公开(公告)号：EP0427265A2

公开(公告)日：1991-05-15

申请号：EP90121413.0

申请日：1990-11-08

申请人： IBIDEN CO., LTD.

发明人： Yazu, Hajime ,  Iriyama, Takao

IPC分类号： H01L23/36 ,  H01L23/13

CPC分类号： H01L23/49827 ,  H01L23/13 ,  H01L23/36 ,  H01L24/48 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12033 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/30107 ,  H01L2224/45099 ,  H01L2924/00

摘要： An electronic part mounting board (1) is provided compri­sing a substrate (10) having an electronic part mounting opening (13) formed in an upper surface thereof and a re­cess provided on a rear surface thereof and larger in size than the electronic part mounting opening; a heat radiating plate (2) fixed to the recess by means of a bond (3) with a position of an upper surface of the heat radiating plate (2) exposed to the electronic part mounting opening (13); an exposed depression (4) extending over the substrate and the heat radiating plate (2) at a position where a side wall (12) of the recess and a side wall (21) of the heat radiating plate (2) confront each other and having a part of the bond exposed flush with the bottom surface thereof; and a metal plating layer (75) continuously covering in se­quence a lower surface of the heat radiating plate (2), a surface of the exposed depression (4) and a rear surface of the substrate (10). Furthermore a method of manufacturing the aforesaid electronic part mounting board is provided.

摘要翻译： 的电子部件安装板（1）提供了一种包括具有在电子部件用基板（10）安装在尺寸在上表面上形成在开口（13）和设置在其后表面上的凹部和大于电子部件安装开口 ; 通过键（3）与所述散热板的上表面上的一个位置被固定到凹部中的散热板（2）（2）暴露于电子零件安装开口（13）; 上露出凹部（4）延伸过基板和散热板（2）的位置处，其中所述凹部的侧壁（12）和所述散热板的侧壁（21）（2）彼此面对并 具有暴露与其底表面齐平的键的一部分; 和金属镀层（75），按顺序连续地覆盖所述散热板的下表面（2），露出的凹部（4）和所述基板的后表面（10）的表面上。 进一步提供了前述的电子部件安装板的制造方法。

公开(公告)号：EP0218796B1

公开(公告)日：1990-10-31

申请号：EP86108770.8

申请日：1986-06-27

申请人： DAI-ICHI SEIKO CO. LTD.

发明人： Konishi, Akira ,  Wakano, Teruo

IPC分类号： H01L23/48 ,  H01L23/14 ,  H01L23/36

CPC分类号： H01L21/565 ,  H01L21/56 ,  H01L23/145 ,  H01L23/3736 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  Y10T29/49146 ,  Y10T29/49151 ,  H01L2924/00 ,  H01L2224/45099

公开(公告)号：EP0341246A4

公开(公告)日：1990-09-26

申请号：EP88900159

申请日：1987-10-01

申请人： OLIN CORPORATION

发明人： SINGHDEO, NARENDRA, N. ,  MAHULIKAR, DEEPAK ,  BUTT, SHELDON, H.

IPC分类号： B32B15/04 ,  A61F2/00 ,  A61F2/30 ,  A61F2/36 ,  C03C14/00 ,  H05K1/03 ,  B32B9/00 ,  B32B15/00 ,  C03C1/00 ,  C03C3/04 ,  C03C3/078 ,  C03C8/18

CPC分类号： A61F2/30965 ,  A61F2/367 ,  A61F2002/3631 ,  A61F2002/368 ,  A61F2002/3682 ,  A61F2310/00203 ,  C03C14/004 ,  C03C2214/04 ,  C03C2214/08 ,  H01L2224/16 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/3025 ,  H05K1/0306 ,  H01L2924/00

摘要： Engineering ceramic product formed of a ceramic-glass-metal composite being strong, durable, formable into complex shapes and having improved thermal conductivity. Metal elements can be embedded into the composite to enable simplified fabrication of devices such as a semiconductor packaging. Specifically, a semiconductor casing (22) comprises a base component (24) and lid component (28) both formed of a ceramic-glass-metal composite material (26) of this invention. The composite material comprises ceramic particles, a glassy phase for adhering the ceramic particles together, and metallic particles dispersed discontinuously throughout the composite. A metallic lead frame (30) is embedded into the base component (24). A sealing glass (32), such as a solder glass from the group consisting of borosilicate, soda-lime-silica, lead-silicate and lead-zinc-borate, bonds the base component (24) to the lid component (28).

公开(公告)号：EP0336359A2

公开(公告)日：1989-10-11

申请号：EP89105868.7

申请日：1989-04-04

申请人： HITACHI, LTD.

发明人： Tanaka, Akira ,  Yamada, Kazuji ,  Inoue, Hirokazu ,  Arakawa, Hideo ,  Okamoto, Masahide

IPC分类号： H01L23/04

CPC分类号： H01L23/12 ,  H01L23/057 ,  H01L23/467 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/451 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012

摘要： A cavity-down type package for a semiconductor device comprises an insulating base substrate (6) on which the semiconductor device (1) is mounted, and another insulat­ing cap substrate (8) with plural outer connection terminals (5) on its outer surface and with electrodes (11) provided on conductive layers (4) for electric conduc­tion on its inner surface. The electrodes on the insulating base substrate and those (11) on the insulating cap substrate (8) are connected with each other by means of conductive material such as bumps.

摘要翻译： 一种用于半导体器件的降空型封装，包括其上安装有半导体器件（1）的绝缘基底（6）和在其外表面上具有多个外连接端子（5）的另一绝缘帽衬底（8），以及 其中电极（11）设置在导电层（4）上，用于在其内表面上导电。 绝缘基底基板上的电极和绝缘帽基板（8）上的电极（11）通过诸如凸块的导电材料相互连接。

公开(公告)号：EP0183016B1

公开(公告)日：1989-09-20

申请号：EP85112553.4

申请日：1985-10-03

申请人： SUMITOMO ELECTRIC INDUSTRIES LIMITED

发明人： Itoh, Yoshiaki c/o Itami Works ,  Odani, Yusuke c/o Itami Works ,  Akechi, Kiyoaki c/o Itami Works ,  Kuroishi, Nobuhito c/o Itami Works

IPC分类号： C22C21/02 ,  C22C28/00 ,  H01L23/36

CPC分类号： H01L24/32 ,  C22C1/0416 ,  H01L23/3733 ,  H01L23/433 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32188 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/351 ,  Y10S165/905 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

公开(公告)号：EP0211618A3

公开(公告)日：1987-12-16

申请号：EP86305894

申请日：1986-07-31

申请人： HITACHI, LTD.

发明人： Tsuchiya, Masatoshi ,  Ogihara, Satoru ,  Kagohara, Hiromi ,  Otsuka, Kanji ,  Oishi, Tomoji

IPC分类号： H01L23/04 ,  H01L23/14 ,  H01L23/10

CPC分类号： H01L23/057 ,  H01L23/10 ,  H01L23/15 ,  H01L23/49579 ,  H01L24/48 ,  H01L25/0655 ,  H01L2224/16145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12036 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  Y10S428/901 ,  H01L2924/00 ,  H01L2224/45099

摘要： An integrated circuit package has a semiconductor element (1) mounted on an insulating substrate (4) which has a coefficient of thermal expansion from 35 to 40 x 10 -7 /°C and a high thermal conductivity, preferably a sintered product of silicon carbide. The substrate (4), and the element (1) are covered by a cap (5) which has a coefficient of thermal expansion of 20 to 55 x 10 -7 /°C and an airtight seal is provided by sealing glass (6) which has a coefficient of thermal expansion from 30 to 55 x 10 -7 /°C. Leads (3) extend through the glass (6) and are connected to the substrate (1) via wires (2). The leads have a coefficient of thermal expansion less than 40 x 10- 7 / °C, e.g. an alloy of iron containing nickel and cobalt. In this way the coefficient of thermal expansion of the leads (3) is set approximately equal to, or less than the coefficient of thermal expansion of the substrate (4), and this prevents cracking of the glass (6) when the package cools from the glass sealing temperature, or when the package is tested by thermal cycles.

公开(公告)号：EP0238651A1

公开(公告)日：1987-09-30

申请号：EP86906528.0

申请日：1986-09-29

申请人： UNISYS CORPORATION

发明人： NELSON, John, Arnold ,  ROBINSON, Dale, Lynn

IPC分类号： H01L23 ,  H01L25

CPC分类号： H01L23/10 ,  H01L23/04 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A magnetically sealed integrated circuit package includes a substrate having a cavity for holding multiple integrated circuit die, a lid for covering the cavity to protect the die, a ferromagnetic seal ring which is fixed to the substrate around the die, and a magnet which is fixed to the lid and coincides in shape to the seal ring for magnetically attracting the seal ring to hold the lid in place when the lid covers the cavity.

公开(公告)号：EP0197148A1

公开(公告)日：1986-10-15

申请号：EP84904181.9

申请日：1984-11-27

申请人： IBIDEN CO, LTD.

发明人： MABUCHI, Katsumi ,  KOMURA, Toshimi

IPC分类号： H05K1/18 ,  H01L23/40 ,  H01L21/58

CPC分类号： H05K1/0204 ,  H01L23/13 ,  H01L23/36 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/181 ,  H05K1/021 ,  H05K1/182 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2201/10416 ,  H05K2203/049 ,  Y10S428/901 ,  Y10T156/1052 ,  Y10T156/1064 ,  Y10T428/239 ,  Y10T428/24331 ,  Y10T428/24917 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A printed-circuit board containing a plastic material is formed with an opening for mounting an electronic element, the opening extending through the board in the vertical direction. The opening thereof on the reverse side of the board is closed by a metal plate whose periphery is bonded to the board surface by a bonding layer. A deposited film is formed integrally over the inner wall and the bottom surface of the opening in the board, and a deposited film is formed integrally over the reverse surface of the board and the reverse surface of the metal plate. It is therefore possible to dissipate through the metal plate the heat generated from the electronic element mounted on the bottom surface in the opening. In addition, it is possible to prevent by the deposited films the intrusion of moisture which conventionally enters the opening in the board through the plastic material and the bonding layer.

公开(公告)号：EP0188838A1

公开(公告)日：1986-07-30

申请号：EP85202039.5

申请日：1985-12-10

申请人： LABORATOIRES D'ELECTRONIQUE ET DE PHYSIQUE APPLIQUEE L.E.P. ,  Philips Electronics N.V.

发明人： Monnier, Michel, Jean-Claude

IPC分类号： H01L23/04 ,  H01L23/48

CPC分类号： H01L23/5384 ,  H01L23/057 ,  H01L23/4828 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01021 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/3025 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： L'invention concerne un boîtier pour composant électronique, incluant un substrat 120 en céramique sur lequel est déposé un circuit à couches multiples 110 réalisé par sérigraphie et destiné à assurer la liaison entre les bornes 7 du composant électronique et les broches 2 de fixation du boîtier logées dans des trous métallisés munis de couronnes conductrices (11 et 12) réalisés par sérigraphie, caractérisé en ce que les couches conductrices sont constituées par un composé sérigraphiable formé au moins de cuivre et d'un matériau vitrocristallin, à cuire en atmosphère neutre à une température inférieure à la température de fusion du cuivre, en ce que les couches isolantes sont constituées par un composé sérigraphiable vitrocristallin à cuire en atmosphère neutre à une température compatible avec les couches conductrices, ce composé isolant présentant un coefficient de dilatation adapté à celui du substrat jusqu'à sa température de cuisson, en ce que la dernière couche du circuit est une couche protectrice isolante vi- trocristaillne, en ce que les broches présentent la forme d'une tige munie d'une tête plate, la tête plate prenant appui sur la couronne située sur l'une des faces du substrat, en ce que les broches sont fixées à l'aide d'un alliage métallique compatible avec la métallisation des trous et des couronnes conductrices, dont la température de fusion est inférieure à, ou de l'ordre de, la température de cuisson des couches du circuit, en ce que, le composant électronique étant placé sur le substrat, les bornes de ce composant sont reliées par des fils souples aux extrémités des conducteurs laissées libres lors de l'élaboration du circuit multicouches, et en ce que le composant électronique est protégé par un capot.
Application: Boîtiers pour circuits intégrés à très grand nombre de broches.

公开(公告)号：EP0123692A4

公开(公告)日：1985-07-30

申请号：EP83903634

申请日：1983-09-29

申请人： MAYO FOUNDATION

发明人： GILBERT BARRY K ,  SCHWAB DANIEL J

IPC分类号： H01L23/12 ,  H01L23/02 ,  H01L23/057 ,  H01L23/498 ,  H01L23/66 ,  H05K1/02 ,  H05K3/34 ,  H05K1/11 ,  H05K1/14

CPC分类号： H01L23/49805 ,  H01L23/057 ,  H01L23/49822 ,  H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12033 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H05K1/0237 ,  H05K3/3442 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A carrier apparatus (40) for mounting logic components on the surface of a circuit board (41). The carrier apparatus (40) includes a housing structure defining top and bottom surfaces and further defining a cavity (50) in the bottom surface for receipt of a logic component (51). A recessed cover portion (56) is attached to the housing so as to enclose the cavity (50) thereby effectively sealing the logic component (51) in the housing. The carrier apparatus (40) includes means for mounting the housing on a circuit board such that the cover (56) does not make contact with the surface of the circuit board (41). The housing further includes means for electrically interconnecting the logic component (51) to the circuit board (41). In yet another embodiment, a carrier apparatus (100) for mounting logic components on the surface of a circuit board (41) is disclosed which utilize ground and voltage planes together with alternating signal (118) and AC ground (121) traces so as to effectuate coplanar/strip-line and coplanar/microstrip transmission line environments along portions of the signal traces (118). Consequently, this results in signal lines having a controlled impedance environment and minimized crosstalk between neighboring signal leads lying in the same plane.