公开(公告)号：EP1034091B1

公开(公告)日：2004-01-14

申请号：EP98936818.8

申请日：1998-07-02

Applicant: Lear Automotive Dearborn, Inc.

Inventor： MAUE, H., Winston ,  REICH, Ronald, K. ,  MORGAN, Robert, G. ,  RODDY, Timothy, S.

IPC: B60R16/02

CPC classification number: B60R16/0215 ,  B60R16/0207 ,  B60R16/0238 ,  B60R16/0239 ,  H01H2011/0081 ,  H01H2011/065 ,  H01H2300/01 ,  H01R9/2466 ,  H01R12/59 ,  H05K1/0284 ,  H05K1/144 ,  H05K3/182 ,  H05K2201/0187 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/10053

Abstract: The preferred embodiment apparatus employs an interior trim panel (23) and an electrical harness (25) for use in an automative vehicle. In one aspect of the present invention, the interior trim panel has a generally rigid substrate (27) covered by an aesthetically pleasing covering material (29). In another aspect of the present invention, an electrical harness (25) is provided with integrally created switch contacts (71; 73; 91; 101) and integrally created connector terminals (271). The invention includes an electrical harness (25) made by injection molding a catalytic platable polymeric resin (41) in a first injection mold. Next, a second shot of a non-catalytic polymeric resin (43) is injection molded over portions of the catalytic platable polymeric resin (41) in a second mold. The surfaces of catalytic platable polymeric resin (41) which remain exposed after overmolding of non-catalytic polymeric resin (43) define multiple circuits (45). An adhesion promoter is applied to these exposed circuit areas and then these exposed surfaces are plated with an electroless copper which is attracted to the catalyst in catalytic platable resin (41). The polymeric resins are preferably selected from those having a relatively high heat deflection temperature. The non-catalytic polymeric resin (43) acts as an insulator while the raised and plated portions of catalytic platable polymeric resin (41) act as electricity carrying, conductive circuits or traces (45).

公开(公告)号：EP0792518B1

公开(公告)日：2003-04-23

申请号：EP95940644.8

申请日：1995-11-06

Applicant: MICRON TECHNOLOGY, INC.

Inventor： AKRAM, Salman ,  FARNWORTH, Warren, M. ,  WOOD, Alan, G.

IPC: H01L21/66 ,  G01R1/073

CPC classification number: G01R1/06738 ,  G01R1/07314 ,  H01L2224/13019 ,  H05K1/0306 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09045 ,  Y10T29/49155 ,  Y10T29/49453

Abstract: A method for forming a self-limiting, silicon based interconnect for making temporary electrical contact with bond pads on a semiconductor die is provided. The interconnect includes a silicon substrate having an array of contact members adapted to contact the bond pads on the die for test purposes (e.g., burn-in testing). The interconnect is fabricated by: forming the contact members on the substrate; forming a conductive layer on the tip of the contact members; and then forming conductive traces to the conductive layer. The conductive layer is formed by depositing a silicon containing layer (e.g., polysilicon, amorphous silicon) and a metal layer (e.g., titanium, tungsten, platinum) on the substrate and contact members. These layers are reacted to form a silicide. The unreacted metal and silicon containing layer are then etched selective to the conductive layer which remains on the tip of the contact members. Conductive traces are then formed in contact with the conductive layer using a suitable metallization process. Bond wires are attached to the conductive traces and may be attached to external test circuitry. Alternately, another conductive path such as external contacts (e.g., slide contacts) may provide a conductive path between the conductive traces and external circuitry. The conductive layer, conductive traces and bond wires provide a low resistivity conductive path from the tips of the contact members to external test circuitry.

公开(公告)号：EP1155603B1

公开(公告)日：2003-03-05

申请号：EP00900531.5

申请日：2000-01-06

Applicant: Novatec S.A.

Inventor： BOURRIERES, Francis ,  KAISER, Clément

IPC: H05K3/34 ,  H05K3/36

CPC classification number: H05K3/34 ,  H05K1/0284 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/09045 ,  H05K2201/10477 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149

Abstract: The invention concerns a method for producing electronic modules with ball connector (7) or integrated preforms capable of being soldered on a printed circuit (3) and a device for implementing said method. The invention concerns a method for producing electronic modules in the form of ball housings combining a ball grid array (7) or geometrically identical preforms for interconnecting or shielding and surface-mounted components (2) on the same surface of a substrate (1), thereby enabling said module to be directly connectable by soldering on a printed circuit (3). The balls (7) and the components (2) are transferred in one single step onto the substrate (1) by means of a gripping device adapted to the topography of the module to be produced.

Abstract translation: 本发明涉及用于制造电子模块的与球连接器的方法（7）或能够在印刷电路（3）和用于实施所述方法的设备上被焊接一体化的预成型件。 本发明涉及一种方法，用于在球壳体结合球栅阵列（7）或几何形状相同的预型件，用于互连或屏蔽和表面安装部件的形式生产电子模块（2）上的基片的同一表面（1） 从而使得所述模块是由印刷电路（3）上直接焊接连接。 滚珠（7）和所述组件（2）在到衬底（1）一个单独的步骤中通过一个夹紧装置angepasst被转印到要产生的模块的形貌。

公开(公告)号：EP1284502A1

公开(公告)日：2003-02-19

申请号：EP02016356.4

申请日：1996-11-07

Applicant: FUJITSU LIMITED

Inventor： Yoneda, Yoshiyuki, Fujitsu Limited ,  Tsuji, Kazuto, Fujitsu Limited ,  Orimo, Seiichi, Fujitsu Limited ,  Sakoda, Hideharu, Fujitsu Limited ,  Nomoto, Ryuji, Fujitsu Limited ,  Onodera, Masanori, Fujitsu Limited ,  Kasai, Junichi, Fujitsu Limited

IPC: H01L23/31

CPC classification number: H01L21/4832 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/67138 ,  H01L21/6833 ,  H01L23/3107 ,  H01L24/11 ,  H01L24/13 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/85 ,  H01L24/97 ,  H01L25/105 ,  H01L29/0657 ,  H01L2224/05554 ,  H01L2224/11 ,  H01L2224/1134 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45565 ,  H01L2224/4569 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/4848 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/7865 ,  H01L2224/85001 ,  H01L2224/85051 ,  H01L2224/85181 ,  H01L2224/85205 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85455 ,  H01L2224/85664 ,  H01L2224/85986 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10158 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3011 ,  H05K1/181 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3436 ,  H05K3/3442 ,  H05K2201/09045 ,  H05K2201/10727 ,  H05K2201/10977 ,  Y02P70/613 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A device includes a chip (111), and a resin package (112, 151, 314) sealing the chip, the resin package having resin projections (117, 154, 318) located on a mount-side surface of the resin package. Metallic films (113, 155, 315) are respectively provided to the resin projections. Connecting parts (118, 101, 163, 245, 313, 341, 342) electrically connect electrode pads of the chip and the metallic films.

Abstract translation: 一种器件包括芯片（111）和密封芯片的树脂封装（112,151,314），树脂封装具有位于树脂封装的安装侧表面上的树脂突起（117,154,318）。 金属膜（113,155,315）分别设置在树脂突起上。 连接部件（118,101,163,245,313,341,342）电连接芯片的电极焊盘和金属膜。

公开(公告)号：EP1128475A3

公开(公告)日：2002-11-27

申请号：EP01101986.6

申请日：2001-01-30

Applicant: ITT MANUFACTURING ENTERPRISES, INC.

Inventor： Sarkissian, Vicken Roben

IPC: H01R12/20

CPC classification number: H05K1/119 ,  H01R12/716 ,  H01R13/035 ,  H01R13/62933 ,  H05K1/0284 ,  H05K3/326 ,  H05K3/368 ,  H05K3/42 ,  H05K2201/09045 ,  H05K2201/1059 ,  Y10S439/931

Abstract: A right angle electrical connector (10, 66, 70) that uses straight contacts (22, 82, 98), rather than contacts bent at a right angle. A flat insulative plate (30, 115) extends rearwardly from a tall portion of the connector body device (12, 77, 91) that is mounted over a printed circuit board (14, 110, 110'). Pegs (40, 120) formed on the bottom of the plate are mounted over a printed circuit board (38, 124, 126) in the printed circuit board. Conductive traces (44, 46, 43, 50, 128, 134) extend from contact passages in the connector body to the flat plate and pegs to provide electrical connections between contacts mounted in the passages and the printed circuit board.

Abstract translation: 直角电连接器（10,66,70）使用直触头（22,82,98），而不是以直角弯曲的触头。 扁平绝缘板（30,115）从安装在印刷电路板（14,110,110'）上的连接器本体装置（12,77,91）的高部向后延伸。 形成在印版底部上的销钉（40,120）安装在印刷电路板中的印刷电路板（38,124,126）上。 导电迹线（44,46,43,50,128,134）从连接器本体中的接触通道延伸到平板和栓钉，以提供安装在通道中的触头与印刷电路板之间的电连接。

公开(公告)号：EP1106040B1

公开(公告)日：2002-03-27

申请号：EP99934550.7

申请日：1999-07-01

Applicant: Siemens S.A.

Inventor： BOONE, Luc ,  DE STEUR, Hubert ,  HEERMAN, Marcel ,  VAN PUYMBROECK, Jozef

IPC: H05K3/40 ,  H01L21/48 ,  H01L23/13

CPC classification number: H01L21/4846 ,  B29L2031/3493 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K3/027 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09154 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (O) and the bottom part (U) of the substrate (S1).

Abstract translation: 本发明涉及一种用于制造具有顶部和具有检查交叉连接的衬底和互连的底部部分之间的交叉连接的导电互连。 基板（S1）给出在至少一个前表面和/或在一个凹部的至少一个内壁的区域的区域的倾斜，屋顶形或凸形轮廓（K1）。 金属化的衬底（S1）后，印刷电路板的导体形交叉连接（Q）在上述轮廓（K1）的同时在顶部部分印刷电路板的导体（L）的激光结构化的区域中产生的（0 ）和底部部分（基板U）（S1）。

公开(公告)号：EP1129511A1

公开(公告)日：2001-09-05

申请号：EP99960853.2

申请日：1999-11-02

Applicant: Tyco Electronics Logistics AG

Inventor： LEEMAN, Reginald ,  HOUTTEMAN, Bernard ,  EMBO, Georges ,  ACKE, Edgard

IPC: H01R13/646 ,  H01R12/16 ,  H05K3/34

CPC classification number: H01R24/50 ,  H01R9/0515 ,  H01R12/707 ,  H01R24/38 ,  H01R2103/00 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: The invention relates to an electric component for printed boards, especially an HF coaxial connector. According to the invention, the housing (1) of the component is fixed on the printed board (7) by way of solder joints between the SMD soldered connections provided on the bottom part (6) of said housing and respective soldered connections on the printed circuit. Said housing (1) has several solderable bolts (11) on its bottom part (6) for additionally fixing the housing to the printed circuit board (7). Said bolts engage with the continuous contacting bolt holes (12) assigned to them on the circuit board (7) and are soldered in said bolts.

公开(公告)号：EP1106040A1

公开(公告)日：2001-06-13

申请号：EP99934550.7

申请日：1999-07-01

Applicant: Siemens S.A.

Inventor： BOONE, Luc ,  DE STEUR, Hubert ,  HEERMAN, Marcel ,  VAN PUYMBROECK, Jozef

IPC: H05K3/40 ,  H01L21/48 ,  H01L23/13

CPC classification number: H01L21/4846 ,  B29L2031/3493 ,  H01L23/13 ,  H01L23/49811 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/29007 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01057 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/0284 ,  H05K3/027 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09154 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: The invention relates to a method for producing interconnections with electrically conductive cross connections between the top and the bottom part of a substrate and interconnections having such cross connections. The substrate (S1) is given a slanted, roof-shaped or convex contour (K1) in the area of at least one front face and/or in the area of at least one inner wall of a recess. After metallizing the substrate (S1), printed-board conductor-shaped cross connections (Q) are produced in the area of the above-mentioned contours (K1) simultaneously with laser structuring of printed board conductors (L) on the top part (O) and the bottom part (U) of the substrate (S1).

公开(公告)号：EP0896787B1

公开(公告)日：2000-07-19

申请号：EP97918270.6

申请日：1997-05-01

Applicant: Ford Motor Company ,  FORD MOTOR COMPANY LIMITED

Inventor： TODD, Michael, George ,  SINKUNAS, Peter, Joseph ,  GLOVATSKY, Andrew, Zachary

IPC: H05K3/46 ,  H05K1/14

CPC classification number: H05K3/462 ,  H01L2924/1515 ,  H05K1/0284 ,  H05K1/119 ,  H05K1/144 ,  H05K3/368 ,  H05K3/4623 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2201/1059 ,  H05K2201/10666 ,  H05K2203/167 ,  Y10S438/977

Abstract: A three-dimensional multi-layer moulded electronic device and method for manufacturing same, wherein the device comprises at least two moulded, three-dimensional substrates (12, 14) having mating surfaces (20, 22), each substrate including a layer (16, 18) of patterned conductive material on at least one surface and electrically conductive vias (24, 26) at selected locations of the substrate for interconnection of the conductive layers (16, 18), wherein the substrates (20, 22) are electrically joined at their mating surfaces and the circuit layers (16, 18) are aligned and interconnected to form a multi-layer, three-dimensional circuit which may include moulded-in structural features.

公开(公告)号：EP0899821A3

公开(公告)日：2000-02-23

申请号：EP98115867.8

申请日：1998-08-22

Applicant: GRUNDIG Aktiengesellschaft

Inventor： Sölkner, Thomas ,  Lorenz, Werner ,  Ferger, Manfred ,  Höbel, Peter ,  Weidel, Günther

IPC: H01R13/03 ,  H01H1/40

CPC classification number: H05K3/326 ,  H01H1/403 ,  H01H2009/0077 ,  H01H2011/0081 ,  H01H2011/065 ,  H01H2229/014 ,  H01H2229/046 ,  H01R13/035 ,  H05K1/119 ,  H05K3/182 ,  H05K3/368 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/09045 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/10053 ,  H05K2201/10598

Abstract: Die Erfindung betrifft eine Bedeineinheit, einen elektrischen Steckerverbinder, einen elektrischen Taster, eine elekrtische Anschlußbuchseund ein Verfahren zur Metallisierung von Kunststoffoberflächen. Der elektrische Steckverbinder besteht aus 2 Verbindungselementen, wobei ein erstes Verbindungselement ein Trägerstück mit mindestens einem Kontaktelement aufweist. Zur Vereinfachung der Herstellung und zur Erleichterung der Wiederverwertung der eingesetzten Rohstoffe ist erfindungsgemäß vorgesehen, daß das Trägerstück und das Kontaktelement aus einem ersten thermoplastischen Kunststoff hergestellt sind, dessen Oberfläche zumindest abschnittsweise chemisch metallisierbar ist.