专利检索 ap:("瑞萨电子株式会社") AND inv:"日高隆雄" 第 1 页

1.

发明授权
半导体器件有权

公开(公告)号：CN103400818B

公开(公告)日：2016-06-22

申请号：CN201310353825.7

申请日：2009-06-12

申请人： 瑞萨电子株式会社

发明人： 小松干彦 , 日高隆雄 , 木村纯子

IPC分类号： H01L23/488

CPC分类号： H01L25/0657 , G06F1/26 , H01L23/3114 , H01L23/481 , H01L23/4952 , H01L23/49575 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/09 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/16 , H01L2223/6611 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/85205 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01003 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/01039 , H01L2924/00 , H01L2224/48257 , H01L2924/00012 , H01L2924/00011

摘要： 本发明公开了一种在一个封装中层叠有多个半导体芯片的半导体器件中，将多个半导体芯片中的任何一个所产生的电压作为电源电压供给其它半导体芯片并可使其稳定运行的技术。本发明的主要一例是将2个芯片层叠，将焊盘A、B、C分别配置于各芯片并排的边，将所述焊盘分别以金属线wireA、B、C共同地连接。另一例为沿着与配置有焊盘A、B、C的边不同的边配置焊盘H及焊盘J，并通过金属线wireHJ将芯片间接合连接。

2.

发明公开
半导体器件有权

公开(公告)号：CN103794591A

公开(公告)日：2014-05-14

申请号：CN201310353788.X

申请日：2009-06-12

申请人： 瑞萨电子株式会社

发明人： 小松干彦 , 日高隆雄 , 木村纯子

IPC分类号： H01L23/495 , H01L25/16 , H01L25/065

CPC分类号： H01L25/0657 , G06F1/26 , H01L23/3114 , H01L23/481 , H01L23/4952 , H01L23/49575 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/09 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/16 , H01L2223/6611 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/85205 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01003 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/01039 , H01L2924/00 , H01L2224/48257 , H01L2924/00012 , H01L2924/00011

摘要： 本发明公开了一种在一个封装中层叠有多个半导体芯片的半导体器件中，将多个半导体芯片中的任何一个所产生的电压作为电源电压供给其它半导体芯片并可使其稳定运行的技术。本发明的主要一例是将2个芯片层叠，将焊盘A、B、C分别配置于各芯片并排的边，将所述焊盘分别以金属线wireA、B、C共同地连接。另一例为沿着与配置有焊盘A、B、C的边不同的边配置焊盘H及焊盘J，并通过金属线wireHJ将芯片间接合连接。

3.

发明公开
半导体器件有权

公开(公告)号：CN103400818A

公开(公告)日：2013-11-20

申请号：CN201310353825.7

申请日：2009-06-12

申请人： 瑞萨电子株式会社

发明人： 小松干彦 , 日高隆雄 , 木村纯子

IPC分类号： H01L23/488

CPC分类号： H01L25/0657 , G06F1/26 , H01L23/3114 , H01L23/481 , H01L23/4952 , H01L23/49575 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/09 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/16 , H01L2223/6611 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/85205 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01003 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/01039 , H01L2924/00 , H01L2224/48257 , H01L2924/00012 , H01L2924/00011

摘要： 本发明公开了一种在一个封装中层叠有多个半导体芯片的半导体器件中，将多个半导体芯片中的任何一个所产生的电压作为电源电压供给其它半导体芯片并可使其稳定运行的技术。本发明的主要一例是将2个芯片层叠，将焊盘A、B、C分别配置于各芯片并排的边，将所述焊盘分别以金属线wireA、B、C共同地连接。另一例为沿着与配置有焊盘A、B、C的边不同的边配置焊盘H及焊盘J，并通过金属线wireHJ将芯片间接合连接。

4.

发明授权
半导体器件有权

公开(公告)号：CN103794591B

公开(公告)日：2016-08-10

申请号：CN201310353788.X

申请日：2009-06-12

申请人： 瑞萨电子株式会社

发明人： 小松干彦 , 日高隆雄 , 木村纯子

IPC分类号： H01L23/495 , H01L25/16 , H01L25/065

CPC分类号： H01L25/0657 , G06F1/26 , H01L23/3114 , H01L23/481 , H01L23/4952 , H01L23/49575 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/09 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/16 , H01L2223/6611 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/85205 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01003 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/01039 , H01L2924/00 , H01L2224/48257 , H01L2924/00012 , H01L2924/00011

摘要： 本发明公开了一种在一个封装中层叠有多个半导体芯片的半导体器件中，将多个半导体芯片中的任何一个所产生的电压作为电源电压供给其它半导体芯片并可使其稳定运行的技术。本发明的主要一例是将2个芯片层叠，将焊盘A、B、C分别配置于各芯片并排的边，将所述焊盘分别以金属线wireA、B、C共同地连接。另一例为沿着与配置有焊盘A、B、C的边不同的边配置焊盘H及焊盘J，并通过金属线wireHJ将芯片间接合连接。

5.

发明授权
半导体器件有权转让

公开(公告)号：CN101677096B

公开(公告)日：2013-09-11

申请号：CN200910146106.1

申请日：2009-06-12

申请人： 瑞萨电子株式会社

发明人： 小松干彦 , 日高隆雄 , 木村纯子

IPC分类号： H01L25/00 , H01L23/482 , H01L23/52 , H01L23/58

CPC分类号： H01L25/0657 , G06F1/26 , H01L23/3114 , H01L23/481 , H01L23/4952 , H01L23/49575 , H01L23/50 , H01L24/05 , H01L24/06 , H01L24/09 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/85 , H01L25/16 , H01L2223/6611 , H01L2224/02166 , H01L2224/04042 , H01L2224/05553 , H01L2224/05554 , H01L2224/05556 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/32145 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48145 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48647 , H01L2224/48724 , H01L2224/48747 , H01L2224/48824 , H01L2224/48847 , H01L2224/49111 , H01L2224/49113 , H01L2224/4917 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2224/85205 , H01L2225/06506 , H01L2225/0651 , H01L2225/06555 , H01L2225/06562 , H01L2924/00014 , H01L2924/01003 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01055 , H01L2924/01057 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/13091 , H01L2924/15311 , H01L2924/15787 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107 , H01L2924/30105 , H01L2924/01039 , H01L2924/00 , H01L2224/48257 , H01L2924/00012 , H01L2924/00011

摘要： 本发明提供一种半导体器件，该半导体器件是在一个封装中层叠有多个半导体芯片，将多个半导体芯片中的任何一个所产生的电压作为电源电压供给其它半导体芯片并可使其稳定运行。本发明的主要一例是将2个芯片层叠，将焊盘(A、B、C)分别配置于各芯片并排的边，将所述焊盘分别以金属线(wireA、B、C)共同地连接。另一例为沿着与配置有焊盘(A、B、C)的边不同的边配置焊盘(H)及焊盘(J)，并通过金属线(wireHJ)将芯片间接合连接。