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公开(公告)号:CN105140136B
公开(公告)日:2018-02-13
申请号:CN201510438605.3
申请日:2010-03-11
申请人: 高通股份有限公司
IPC分类号: H01L21/56 , H01L21/60 , H01L23/31 , H01L23/48 , H01L23/522 , H01L25/065 , H01L25/18
CPC分类号: G06F1/16 , G11C5/147 , H01L21/563 , H01L23/3128 , H01L23/3171 , H01L23/3192 , H01L23/481 , H01L23/5223 , H01L23/5227 , H01L23/60 , H01L23/66 , H01L24/02 , H01L24/03 , H01L24/05 , H01L24/06 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/50 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/85 , H01L24/92 , H01L24/94 , H01L24/97 , H01L25/0657 , H01L25/16 , H01L25/18 , H01L25/50 , H01L2223/6611 , H01L2223/6666 , H01L2224/02166 , H01L2224/02311 , H01L2224/02313 , H01L2224/02321 , H01L2224/0233 , H01L2224/02331 , H01L2224/0235 , H01L2224/0237 , H01L2224/02371 , H01L2224/02375 , H01L2224/02381 , H01L2224/0239 , H01L2224/024 , H01L2224/0345 , H01L2224/03462 , H01L2224/03464 , H01L2224/03612 , H01L2224/03614 , H01L2224/03912 , H01L2224/0392 , H01L2224/0401 , H01L2224/04042 , H01L2224/05024 , H01L2224/05027 , H01L2224/05155 , H01L2224/05166 , H01L2224/05171 , H01L2224/05176 , H01L2224/05181 , H01L2224/05187 , H01L2224/05541 , H01L2224/05548 , H01L2224/05554 , H01L2224/0556 , H01L2224/05567 , H01L2224/05572 , H01L2224/056 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05669 , H01L2224/05673 , H01L2224/05676 , H01L2224/11 , H01L2224/11009 , H01L2224/1132 , H01L2224/11334 , H01L2224/11462 , H01L2224/11464 , H01L2224/1147 , H01L2224/11849 , H01L2224/119 , H01L2224/1191 , H01L2224/13 , H01L2224/13006 , H01L2224/1302 , H01L2224/13022 , H01L2224/13024 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/13099 , H01L2224/131 , H01L2224/13109 , H01L2224/13111 , H01L2224/13113 , H01L2224/13124 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13164 , H01L2224/13169 , H01L2224/13294 , H01L2224/133 , H01L2224/13311 , H01L2224/13609 , H01L2224/1403 , H01L2224/1411 , H01L2224/14181 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/16245 , H01L2224/16265 , H01L2224/17181 , H01L2224/2919 , H01L2224/2929 , H01L2224/29294 , H01L2224/293 , H01L2224/29339 , H01L2224/32105 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48111 , H01L2224/48145 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/48624 , H01L2224/48644 , H01L2224/48647 , H01L2224/48664 , H01L2224/48669 , H01L2224/48764 , H01L2224/48769 , H01L2224/48824 , H01L2224/48844 , H01L2224/48847 , H01L2224/48864 , H01L2224/4911 , H01L2224/49175 , H01L2224/4918 , H01L2224/73203 , H01L2224/73204 , H01L2224/73207 , H01L2224/73215 , H01L2224/73253 , H01L2224/73257 , H01L2224/73265 , H01L2224/81191 , H01L2224/81411 , H01L2224/81444 , H01L2224/81801 , H01L2224/81815 , H01L2224/8185 , H01L2224/81895 , H01L2224/81903 , H01L2224/83101 , H01L2224/83104 , H01L2224/83851 , H01L2224/92 , H01L2224/9202 , H01L2224/92125 , H01L2224/92127 , H01L2224/92147 , H01L2224/92225 , H01L2224/92247 , H01L2224/94 , H01L2224/97 , H01L2225/06506 , H01L2225/0651 , H01L2225/06513 , H01L2225/06517 , H01L2225/06541 , H01L2225/06562 , H01L2225/06589 , H01L2225/1023 , H01L2225/1029 , H01L2225/1058 , H01L2225/107 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/0102 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01031 , H01L2924/01032 , H01L2924/01033 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01059 , H01L2924/01068 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01075 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01083 , H01L2924/01322 , H01L2924/01327 , H01L2924/014 , H01L2924/04941 , H01L2924/04953 , H01L2924/05042 , H01L2924/09701 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12042 , H01L2924/1305 , H01L2924/13091 , H01L2924/14 , H01L2924/1421 , H01L2924/1433 , H01L2924/15311 , H01L2924/15787 , H01L2924/15788 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19104 , H01L2924/19105 , H01L2924/30105 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48869 , H01L2224/48744 , H01L2924/00012 , H01L2224/03 , H01L2224/0361 , H01L2924/0665 , H01L2224/81 , H01L2224/83 , H01L24/78 , H01L2224/85 , H01L21/56 , H01L21/78 , H01L2924/0635 , H01L2924/07025 , H01L21/304 , H01L21/76898 , H01L2224/0231
摘要: 本申请涉及使用顶部后钝化技术和底部结构技术的集成电路芯片。本发明揭示集成电路芯片和芯片封装,其包含所述集成电路芯片的顶部处的过钝化方案和所述集成电路芯片的底部处的底部方案,所述过钝化方案和底部方案使用顶部后钝化技术和底部结构技术。所述集成电路芯片可通过所述过钝化方案或所述底部方案连接到外部电路或结构,例如球栅格阵列(BGA)衬底、印刷电路板、半导体芯片、金属衬底、玻璃衬底或陶瓷衬底。还描述相关的制造技术。
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公开(公告)号:CN103779359B
公开(公告)日:2017-03-29
申请号:CN201410039983.X
申请日:2005-11-22
申请人: 株式会社半导体能源研究所
IPC分类号: H01L27/12 , H01L29/786 , H01L21/84 , H01L21/02 , H01L23/544 , H01L21/683 , H01L23/488
CPC分类号: H01L21/6835 , H01L21/02532 , H01L21/02683 , H01L21/02691 , H01L21/84 , H01L23/544 , H01L24/29 , H01L24/48 , H01L24/73 , H01L24/83 , H01L24/85 , H01L27/12 , H01L29/78603 , H01L29/78648 , H01L2221/6835 , H01L2223/5442 , H01L2223/54426 , H01L2223/6677 , H01L2224/16 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/48464 , H01L2224/73265 , H01L2224/83191 , H01L2224/838 , H01L2224/85 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01018 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01032 , H01L2924/01033 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/0106 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/04941 , H01L2924/04953 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19043 , H01L2924/30105 , H01Q1/38 , H01Q9/285 , H01Q23/00 , Y10S438/982 , H01L2924/00 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 本发明的目的在于提供一种通过不同于专利文献1中公开的方法从衬底分离薄膜晶体管和包括该薄膜晶体管的电路或半导体器件,并将该薄膜晶体管和电路或半导体器件移位到具有柔性的衬底上的方法。根据本发明,在绝缘膜处形成了大开口或多个开口,在开口处形成了连接薄膜晶体管的导电膜,以及移除了剥离层,然后,将具有薄膜晶体管的层移位到提供有导电膜等的衬底上。根据本发明的薄膜晶体管具有通过激光照射结晶化的半导体膜,并且防止不必用激光照射的剥离层暴露在激光照射下。
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公开(公告)号:CN105745339A
公开(公告)日:2016-07-06
申请号:CN201480048613.0
申请日:2014-09-04
申请人: MK电子株式会社
IPC分类号: C22C5/06 , H01L21/301
CPC分类号: C22C5/06 , H01L24/43 , H01L24/45 , H01L2224/43 , H01L2224/43848 , H01L2224/45139 , H01L2224/45147 , H01L2224/48091 , H01L2924/00011 , H01L2924/181 , H01L2924/01046 , H01L2924/01079 , H01L2924/00014 , H01L2924/013 , H01L2924/00 , H01L2924/2011 , H01L2924/20111 , H01L2924/01047 , H01L2924/01078 , H01L2924/01022 , H01L2924/01077 , H01L2924/00013 , H01L2924/00015 , H01L2924/01049
摘要: 含有银(Ag)作为主要组分并且含有钯(Pd)和金(Au)的银合金接合线,其中钯(Pd)含量是约0.1重量%至约4.0重量%,并且金(Au)与钯(Pd)的重量含量比是约0.25至约1.0。银合金接合线的使用改善了接合球形状和在线尖端上形成的球的球形均匀性,并且提供了优异的可靠性、焊环线性度和接合强度。
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公开(公告)号:CN105295764A
公开(公告)日:2016-02-03
申请号:CN201510645083.4
申请日:2009-04-17
申请人: 日立化成工业株式会社
IPC分类号: C09J9/02 , C09J171/12 , C09J175/06 , C09J175/08 , C09J175/14 , H01B1/12 , H01L23/488
CPC分类号: C09J4/06 , C08F283/006 , C08F290/00 , C08F290/06 , C08G18/672 , C08G18/755 , C08L2666/02 , C09J133/14 , C09J151/003 , C09J175/16 , G02F2202/28 , H01B1/122 , H01L24/28 , H01L24/83 , H01L2224/2919 , H01L2224/838 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , C08G18/44 , C08G18/48 , H01L2924/00
摘要: 本发明涉及粘接剂组合物在用于制造连接材料中的应用、电路连接用粘接剂、连接体及半导体装置。本发明涉及一种粘接剂组合物在用于制造连接材料中的应用,该连接材料用于介于具有相对的电路电极的基板间,而以使所述相对的电路电极彼此间电连接的方式粘接所述基板彼此间,其特征在于,所述粘接剂组合物含有:(a)热塑性树脂、(b)一分子中具有2个以上的(甲基)丙烯酰基及2个以上的氨基甲酸酯键且重均分子量为大于30000且小于50000的自由基聚合性化合物、以及(c)自由基聚合引发剂,并进一步含有所述(b)自由基聚合性化合物以外的3官能的(甲基)丙烯酸酯。
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公开(公告)号:CN102618213B
公开(公告)日:2015-05-20
申请号:CN201210018460.8
申请日:2005-03-16
申请人: 住友电木株式会社
IPC分类号: C08F290/06 , C09J201/02 , C09J4/00 , C09J4/02 , H01L21/58 , H01L23/373
CPC分类号: C08F220/58 , C08F234/02 , C08G73/12 , C08K3/08 , C08K3/26 , C08K5/0025 , C08K5/14 , C08L79/085 , C09J179/08 , C09J201/025 , H01L23/145 , H01L23/3737 , H01L24/29 , H01L24/83 , H01L2224/29111 , H01L2224/2919 , H01L2224/8385 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01024 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01057 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/1579 , H01L2924/181 , H01L2924/30105 , H01L2924/00 , H01L2924/3512 , H01L2924/00015
摘要: 本发明涉及一种树脂组合物,其是用作粘接半导体元件或散热部件的粘合剂使用的树脂组合物,其特征在于,至少含有填充材料(A)、主链骨架上含有以下述通式(1)表示的结构且至少含有一个以下述通式(2)表示的官能团的化合物(B)、以及热自由基引发剂(C),并且实质上不含光聚合引发剂。可提供一种速固化性优良,在烘箱中也可进行固化,作为半导体用芯片粘合材料使用时,耐焊锡裂纹性等可靠性也优良的半导体装置。
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公开(公告)号:CN102569256B
公开(公告)日:2014-11-19
申请号:CN201210036267.7
申请日:2009-02-18
申请人: 三菱电机株式会社
IPC分类号: H01L23/538 , H01L23/433 , H01L23/495 , H01L25/11 , H01L25/18
CPC分类号: H01L23/5385 , H01L21/565 , H01L23/4334 , H01L23/49537 , H01L24/48 , H01L24/49 , H01L24/97 , H01L25/117 , H01L25/18 , H01L2224/48091 , H01L2224/48247 , H01L2224/49175 , H01L2924/00014 , H01L2924/01068 , H01L2924/01077 , H01L2924/01087 , H01L2924/12044 , H01L2924/1301 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3011 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要: 本发明的目的在于提供实现重叠配置元件且散热性较高的树脂密封型半导体的树脂密封型半导体装置及其制造方法。具备:第一半导体开关元件,在表面接合有第一发射极端子,在背面接合有第一集电极端子;第二半导体开关元件,在表面接合有第二发射极端子,在背面接合有第二集电极端子;第一散热板,与该第一集电极端子接合;第二散热板,与该第二集电极端子接合;整体地覆盖该第一半导体开关元件和该第二半导体开关元件的模塑树脂。并且,该第一散热板、该第二散热板从该模塑树脂露出,该第一发射极端子和该第二发射极端子相对并且分离。
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公开(公告)号:CN102618178B
公开(公告)日:2014-11-05
申请号:CN201210022735.5
申请日:2012-01-20
申请人: 琳得科株式会社
CPC分类号: H01L24/27 , C08L33/066 , C08L63/00 , C09J133/08 , C09J163/00 , H01L21/6836 , H01L24/29 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29386 , H01L2224/83191 , H01L2224/83862 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/0102 , H01L2924/01029 , H01L2924/01033 , H01L2924/01045 , H01L2924/01075 , H01L2924/01077 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0715 , H01L2924/09701 , H01L2924/10253 , H01L2924/181 , Y10T428/249982 , Y10T428/287 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/05442 , H01L2924/05432 , H01L2924/04642 , H01L2924/0503 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要: 本发明提供一种在一定期间的保管后,经过严格的热湿条件及回焊步骤,封装可靠性及粘接性也优良的半导体用粘接剂组合物等。本发明的半导体用粘接剂组合物的特征在于,包含丙烯酸酯聚合物(A);环氧系热固化树脂(B);热固化剂(C);具有有机官能团、分子量300以上、烷氧基当量大于13mmol/g的硅烷化合物(D);以及具有有机官能团、分子量300以下、烷氧基当量13mmol/g以下的硅烷化合物(E)。
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公开(公告)号:CN104018023A
公开(公告)日:2014-09-03
申请号:CN201410187816.X
申请日:2014-05-06
申请人: 阜阳市光普照明科技有限公司
CPC分类号: H01L2224/43 , H01L2224/4321 , H01L2224/43848 , H01L2224/43986 , H01L2224/45 , H01L2224/45147 , H01L2924/12041 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/0102 , H01L2924/01004 , H01L2924/01022 , H01L2924/01077 , H01L2924/01058 , H01L2924/0107 , H01L2924/01063 , H01L2924/01005 , H01L2924/01015 , H01L2924/013 , H01L2924/00 , H01L2924/00012 , H01L2924/01012 , H01L2924/01013 , H01L2924/0103 , H01L2924/01031 , H01L2924/0105
摘要: 本发明公开了一种LED封装用铜合金键合连接线的制备方法,其各元素成分的重量百分比如下:Pd0.3-0.6、Ag0.2-0.4、Au0.15-0.25、Pt0.05-0.1、Ca0.07-0.14、Be0.04-0.08、Ti0.02-0.03、Ir0.015-0.025、Ce0.01-0.02、Yb0.008-0.016、Eu0.005-0.01、B0.004-0.0.007、P0.005-0.01,余量为铜及不可避免的杂质。本发明制得的铜合金键合连接线具有柔软性好,硬度低,耐腐蚀氧化,导电和导热性能好,抗拉强度高、成本低等特点,大大提高了铜线的使用可靠性和安全性。
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公开(公告)号:CN102277124B
公开(公告)日:2014-08-06
申请号:CN201110222529.4
申请日:2006-03-15
申请人: 日立化成株式会社
IPC分类号: C09J175/16 , C09J9/02 , H01L23/00 , H05K3/32
CPC分类号: C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00
摘要: 本发明是粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置。本发明的粘接剂组合物含有自由基产生剂、热塑性树脂、和分子内具有2个以上的(甲基)丙烯酰基和2个以上的氨酯键且具有下述式(H)表示的2价基团的聚氨酯(甲基)丙烯酸酯,
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公开(公告)号:CN102796487B
公开(公告)日:2014-04-02
申请号:CN201210279675.5
申请日:2006-03-15
申请人: 日立化成株式会社
IPC分类号: C09J175/16 , C09J9/02 , H01L21/603 , H01R4/04 , H05K3/32
CPC分类号: C08G18/672 , C08G18/3212 , C08G18/44 , C08G18/73 , C08L75/16 , C08L2666/20 , C09J133/066 , C09J133/14 , C09J175/16 , H01L24/29 , H01L24/83 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/29386 , H01L2224/294 , H01L2224/32225 , H01L2224/83101 , H01L2224/83851 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01067 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/10329 , H01L2924/10336 , H01L2924/10349 , H01L2924/15788 , H01L2924/19042 , H05K3/323 , H05K2201/0129 , C08G18/664 , C08G18/6674 , C08G18/6607 , C08G18/48 , H01L2924/00
摘要: 本发明是粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置。本发明的粘接剂组合物含有:自由基产生剂、热塑性树脂、分子内具有2个以上的自由基聚合性基团、包含下述通式(B)和/或(C)的结构、包含选自下述通式(D)、(E)和(F)中的至少1种结构、且重均分子量为3000~30000的聚氨酯(甲基)丙烯酸酯、以及分子内具有1以上磷酸基的乙烯基化合物,通式(C)中,R5表示氢、R6表示甲基,或者,R5表示甲基、R6表示氢,通式(D)、(E)、(F)中,l、m及n各自表示2~60的整数。
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