公开(公告)号：EP1812955A4

公开(公告)日：2009-01-07

申请号：EP05816032

申请日：2005-10-20

Applicant: HARRIS CORP

Inventor： SMITH C W SINJIN ,  JAYNES PAUL B ,  NEWTON CHARLES M

IPC: H01K3/22

CPC classification number: H05K3/0014 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0323 ,  H05K2201/09018 ,  H05K2201/091 ,  H05K2203/1105 ,  H05K2203/302 ,  Y10S156/924 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T156/1189 ,  Y10T428/10 ,  Y10T428/1005

Abstract: A method and apparatus relating to a multi­functional, structural circuit, referred to as a structural circuit, are disclosed. The method can include thermoforming a liquid crystal polymer (LCP) circuit with a structural element (215). At least one circuit component can be attached to the surface of the LCP circuit (220).

公开(公告)号：EP1927118A2

公开(公告)日：2008-06-04

申请号：EP06815217.2

申请日：2006-09-22

Applicant: Radial Electronics, Inc.

Inventor： QUILICI, James E.

IPC: H01F27/28

CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F27/027 ,  H01F41/02 ,  H01F41/0206 ,  H01F41/041 ,  H01F41/042 ,  H01F41/064 ,  H01F2027/2814 ,  H05K1/0284 ,  H05K1/144 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/20 ,  H05K3/4611 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2203/0139 ,  H05K2203/0143 ,  H05K2203/0292 ,  Y10T29/4902 ,  Y10T29/49073 ,  Y10T29/49075 ,  Y10T156/10

Abstract: Disclosed is an apparatus and method for a magnetic component. The magnetic component 400 includes a substrate 402 having a feature 406 and a first conductive pattern 408 disposed on the feature. The magnetic component also includes a permeability material disposed within the feature. A substrate material 416 is disposed on the substrate to facilitate substantial enclosure of the permeability material between the substrate and the substrate material 410, where the substrate material has a second conductive pattern 414. The first conductive pattern and the second conductive pattern cooperate to be capable of facilitating magnetic properties of the permeabilit material.

公开(公告)号：EP1789840A2

公开(公告)日：2007-05-30

申请号：EP05781615.9

申请日：2005-08-01

Applicant: Harris Corporation

Inventor： SMITH, C.W. Sinjin ,  NEWTON, Charles M. ,  JAYNES, Paul B.

IPC: G02F1/1339

CPC classification number: H05K3/281 ,  B30B5/02 ,  B30B15/34 ,  B32B37/10 ,  B32B37/1009 ,  B32B37/185 ,  B32B2305/34 ,  B32B2305/55 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0141 ,  H05K2203/065 ,  H05K2203/068 ,  H05K2203/1311

Abstract: A method and apparatus is disclosed for affixing a cover layer (18) formed of liquid crystal polymer to a flex circuit (20) consisting of circuit elements (54) mounted to a liquid crystal polymer substrate (52) in order to encapsulate the circuit elements between the cover layer and substrate to protect them from exposure to moisture and contaminants.

公开(公告)号：EP1393896A4

公开(公告)日：2007-01-10

申请号：EP02717134

申请日：2002-04-12

Applicant: TOYO KOHAN CO LTD

Inventor： SAIJO KINJI ,  YOSHIDA KAZUO ,  OKAMOTO HIROAKI ,  OHSAWA SHINJI

IPC: B32B27/16 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  B32B27/00

CPC classification number: B32B15/08 ,  B32B27/16 ,  B32B27/281 ,  B32B38/0008 ,  B32B2037/0092 ,  B32B2305/55 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/0058 ,  H05K3/381 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/065 ,  H05K2203/097 ,  Y10T428/31504

Abstract: A laminated plate formed of a base material and a high molecular plate laminated with each other without using adhesive agent and a part using the laminated plate, wherein the laminated plate is formed by laminatedly sticking the base plate to the high molecular plate after applying an activating treatment onto the opposed surfaces of the base plate and the high molecular plate, and the part is formed by using the laminated plate.

公开(公告)号：EP1734068A1

公开(公告)日：2006-12-20

申请号：EP05719312.0

申请日：2005-02-18

Applicant: POLYMATECH CO., LTD.

Inventor： TOBITA, Masayuki POLYMATECH CO., LTD. R & D Centr. ,  KIMURA, Toru POLYMATECH CO., LTD. R & D CENTR. ,  AOKI, Hisashi POLYMATECH CO., LTD. R & D CENTR. ,  SHIMOYAMA, Naoyuki POLYMATECH CO., LTD. R & Dcentr ,  ISHIGAKI, Tsukasa POLYMATECH CO., LTD. R & D centr ,  OCHI, Mitsukazu ,  HARADA, Miyuki

IPC: C08J5/24 ,  B32B15/08 ,  C08K7/02 ,  C08L63/00 ,  H05K1/03 ,  H05K3/00 ,  C08L101/00

CPC classification number: C08G59/28 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/40 ,  B32B2274/00 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  C08G59/5033 ,  C08J5/24 ,  C08J2363/00 ,  C08K7/02 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0287 ,  H05K2201/029 ,  H05K2201/068 ,  Y10T428/249924 ,  C08L63/00

Abstract: A thermoplastic polymer composite formed article or a thermoplastic polymer composite formed article formed from a thermoplastic polymer or a thermoplastic polymer and a fiber, wherein the fiber is arranged along a first plane and the molecular chains of the thermoplastic polymer or thermoplastic polymer is oriented in the direction intersecting with the first plane, and the molecular chains of the thermoplastic polymer or thermoplastic polymer has a degree (α) of orientation in a range of 0. 5 or more and less than 1.0, and wherein the thermal expansion coefficients of said formed article in the direction along the first plane and in the direction intersecting with the first plane are both 5 × 10 -6 to 50 × 10 -6 (/K), and the difference between the thermal expansion coefficient in the direction along the first plane and the thermal expansion coefficient in the direction intersecting with the first plane is 30 × 10 -6 (/K) or less.

Abstract translation: 一种热塑性聚合物复合成型制品或由热塑性聚合物或热塑性聚合物和纤维形成的热塑性聚合物复合成型制品，其中纤维沿着第一平面布置，热塑性聚合物或热塑性聚合物的分子链定向在 方向与第一平面交叉，并且热塑性聚合物或热塑性聚合物的分子链具有在0.5以上且小于1.0的范围内的取向度（±）），并且其中所述成形制品的热膨胀系数 沿着第一平面的方向和与第一平面相交的方向分别为5×10 -6至50×10 -6（/ K），沿着第一平面的方向上的热膨胀系数与 与第一平面交叉的方向的热膨胀系数为30×10 -6（/ K）以下。

公开(公告)号：EP0949067B1

公开(公告)日：2006-06-21

申请号：EP99106126.8

申请日：1999-04-06

Applicant: KURARAY CO., LTD.

Inventor： Tanaka, Yoshinobu ,  Tsudaka, Takeichi ,  Onodera, Minoru ,  Sato, Toshiaki

IPC: B32B37/00 ,  B32B15/08

CPC classification number: B32B15/08 ,  B32B38/10 ,  B32B2305/55 ,  B32B2309/02 ,  B32B2457/08 ,  H05K3/022 ,  H05K3/462 ,  H05K3/4635 ,  H05K2201/0141 ,  H05K2201/0358 ,  H05K2201/068 ,  H05K2203/0264 ,  H05K2203/1536 ,  Y10T156/1059 ,  Y10T156/1911 ,  Y10T428/10 ,  Y10T428/1005 ,  Y10T428/1086 ,  Y10T428/31681

公开(公告)号：EP1527121B1

公开(公告)日：2006-06-07

申请号：EP03771815.2

申请日：2003-07-23

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： SAMUELS, Michael, Robert ,  MOLITOR, Michael, Joseph

IPC: C08G69/44 ,  C09K19/00 ,  C09K19/38 ,  C09K19/52 ,  H01B3/30 ,  H05K1/03 ,  C08J5/08 ,  C08K3/36 ,  C08L77/12

CPC classification number: C09K19/52 ,  C09K19/00 ,  C09K19/38 ,  C09K19/542 ,  H01B3/305 ,  H01B3/445 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0224 ,  H05K2201/0254

Abstract: Disclosed are liquid crystalline polymer compositions, which are melt moldable, and which contain a perfluorinated polymer, and a particulate aramid, and optionally contain hollow glass or quartz spheres, and which usually have low dielectric constants. They are particularly useful as electrical connectors and substrates for other electronic applications which use high frequency signals.

公开(公告)号：EP1582340A1

公开(公告)日：2005-10-05

申请号：EP03782886.0

申请日：2003-12-25

Applicant: TORAY INDUSTRIES, INC.

Inventor： HIGASHIOJI, Takuji ,  TSUNEKAWA, Tetsuya ,  MACHIDA, Tetsuya ,  NAKAMORI, Yukari

IPC: B32B5/18 ,  B32B27/08

CPC classification number: B32B27/08 ,  B29C33/68 ,  B29C55/023 ,  B29C55/12 ,  B29K2995/0037 ,  B32B3/12 ,  B32B27/06 ,  B32B27/36 ,  B32B2307/518 ,  B32B2307/704 ,  B32B2307/736 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/0141 ,  Y10T428/24975

Abstract: A laminated film which is excellent in thermal dimensional stability, cushion properties and low dielectric characteristics is disclosed. The laminated film comprises at least two layers among which at least one layer is a biaxially oriented film composed of a thermoplastic resin composition and at least one other layer is a film having a network structure.

公开(公告)号：EP1420928B1

公开(公告)日：2005-07-20

申请号：EP02763567.1

申请日：2002-08-29

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： SAMUELS, Michael, R.

IPC: B29B13/10 ,  B02C19/12

CPC classification number: B32B27/12 ,  B29B13/10 ,  B32B15/04 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: Thermotropic liquid crystalline polymers are readily ground to smaller particle sizes by using a two or more stage grinding process. The particles produced usually are relatively short, but still, fibers. The ground LCP is useful for rotational molding, powder coating, and forming nonwoven structures.

公开(公告)号：EP1303575B1

公开(公告)日：2005-05-25

申请号：EP00990184.4

申请日：2000-11-16

Applicant: 3M Innovative Properties Company

Inventor： YANG, Rui ,  MAO, Guoping

IPC: C09K13/02 ,  H05K1/00 ,  H05K3/00

CPC classification number: C09K13/02 ,  C08J7/12 ,  H05K3/002 ,  H05K2201/0141 ,  H05K2201/0397 ,  H05K2203/0786 ,  Y10T428/249953 ,  Y10T428/249958 ,  Y10T428/249975 ,  Y10T428/249979

Abstract: A flexible circuit comprising a liquid crystal polymer film having through-holes and related shaped voids formed therein using an etchant composition comprising a solution in water of from 35 wt. % to 55 wt. % of an alkali metal salt; and from 10 wt. % to 35 wt. % of a solubilizer dissolved in the solution to provide the etchant composition suitable for etching the liquid crystal polymer at a temperature from 50 °C to 120 °C.