Abstract:
To provide an adhesive film by which air bubbles formed at a bonding interface when the adhesive film is used for bonding, readily disappear under normal temperature and normal pressure. One embodiment of the adhesion film of the present invention is characterized by having at least one adhesive layer, wherein the adhesive layer satisfies the following requirements (a) to (c). (a) A diffusion coefficient of nitrogen gas is at least 1.5×10 -6 cm 2 /sec. (b) A shear modulus G' (1Hz) is from 5×10 2 to 1.0×10 5 Pa, at a measurement temperature of 25°C and a frequency of 1 Hz. (c) The adhesive layer has an absorption peak at from 800 to 820 cm -1 and no absorption peak at from 1,000 to 1,020 cm -1 , in an infrared absorption spectrum.
Abstract:
The present disclosure describes carriers for carrying products, connected with reusable stickiness (adhesive) to grab and release different surfaces (products) and also includes the gecko conveyor, gecko cylinder, mechanical gecko arm etc. While the gecko's “glue” holds the product on the carrier strongly in one direction, one can easily pull the product out to the other direction and no extra motor or vacuum is needed, hence saving on costs and on extra parts that can be damaged. The shape of the product can be changed and is not necessarily symmetric. The carrier can come as a complete new product or the gecko adhesive can be as an add-on a belt of an existing carrier and includes a carrier that has reusable adhesive made out of carbon nanotubes mimicking a gecko foot. The present invention is directed to all carriers such as in factories, construction, cranes and conveyor belts in airports.
Abstract:
A wiring substrate 11 used for improvement in manufacturing efficiency of a semiconductor device includes a support body 12 having transparency; an adhesive layer 13 disposed on a main surface 12a of the support body 12, the adhesive layer 13 including a peeling layer 41 which contains a third resin which is decomposed by light irradiation and a protective layer 42 which is disposed on the peeling layer 41 and contains a fourth resin; and a laminate 21 disposed on the adhesive layer 13, the laminate 21 including a first resin layer 14, a second resin layer 19 disposed on the first resin layer 14, and a wiring pattern 18 disposed at least between the first resin layer 14 and the second resin layer 19. Accordingly, the semiconductor chip 22 and the wiring substrate 11 which is the external connection member can be separately manufactured, thereby improving manufacturing efficiency of the semiconductor device 1.
Abstract:
A method for bonding a fabric to a polyolefin elastomer. The method comprises applying to the fabric: (a) from 10 to 90 wt % of an aqueous dispersion of a thermoplastic polymer; and (b) from 90 to 10 wt % of an aqueous dispersion of a rosin, wherein percentages are based on total dry weight of thermoplastic polymer and rosin.
Abstract:
Provided is a polyvinyl chloride (PVC) adhesive tape less susceptible to cracking at low temperatures even with thin PVC film. The pressure-sensitive adhesive (PSA) tape provided by the present invention comprises a PVC film and a PSA layer placed on at least one face of the PVC film. The PSA tape shows a tensile elongation at break of 80 % or higher at -20 °C.
Abstract:
Provided is a thermal type airflow volume meter improving measurement accuracy, a method for manufacturing the same, and an adhesive sheet for use therein, the adhesive sheet divided into at least two or more per adherend and having a thickness of approximately 0.1 mm or less is divided to correspond to a shape of the adherend and generates or increases adhesion or stickiness by external energy.
Abstract:
The adhesive sheet for bonding an unvulcanized rubber to a metal, including, a release film, which includes a first film layer made of polypropylene and a second film layer made of polyethylene terephthalate, and which is formed as an integrated film, an upper adhesive layer obtained by applying a solvent dispersed type vulcanization adhesive having reactivity with the unvulcanized rubber to a side of the first film layer of the release film and drying the solvent dispersed type vulcanization adhesive, and a lower adhesive layer obtained by, after drying the upper adhesive layer, applying an adhesive having reactivity with the metal onto the upper adhesive layer, and by drying the adhesive.
Abstract:
Provided is a primer composition that can cause a fiber-reinforced plastic (FRP) and an adhesive to sufficiently conform to each other to express a sufficient adhesive strength. The present invention also provides a composite article containing a fiber-reinforced plastic (FRP) subjected to a primer treatment with such primer composition. The primer composition of the present invention includes: an aromatic compound having a hydroxyl group; and an epoxy. The composite article of the present invention includes a fiber-reinforced plastic, and at least part of a surface of the fiber-reinforced plastic is subjected to a primer treatment with the primer composition of the present invention.
Abstract:
Provided is a crosslinked polyolefin-based resin foam sheet of the present invention having a large number of foam cells, which is obtained by crosslinking and foaming a polyolefin-based resin, and in which the foaming ratio is 1.1 to 2.8 cm 3 /g, the average cell diameter in the MD of the foam cells is 150 to 250 µm, the average cell diameter in the CD is 120 to 300 µm, the ratio of the average cell diameter in the MD to the average cell diameter in the CD (MD/CD) of the foam cells is 0.75 to 1.25, and the ratio of the average cell diameter in the MD to the average cell diameter in the ZD (MD/ZD) is 1.9 to 7.0.