公开(公告)号：EP1954112A4

公开(公告)日：2009-09-23

申请号：EP06822580

申请日：2006-10-30

Applicant: SUMITOMO BAKELITE CO

Inventor： KONDO MASAYOSHI

IPC: H05K3/46

CPC classification number: H05K3/4673 ,  H05K3/386 ,  H05K3/4617 ,  H05K3/4626 ,  H05K3/4647 ,  H05K2201/09881 ,  H05K2203/0264 ,  H05K2203/066 ,  H05K2203/1189

公开(公告)号：EP2086300A1

公开(公告)日：2009-08-05

申请号：EP09156841.0

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo ,  Wang, Dongdong ,  Mori, Takahiro

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: A metal layer 18 is sandwiched between insulating layers 14 and 20 so that required strength is maintained. Hence it follows that the thickness of a core substrate 30 can be reduced and, therefore, the thickness of a multi-layer printed circuit board can be reduced. Formation of non-penetrating openings 22 which reach the metal layer 18 in the insulating layers 14 and 20 is simply required. Therefore, small non-penetrating openings 22 can easily be formed by applying laser beams. Thus, through holes 36 each having a small diameter can be formed.

Abstract translation: 金属层18被夹在绝缘层14之间和20，从而没必要的强度得以保持。 因此它遵循，芯的DASS模具厚度基片30可以减小，因此，多层印刷电路板的厚度可以减小。 非贯通孔22，其在绝缘层14和20到达金属层18的形成是简单地需要。 因此，小的非贯通孔22能够容易地通过施加激光束形成的。 因此，通过具有小直径的每个孔36可以被形成。

公开(公告)号：EP1903842A3

公开(公告)日：2009-05-06

申请号：EP08000185.2

申请日：1999-06-23

Applicant: IBIDEN CO., LTD.

Inventor： Nishiwaki, Yoko ,  Noda, Kouta

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4626 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/0094 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  Y10T29/49155

Abstract: A multilayer printed wiring board having a structure that outer conductor circuit patterns (5) are formed on a core substrate (1) having inner conductor circuit patterns (4) formed thereon through interlaminar resin insulating layers (2), and through-holes (9) are formed in the substrate for electrically connecting the inner conductor circuit patterns (4) to each other. A filler (10) is filled in the through-hole (9). The same kind of roughened layers (11) are formed on the inner conductor circuit pattern (4) on the substrate (1) over a full surface including a side surface thereof. The interlaminar resin insulating layer (2) formed covering the inner conductor circuit patterns (4) is flat. The outer conductor circuit pattern (5) is comprised of an electroless plated layer (12) formed on the interlaminar resin insulating layer (2) and an electrolytic plated layer (13) formed on the electroless plated layer (12).

Abstract translation: 一种多层印刷线路板，其具有这样的结构：在其上通过层间树脂绝缘层（2）形成内部导体电路图案（4）的核心基板（1）上形成外部导体电路图案（5） ）形成在基板中，用于将内部导体电路图案（4）彼此电连接。 填充物（10）填充在通孔（9）中。 在包括其侧表面的整个表面上，在基板（1）上的内部导体电路图案（4）上形成相同种类的粗糙层（11）。 形成为覆盖内部导体电路图案（4）的层间树脂绝缘层（2）是平坦的。 外导体电路图案（5）由形成在层间树脂绝缘层（2）上的非电镀层（12）和形成在非电镀层（12）上的电解电镀层（13）组成。

公开(公告)号：EP1720393A3

公开(公告)日：2009-03-25

申请号：EP06017888.6

申请日：1996-03-29

Applicant: IBIDEN CO., LTD.

Inventor： Yasue, Toshihiko ,  Hiramatsu, Yasuji ,  Yano, Hideki ,  Ishitani, Yoshifumi ,  Kawamura, Yoichiro ,  Murase, Hideki ,  Suzuki, Ayumi ,  Kawade, Masato

IPC: H05K3/46

CPC classification number: H05K3/4661 ,  H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: It is to provide a multilayer printed circuit board having excellent resolution, interlaminar insulation property and resistance to cool-heat shock without forming unevenness on the surface and lowering peel strength even if the thickness of the resin insulating layer is thin. The invention proposes a multilayer printed circuit board comprising a lower conductor circuit layer formed on a substrate, a resin insulating layer formed on the lower conductor circuit layer, an upper conductor circuit layer formed on the resin insulating layer, and a viahole formed in the resin insulating layer for electrically connecting the lower conductor circuit layer and the upper conductor circuit layer, wherein the resin insulating layer is comprised of a composite layer of thermosetting resin and thermoplastic resin.

公开(公告)号：EP1903842A2

公开(公告)日：2008-03-26

申请号：EP08000185.2

申请日：1999-06-23

Applicant: IBIDEN CO., LTD.

Inventor： Nishiwaki, Yoko ,  Noda, Kouta

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4626 ,  H05K3/0023 ,  H05K3/0082 ,  H05K3/0094 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4602 ,  H05K2201/0108 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/072 ,  H05K2203/1157 ,  Y10T29/49155

Abstract: A multilayer printed wiring board having a structure that outer conductor circuit patterns are formed on a core substrate having inner conductor circuit patterns formed thereon through interlaminar resin insulating layers, and through-holes are formed in the substrate for electrically connecting the inner conductor circuit patterns to each other. A filler is filled in the through-hole. The same kind of roughened layers are formed on the inner conductor circuit pattern on the substrate over a full surface including a side surface thereof. The interlaminar resin insulating layer formed covering the inner conductor circuit patterns is flat. The outer conductor circuit pattern is comprised of an electroless plated layer formed on the interlaminar resin insulating layer and an electrolytic plated layer formed on the electroless plated layer.

Abstract translation: 一种多层印刷线路板，其具有通过层间树脂绝缘层（2）形成有内导体电路图案（4）的芯基板（1）上形成外导体电路图案（5）的结构，以及通孔（9） ）形成在用于将内部导体电路图案（4）彼此电连接的基板中。 填充物（10）填充在通孔（9）中。 在基板（1）上的内部导体电路图案（4）上形成包括其侧表面的整个表面上的相同种类的粗糙层（11）。 形成为覆盖内部导体电路图案（4）的层间树脂绝缘层（2）是平坦的。 外导体电路图案（5）由形成在层间树脂绝缘层（2）上的无电镀层（12）和形成在化学镀层（12）上的电解镀层构成。

公开(公告)号：EP1481575A4

公开(公告)日：2007-11-28

申请号：EP03743491

申请日：2003-03-03

Applicant: PRINTAR LTD

Inventor： ZOHAR RON ,  MOZEL JACOB ,  VILK RAN

IPC: C08F2/48 ,  H05K3/00 ,  H05K3/28

CPC classification number: H05K3/0091 ,  H05K3/28 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/013 ,  H05K2203/081 ,  H05K2203/1509

Abstract: A method and apparatus for applying ink, according to a soldermask pattern, to a printed circuit board (360) having elevated pads defining pad edges, the method including flooding the printed circuit board (360) with ink such that the ink advances, without climbing onto the elevated pads.

公开(公告)号：EP1843650A3

公开(公告)日：2007-11-07

申请号：EP07013524.9

申请日：1999-07-30

Applicant: IBIDEN CO., LTD.

Inventor： Hirose, Naohiro ,  Noda, Kouta ,  Segawa, Hiroshi ,  En, Honjin ,  Tsukada, Kiyotaka ,  Ishida, Naoto ,  Asano, Kouji ,  Shouda, Atsushi

IPC: H05K3/46 ,  H05K3/38

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A multilayered printed circuit board comprising: a substrate (330) on which a conductive circuit (334) is formed; an interlayer insulating resin layer (350) formed on the conductive circuit (334); an opening (348) for forming a via hole (360) formed in the interlayer insulating resin layer (350); and another conductive circuit (358) including a via hole (360) and formed on the interlayer insulating resin layer (350), wherein
the surface of the conductive circuit (334) is subjected to a coarsening process using etching solution containing cupric complex and organic acid, and
stripe pits and projections are formed on the inner wall of the opening (348) for forming the via hole (360).

Abstract translation: 一种多层印刷电路板，包括：衬底（330），其上形成有导电电路（334）; 形成在导电电路（334）上的层间绝缘树脂层（350）; 用于形成层间绝缘树脂层（350）中形成的通路孔（360）的开口（348）; 以及形成在层间绝缘树脂层（350）上的包括通路孔（360）的另一导电电路（358），其中导电电路（334）的表面经受使用包含铜络合物和有机化合物的蚀刻溶液的粗化处理 酸，并且在用于形成通孔（360）的开口（348）的内壁上形成条纹凹凸。

公开(公告)号：EP1639869B1

公开(公告)日：2007-04-18

申请号：EP04729604.1

申请日：2004-04-27

Applicant: Korstens & Goossens GmbH

Inventor： GRÜTER, Ernst-Christoph

IPC: H05K1/02

CPC classification number: H05K1/0265 ,  H05K1/0203 ,  H05K1/183 ,  H05K2201/0919 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2201/10416

Abstract: The invention relates to a printed circuit board comprising at least one non conductive support plate (1) equipped with components and printed conductors for electrically contacting said components, at least one low-current circuit arrangement (2) for coupling or transmitting low current outputs and at least one high-current circuit arrangement (3) for coupling and/or transmitting high current outputs. Printed circuit boards of this type are known, but have the disadvantage of being inflexible or expensive to produce. To solve this problem, the inventive high-current circuit arrangement is only situated in one section of the printed circuit board and in order to house the printed conductors (4) and/or the contact block (5) of the high-current circuit arrangement (3), the support plate (1) comprises at least one component receptacle (6) in the form of a pocket-type recess or continuous cavity, in which the printed conductors (4) and/or the contact block (5) of the high-current circuit arrangement (3) are mounted.

公开(公告)号：EP1744609A2

公开(公告)日：2007-01-17

申请号：EP06123074.4

申请日：2000-05-25

Applicant: IBIDEN CO., LTD.

Inventor： Asai, Motoo Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Wang, Dongdong Ogaki-kita-kojou, Ibiden Co., Ltd. ,  Mori, Takahiro Ogaki-kita-kojou, Ibiden Co., Ltd.

IPC: H05K3/46

CPC classification number: H05K3/423 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K1/036 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/108 ,  H05K3/181 ,  H05K3/381 ,  H05K3/385 ,  H05K3/387 ,  H05K3/388 ,  H05K3/426 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09736 ,  H05K2201/09881 ,  H05K2203/0315 ,  H05K2203/0733 ,  H05K2203/0773 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599

Abstract: The present invention relates to a multi-layer printed circuit board comprising a core substrate having through holes; and an interlayer resin insulating layer built up on said core substrate, wherein said through holes are constituted by filling a first metal layer formed by electroplating, a metal film formed by electroless plating, sputtering or evaporation and a second metal layer formed by electroplating.

Abstract translation: 本发明涉及包括具有通孔的芯基板的多层印刷电路板; 以及在所述芯基板上形成的层间树脂绝缘层，其中所述通孔由填充由电镀形成的第一金属层，通过无电镀，溅射或蒸发形成的金属膜和通过电镀形成的第二金属层构成。

公开(公告)号：EP1731007A1

公开(公告)日：2006-12-13

申请号：EP05715333.0

申请日：2005-02-15

Applicant: SEFAR AG

Inventor： WAGNER, Paul-Heinz ,  HARTL, Thomas

IPC: H05K3/46 ,  H05K3/12

CPC classification number: H05K3/4664 ,  H05K1/095 ,  H05K3/1216 ,  H05K3/28 ,  H05K2201/09881

Abstract: The invention relates to a method for producing a multilayer printed circuit board that can be fitted with electronic components. Said method comprises the following steps: an electrically conductive pattern which corresponds to a printed conductor path (12, 16, 20), has a thickness of