公开(公告)号：EP1248503A4

公开(公告)日：2006-08-09

申请号：EP00987672

申请日：2000-12-21

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  OHSAWA SHINJI ,  OKAMOTO HIROAKI ,  YOSHIDA KAZUO

IPC分类号： H05K1/02 ,  H05K3/06 ,  H05K3/46

CPC分类号： H05K1/0221 ,  H05K3/062 ,  H05K3/4647 ,  H05K2201/0361 ,  H05K2201/09254 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49156

摘要： A structure of a multilayer printed wiring board having a wiring lead-out port can be easily formed. A large number of products can be easily manufactured with good size reproducibility. A method of manufacturing the same is also are disclosed. The multilayer printed wiring board is characterized by having a signal circuit conductor perfectly covered by an earth circuit in its inside and a wiring lead-out port. A signal circuit conductor having a branch pattern is preferable. The multilayer printed wiring board is manufactured by selectively etching the copper of a cladding sheet manufactured by bonding a copper foil to a nickel foil with 0.1 - 3% draft and forming a signal circuit conductor perfectly covered by an earth circuit and the wiring lead-out port.

公开(公告)号：EP1393896A4

公开(公告)日：2007-01-10

申请号：EP02717134

申请日：2002-04-12

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  YOSHIDA KAZUO ,  OKAMOTO HIROAKI ,  OHSAWA SHINJI

IPC分类号： B32B27/16 ,  H05K3/00 ,  H05K3/38 ,  H05K3/46 ,  B32B27/00

CPC分类号： B32B15/08 ,  B32B27/16 ,  B32B27/281 ,  B32B38/0008 ,  B32B2037/0092 ,  B32B2305/55 ,  B32B2379/08 ,  B32B2457/08 ,  H05K3/0058 ,  H05K3/381 ,  H05K3/4652 ,  H05K3/4655 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2203/065 ,  H05K2203/097 ,  Y10T428/31504

摘要： A laminated plate formed of a base material and a high molecular plate laminated with each other without using adhesive agent and a part using the laminated plate, wherein the laminated plate is formed by laminatedly sticking the base plate to the high molecular plate after applying an activating treatment onto the opposed surfaces of the base plate and the high molecular plate, and the part is formed by using the laminated plate.

公开(公告)号：EP1193755A4

公开(公告)日：2007-07-11

申请号：EP00937200

申请日：2000-06-09

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  YOSHIDA KAZUO ,  OKAMOTO HIROAKI ,  OHSAWA SHINJI

IPC分类号： H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H05K3/06 ,  H05K3/28 ,  H05K3/40 ,  H01L23/12 ,  B23K20/00

CPC分类号： H01L23/3114 ,  H01L23/3107 ,  H01L23/49582 ,  H01L23/49861 ,  H01L2224/16 ,  H01L2924/07811 ,  H05K3/062 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10378 ,  H05K2203/0384 ,  H05K2203/1572 ,  Y10T29/30 ,  Y10T29/301 ,  Y10T29/302 ,  Y10T29/49002 ,  Y10T428/1291 ,  H01L2924/00

摘要： A clad plate for forming an interposer for a semiconductor device which can be manufactured at low cost and has good characteristics, an interposer for a semiconductor device, and a method of manufacturing them. Copper foil materials (19, 24, 33) forming conductive layers (10, 17, 18) and nickel plating (20, 21) forming etching stopper layers (11, 12) are formed and pressed to form a clad plate (34) for forming an interposer for a semiconductor device. Thus, a clad plate (34) for forming an interposer for a semiconductor device is manufactured. The clad plate (34) is selectively etched to form a columnar conductor (17), and an insulating layer (13) is formed on the copper foil material forming a wiring layer (10). A bump (18) for connection of a semiconductor chip and the wiring layer (10) are formed on the opposite side to the side on which the columnar conductor (17) is formed. Thus, an interposer for a semiconductor device is manufactured.

公开(公告)号：EP1342564A4

公开(公告)日：2010-03-03

申请号：EP01972690

申请日：2001-10-04

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  YOSHIDA KAZUO ,  OKAMOTO HIROAKI ,  OHSAWA SHINJI

IPC分类号： B23K20/00 ,  B23K20/04 ,  B23K20/14 ,  B32B15/01 ,  H05K3/02 ,  H05K3/06 ,  B23K20/16 ,  H05K1/03 ,  H05K3/46

CPC分类号： H05K3/025 ,  B23K20/04 ,  B32B15/01 ,  H05K3/062 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2203/0384 ,  H05K2203/068 ,  Y10T428/12 ,  Y10T428/12438 ,  Y10T428/12896 ,  Y10T428/12979

公开(公告)号：EP1255295A4

公开(公告)日：2005-03-02

申请号：EP00985900

申请日：2000-12-26

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  OHSAWA SHINJI ,  OKAMOTO HIROAKI ,  YOSHIDA KAZUO

IPC分类号： H01L21/3213 ,  H01L21/28 ,  H01L21/3205 ,  H01L21/60 ,  H01L21/768 ,  H01L23/52 ,  H01L23/31 ,  H01L23/485

CPC分类号： H01L21/76838 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/13099 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155

摘要： A means for highly precisely and economically fabricating wiring on a semiconductor and highly precisely and economically forming a bump on an electrodes. (1) A semiconductor device comprising a semiconductor, a metal foil for fabricating wiring, and conductor wiring on the semiconductor; and a method of fabricating a conductor wiring circuit on a semiconductor, comprising the steps of laying a metal foil for fabricating wiring on the electrode-forming side of the semiconductor, forming a resist wiring pattern by photo-etching the metal foil, etching the metal foil, and removing the resist to form the wiring. (2) A semiconductor device which comprises a multilayer metal foil for fabricating wiring in place of the metal foil for forming wiring of the semiconductor device described in (1); and a method of fabricating conductor wiring having a bump on a semiconductor, comprising the steps of the method described in (1) and further comprising the steps of forming a resist pattern for forming the bump by photo-etching the multilayer metal foil for forming the wiring, forming a bump by selective etching, and removing an etch-stop layer.

摘要翻译： 了一种用于在半导体高精度且经济的制造布线和高精度且上电极经济形成凸块。 （1）一种半导体器件，包括半导体，在半导体的制造布线和导体布线的金属箔，并且在半导体制造导体布线电路，包括铺设的金属箔用于电极上制造布线的步骤的方法 - 形成的半导体的侧上形成一个通过光蚀刻所述金属箔，蚀刻所述金属箔，和除去抗蚀剂以形成布线抗蚀剂布线图案。 （2）一种半导体装置，它包括一个多层金属箔代替金属箔的用于形成（1）中描述的半导体器件的布线的制造布线; 以及制造导体布线具有在半导体凸块，其包括在所描述的方法的步骤的方法，（1）并且还包括用于形成由所述凸块形成的抗蚀剂图案的步骤光蚀刻的多层金属薄板形成 布线，形成通过选择性蚀刻的凸块，以及除去蚀刻停止层。

公开(公告)号：EP1090891A4

公开(公告)日：2004-07-21

申请号：EP99919551

申请日：1999-05-13

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  OHSAWA SHINJI ,  YOSHIDA KAZUO

IPC分类号： B32B15/04 ,  B32B38/00 ,  C04B37/02 ,  H05K3/38 ,  B23K20/00 ,  B23K20/02 ,  B23K20/233 ,  B32B31/20 ,  B32B31/22 ,  C23F4/00 ,  H05K3/00

CPC分类号： B32B38/0036 ,  B32B15/04 ,  B32B2309/02 ,  B32B2309/12 ,  B32B2311/00 ,  B32B2315/02 ,  C04B37/021 ,  C04B2237/40 ,  H05K3/38 ,  Y10S428/94

摘要： A method of manufacturing a high-quality metal foil/ceramics joining material (19) and a metal foil laminated ceramic substrate (20) which can prevent a damage to a ceramic material and enhance the productivity of the metal foil/ceramics joining material and the metal foil laminated ceramic substrate, wherein a ceramic material (13) is heated before a metal foil (11) and the ceramic material (13), both ion-etched, are pressure-joined to ensure an easy and positive subsequent pressure-joining and the ceramic material (13) can be prevented from being broken because the ceramic material (13) is heated while being placed on a holder (14) and is pressure-joined under a pressure of 1 kg/cm or lower.

摘要翻译： 制造高品质的金属箔/陶瓷接合材料（19）和金属箔层压陶瓷基板（20），它可以防止对陶瓷材料的损坏和提高金属箔的生产率的方法/陶瓷接合材料和所述 蚀刻金属箔，被压接于确保容易且正随后的加压接合和陶瓷材料（13）可以从，因为陶瓷材料（13），而在保持器（14）被置于加热的破损防止和 1公斤/毫米<2>或更低的压力下被压接。

公开(公告)号：EP1830611A4

公开(公告)日：2009-06-24

申请号：EP05807092

申请日：2005-11-18

申请人： MULTI INC ,  TOYO KOHAN CO LTD

发明人： WATANABE MITSUHIRO ,  SAIJO KINJI ,  OHSAWA SHINJI ,  YOSHIDA KAZUO ,  NANBU KOJI

IPC分类号： H05K1/02 ,  H05K1/09 ,  H05K3/06 ,  H05K3/38 ,  H05K3/46

CPC分类号： H05K3/427 ,  H05K1/0265 ,  H05K1/116 ,  H05K3/062 ,  H05K3/20 ,  H05K3/4658 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/09736 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/1476 ,  Y10T156/10

摘要： A printed wiring board which can equalize as much as possible the circuit widths of a signal transmission circuit and a power supplying circuit or the like that have required designs of circuit widths to be different significantly and which can be substantially downsized, and a production method therefor, wherein the printed wiring board can be obtained by etching a metal clad laminate plate containing a conductive layer and an insulation layer, and the printed wiring board, where a first circuit and a second circuit formed on the same reference flat surface and being different in thickness coexist, is used. The printed wiring board is characterized in that the first circuit or the second circuit, whichever is thicker, has a clad form where three layers, a first copper layer/a metal-of-different-kind layer/a second copper layer, are sequentially laminated one upon another. The production method for the printed wiring board is characterized by using as a starting material a clad composite material in which three layers, a first copper layer/a metal-of-different-kind layer/a second copper layer, are sequentially laminated one upon another, and by effectively using etching characteristics selecting between the metal-of-different-kind layer and a copper layer.

公开(公告)号：EP1433521A4

公开(公告)日：2006-04-12

申请号：EP01972491

申请日：2001-09-26

申请人： TOYO KOHAN CO LTD ,  TOKYO GAS CO LTD

发明人： SAIJO KINJI ,  OHSAWA SHINJI ,  OKAMOTO HIROAKI ,  YOSHIDA KAZUO ,  SEKI TSUTOMU

IPC分类号： B01D53/22 ,  B01D63/08 ,  B01D69/10 ,  B01D69/12 ,  B01D71/02 ,  C01B3/50

CPC分类号： C01B3/505 ,  B01D53/22 ,  B01D53/228 ,  B01D63/081 ,  B01D67/0072 ,  B01D69/10 ,  B01D71/022 ,  B01D2313/025 ,  B01D2325/04 ,  B01D2325/08 ,  C01B2203/0405 ,  Y10S55/05

摘要： A method for manufacturing a gas separating unit which comprises laminating a metal plate on a material capable separating a hydrogen gas (palladium alloy fo il) by cladding, etching selectively a central portion of a cut clad plate (K) using an etching solution, to thereby expose an underlying palladium alloy foil layer, and providing a metal supporting plate on the other side of the palladium alloy f oil layer. The method allows the manufacture of a gas separating unit having an enhanced effective area of a material capable of separating a hydrogen gas and is excellent in the handlability of a material capable of separating a hydrogen gas during manufacturing.

公开(公告)号：EP1111975A4

公开(公告)日：2005-10-26

申请号：EP99931469

申请日：1999-07-22

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  YOSHIDA KAZUO ,  OHSAWA SHINJI

IPC分类号： H05K3/06 ,  H05K3/20 ,  H05K3/44 ,  H05K3/46

CPC分类号： H05K3/062 ,  H05K3/20 ,  H05K3/44 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10S428/901 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/12931 ,  Y10T428/12944 ,  Y10T428/24917

摘要： A method of manufacturing a multilayered printed-circuit board and a low-cost clad board. Copper foil layers (19, 24, 33) for forming conductor layers (10, 17, 18) and nickel plating layers (20, 21) for forming etch stop layers (11, 12) are alternately stacked and compressed to form a clad board (34) for a printed-circuit board. The clad board (34) for the printed-circuit board is selectively etched to manufacture a base. External conductor layers (15, 16) are formed on the surface of the base and patterned. The conductor layers (10, 15, 16) are interconnected electrically through conductors blocks (17, 18) formed by etching the copper foil layers (19, 24, 33) and the nickel plating layers (20, 21) to complete the manufacture of multilayered printed-circuit board.

摘要翻译： 在本发明中，其产生用于多层印刷电路板能够被经济地制造，并具有优良性能的包覆板，使用它们的多层印刷电路板及其制造方法，多层印刷电路板是通过形成包层板制造 为通过层叠铜箔19，24，33将被形成为导体层10，17，18和镀镍20，21，它们将被蚀刻停止层，并同时压接二者的多层印刷电路板34， 通过选择性地蚀刻用于多层印刷电路板34包层板，所述基体的表面上形成外导体层15,16，同时使这种图案化和电通过插入柱状导体17之间的导体层10，15，16连接产生一个基 通过蚀刻铜箔19，24，33和镀镍20 18形成，21

公开(公告)号：EP1332867A4

公开(公告)日：2004-06-23

申请号：EP01972689

申请日：2001-10-04

申请人： TOYO KOHAN CO LTD

发明人： SAIJO KINJI ,  YOSHIDA KAZUO ,  OKAMOTO HIROAKI ,  OHSAWA SHINJI

IPC分类号： B32B15/08 ,  B32B37/20 ,  H05K3/00 ,  H05K3/02 ,  H05K3/38 ,  B32B31/14

CPC分类号： H05K3/388 ,  B32B15/08 ,  B32B37/20 ,  B32B38/0008 ,  B32B38/162 ,  B32B2037/0092 ,  B32B2038/0092 ,  B32B2309/68 ,  B32B2311/00 ,  B32B2367/00 ,  B32B2379/08 ,  B32B2398/00 ,  B32B2457/08 ,  H05K3/025 ,  H05K2201/0355 ,  Y10T428/31681

摘要： A film which has a multilayered metal and is obtained by bonding a polymer film having a thin metal film formed on a surface thereof to a metal foil having a given thickness without using an adhesive. It has a given thickness and is adhesive-free. The film having a multilayered metal is obtained by preparing a polymer film having a thin metal film superposed on a surface thereof, activating both the surface of the thin metal film and a surface of a metal foil, and press-bonding the activated thin-metal film surface to the activated metal foil surface.