权
电子器件中的电连接结构和导体表面材料的形成方法失效

公开(公告)号：CN1112729C

公开(公告)日：2003-06-25

申请号：CN93104636.X

申请日：1993-04-22

申请人： 国际商业机器公司

发明人： 迈克尔·J·布雷迪 , 柯蒂斯·E·法雷尔 , 宋·K·坎 , 杰弗里·R·马里诺 , 唐纳德·J·米卡莱森 , 保罗·A·莫斯科维茨 , 尤金·J·奥沙利文 , 特雷塞·R·奥图尔 , 桑普阿西·帕鲁索塔曼 , 谢尔登·C·里利 , 乔治·F·沃克

IPC分类号： H01L23/48 , H01L21/50 , H01L21/70

CPC分类号： H01L23/53271 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/2885 , H01L21/6835 , H01L21/76838 , H01L23/4951 , H01L23/4985 , H01L23/49872 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/85 , H01L24/97 , H01L2224/02126 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/051 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/13022 , H01L2224/13101 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/2919 , H01L2224/3015 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4847 , H01L2224/48609 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48709 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48809 , H01L2224/48811 , H01L2224/48816 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/73215 , H01L2224/85001 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/92147 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10S428/901 , Y10T428/24917 , H01L2924/01048 , H01L2924/00 , H01L2924/00012 , H01L2224/48824 , H01L2224/05552 , H01L2224/05599

摘要： 在电子器件中将含硅和锗的材料用作导体的表面。焊料可以非熔化地焊接，而且导线可以焊接在这些表面上。在集成电路芯片的封装中，这些材料可以用作引线框架的表面涂层。这些材料可以用移画印花工艺(decal)转印在导体的表面或者用非电的或电解的方法设置在导体的表面上。

2.

发明公开
具有铜-半导体化合物冶金材料的电子器件失效

公开(公告)号：CN1082770A

公开(公告)日：1994-02-23

申请号：CN93104636.X

申请日：1993-04-22

申请人： 国际商业机器公司

发明人： 迈克尔·J·布雷迪 , 柯蒂斯·E·法雷尔 , 宋·K·坎 , 杰弗里·R·马里诺 , 唐纳德·J·米卡莱森 , 保罗·A·莫斯科维茨 , 尤金·J·奥沙利文 , 特雷塞·R·奥图尔 , 桑普阿西·帕鲁索塔曼 , 谢尔登·C·里利 , 乔治·F·沃克

IPC分类号： H01L23/48 , H01L21/50 , H01L21/70

CPC分类号： H01L23/53271 , C23C18/50 , C25D3/54 , H01L21/288 , H01L21/2885 , H01L21/6835 , H01L21/76838 , H01L23/4951 , H01L23/4985 , H01L23/49872 , H01L24/03 , H01L24/05 , H01L24/13 , H01L24/45 , H01L24/48 , H01L24/85 , H01L24/97 , H01L2224/02126 , H01L2224/0347 , H01L2224/0401 , H01L2224/04042 , H01L2224/04073 , H01L2224/05022 , H01L2224/05027 , H01L2224/0508 , H01L2224/051 , H01L2224/05147 , H01L2224/05166 , H01L2224/05171 , H01L2224/05572 , H01L2224/05609 , H01L2224/05611 , H01L2224/05616 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/10126 , H01L2224/1145 , H01L2224/13022 , H01L2224/13101 , H01L2224/13105 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13116 , H01L2224/13118 , H01L2224/1312 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/2919 , H01L2224/3015 , H01L2224/32245 , H01L2224/45101 , H01L2224/45124 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/48091 , H01L2224/48247 , H01L2224/4826 , H01L2224/48465 , H01L2224/4847 , H01L2224/48609 , H01L2224/48611 , H01L2224/48616 , H01L2224/48624 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48709 , H01L2224/48711 , H01L2224/48716 , H01L2224/48724 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48809 , H01L2224/48811 , H01L2224/48816 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/73215 , H01L2224/85001 , H01L2224/85201 , H01L2224/85203 , H01L2224/85205 , H01L2224/85214 , H01L2224/92147 , H01L2924/00014 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01058 , H01L2924/0106 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01327 , H01L2924/014 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12032 , H01L2924/12033 , H01L2924/12042 , H01L2924/14 , H01L2924/15747 , H01L2924/15787 , H01L2924/181 , H01L2924/30105 , H01L2924/3011 , Y10S428/901 , Y10T428/24917 , H01L2924/01048 , H01L2924/00 , H01L2924/00012 , H01L2224/48824 , H01L2224/05552 , H01L2224/05599

摘要： 在电子器件中将含硅和锗的材料用作导体的表面。焊料可以非熔化地焊接，而且导线可以焊接在这些表面上。在集成电路芯片的封装中，这些材料可以用作引线框架的表面涂层。这些材料可用移画印花工艺(decal)转印在导体的表面或者用非电的或电解的方法设置在导体的表面上。