公开(公告)号：EP0375954A1

公开(公告)日：1990-07-04

申请号：EP89121802.6

申请日：1989-11-25

Applicant: NIPPON CMK CORPORATION LIMITED

Inventor： Kawakami, Shin Nippon CMK Corporation Limited ,  Haruyama, Satoshi Nippon CMK Corporation Limited ,  Okonogi, Hirotaka Nippon CMK Corporation Limited

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4664 ,  H05K1/095 ,  H05K3/245 ,  H05K3/4685 ,  H05K2201/0373

Abstract: A method of manufacturing a printed circuit comprising the following steps: In a connection portion (1) of a printed circuit (10) formed on an insulating substrate (20), another circuit portion (4) such as a jumper circuit is applied with resin ink; and a connection circuit for the circuit terminal portion (4a) of said printed circuit is formed by applying electroconductive ink after a portion (2a) of the terminal surface of said circuit terminal poriton (4a) has been covered with resin ink.

Abstract translation: 一种制造印刷电路的方法，包括以下步骤：在形成在绝缘基板（20）上的印刷电路（10）的连接部分（1）中，将诸如跳线电路的另一电路部分（4）施加树脂 墨水; 并且在所述电路端子管（4a）的端子表面的一部分（2a）已被树脂油墨覆盖之后，通过施加导电油墨来形成用于所述印刷电路的电路端子部分（4a）的连接电路。

公开(公告)号：EP0259035A2

公开(公告)日：1988-03-09

申请号：EP87307154.2

申请日：1987-08-13

Applicant: STC PLC

Inventor： Gainey, Trevor Clifford ,  Hall, Ian ,  Jones, Alan Robert

IPC: H01L21/60 ,  H01L21/58

CPC classification number: H01L24/81 ,  H01L24/31 ,  H01L24/83 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2224/81801 ,  H01L2224/83136 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/13091 ,  H01L2924/15787 ,  H05K1/092 ,  H05K1/111 ,  H05K3/248 ,  H05K3/341 ,  H05K2201/035 ,  H05K2201/0373 ,  H05K2201/10166 ,  H05K2201/10969 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A power component such as a power transistor is mounted on an insulating substrate of e.g. Beryllia. By using a thick film deposition technique. A first layer (2) is deposited and a second layer (3) is deposited over the first layer to produce a regular series of troughs and lans, in the preferred embodiment troughs and ridges, whereby voiding in the solder bond is minimised if not eliminated to thus maintain a good thermal conductivity between the component and the substrate.

Abstract translation: 诸如功率晶体管的功率部件安装在绝缘基板上。 铍。 通过使用厚膜沉积技术。 沉积第一层（2）并且第二层（3）沉积在第一层上以产生规则的一系列槽和兰，在优选实施例中是谷和脊，由此如果不消除焊料接合中的空隙，则最小化 从而在组件和衬底之间保持良好的导热性。

公开(公告)号：EP0213968A1

公开(公告)日：1987-03-11

申请号：EP86400843.8

申请日：1986-04-18

Applicant: CEGELEC

Inventor： Le Diraison, Pierre ,  Pichon, Bernard ,  Trequilly, Yves

IPC: H05K3/30 ,  H01R13/73 ,  H05K3/34

CPC classification number: H05K3/301 ,  H01R13/73 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/0373 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/10598 ,  H05K2203/167

Abstract: Procédé de fixation d'un connecteur sur le substrat d'un circuit imprimé et pion de fixation de ce connecteur sur le substrat.
Pour la fixation d'un connecteur (6) sur le substrat (4) d'un circuit imprimé (2), le maintien temporaire du connecteur sur le substrat est assuré par le coincement d'au moins un pion de fixation (30) muni de stries (38) dans le substrat. La fixation de­finitive est réalisée par un dépôt de soudure (40, 18) sur les extrémités des pions (30) et des queues de connexion à souder (16) du connecteur respectivement, par exemple lors d'une opération de soudure "à la vague".

Abstract translation: 1，一种用于连接件（6）固定到印刷电路板（2）的基板（4）的方法，它DASS包括以下步骤： - 定位第一表面（8）的连接件（6）的 配备有对基板（4）的表面（10），焊料连接销（16），所述销子在所述衬底（4）提供（16）穿过的孔（17），至少一个固定孔（24） 连接件（6）是在基板（4）的固定孔（28）相对; - 插入固定螺栓（30）插入各固定孔（24，28）的连接件（6）的对面，所述基板（4）象螺柱（30）抵靠的第二表面（26） 连接件，它是所述第一表面（8）的对面，并成为楔进底物（4），从而形成连接件（6）和第（4）的基板之间的暂时键; - 在固定螺柱（30）的一个端部突出相对于底物（4），从而实现于基板（4）的连接件（6）的固定沉积焊料（40）。

公开(公告)号：EP0164674A3

公开(公告)日：1987-01-07

申请号：EP85106835

申请日：1985-06-03

Applicant: Advanced Technology Laboratories, Inc.

Inventor： Frey, Gregg W.

IPC: H01B01/22

CPC classification number: H05K3/4007 ,  C08K7/18 ,  C09J5/02 ,  H01B1/22 ,  H05K3/244 ,  H05K3/323 ,  H05K3/388 ,  H05K2201/0317 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/09754 ,  H05K2201/10234 ,  H05K2201/10977 ,  C08L63/00

Abstract: The present invention is a method and structure which produces extremely thin, electrically conductive epoxy bonds (24) between two substrates (12, 14). Copper microspheres (26), having an average diameter of about 2 microns are bound in an epoxy layer (28) which bonds two substrates (12, 14) together. The microspheres (26) make electrical contact between the substrates (12, 14) while providing inter- sphere gaps which are filled with the epoxy which actually bonds the substrates (12, 14) together.

公开(公告)号：EP0066706B1

公开(公告)日：1986-07-30

申请号：EP82103544.1

申请日：1982-04-27

Applicant: International Business Machines Corporation

Inventor： Aug, Conrad Jean ,  Guenther, Charles Joseph ,  Randolph, James Bayliss

IPC: H05K1/14 ,  H05K3/40 ,  H01L23/32 ,  H01R9/09

CPC classification number: H05K3/325 ,  H01L23/32 ,  H01L23/4006 ,  H01L2023/4043 ,  H01L2023/4062 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/10393 ,  H05K2201/10719 ,  H01L2924/00

公开(公告)号：EP2330876B1

公开(公告)日：2017-11-01

申请号：EP09811600.7

申请日：2009-09-07

Applicant: Tokyo University of Science Foundation

Inventor： TANIGUCHI, Jun ,  YOSHINO, Norio

IPC: H05K3/20 ,  B29C33/56 ,  B29C59/02

CPC classification number: B29C33/56 ,  B29C33/424 ,  B29C33/60 ,  B29C37/0053 ,  H05K3/025 ,  H05K3/20 ,  H05K2201/0239 ,  H05K2201/0373 ,  H05K2203/1152 ,  Y10T428/24479 ,  Y10T428/24612 ,  Y10T428/24802 ,  Y10T428/24926 ,  Y10T428/31663

公开(公告)号：EP3081057A1

公开(公告)日：2016-10-19

申请号：EP14811773.2

申请日：2014-12-09

Applicant: Giesecke & Devrient GmbH

Inventor： BALDISCHWEILER, Michael

IPC: H05K3/02 ,  B32B15/00 ,  B32B27/00 ,  B32B37/10 ,  G06K19/077 ,  B30B5/06 ,  H05K1/03 ,  H05K3/00 ,  H05K3/40

CPC classification number: H05K3/022 ,  B30B5/06 ,  B32B15/14 ,  B32B15/20 ,  B32B37/1027 ,  B32B38/06 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2307/202 ,  G06K19/07718 ,  G06K19/07754 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/0014 ,  H05K3/4007 ,  H05K2201/0355 ,  H05K2201/0373 ,  H05K2201/09045 ,  H05K2203/068 ,  H05K2203/1545

Abstract: In a method for producing a module strip (200) with elevations (240) in an electrically conductive layer (230) arranged on one side of the module strip (200), first a carrier layer (220) and the electrically conductive layer (230) are provided. A stencil foil (300), which has clearances (310), is also provided. The stencil foil (300) is then fed together with the carrier layer (220) and the electrically conductive layer (230) to a continuous laminating press (100). The electrically conductive layer (230) is in this case arranged between the stencil foil (300) and the carrier layer (220). The carrier layer (220) is bonded to the electrically conductive layer (230) in the continuous laminating press (100) in a continuous process to form the module strip (200). In this process, the electrically conductive layer (230) is pressed into the clearances (310) in the stencil foil (300), whereby the desired elevations (240) are obtained in the electrically conductive layer (230).

公开(公告)号：EP2437582A4

公开(公告)日：2014-10-22

申请号：EP10780370

申请日：2010-04-13

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC PRINTED CIRCUITS

Inventor： YAMAMOTO MASAMICHI ,  NAKATSUGI KYOUICHIROU ,  YAMAGUCHI TAKASHI ,  KAWAKAMI SHIGEKI ,  KIMURA MICHIHIRO

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/282 ,  H01L2924/0002 ,  H05K1/148 ,  H05K3/305 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0248 ,  H05K2201/0373 ,  H05K2201/083 ,  H05K2201/10977 ,  H05K2203/104 ,  Y10T29/49213 ,  H01L2924/00

公开(公告)号：EP1890343A4

公开(公告)日：2014-04-23

申请号：EP06757029

申请日：2006-06-06

Applicant: FUJIKURA LTD

Inventor： TAKEMOTO KYOSUKE ,  SUZUKI RYUJI ,  OHASHI MASAKAZU

IPC: H05K1/02 ,  F21K99/00 ,  F21Y101/02 ,  H05K1/05 ,  H05K1/18 ,  H05K3/00

CPC classification number: H05K1/021 ,  F21K9/00 ,  H01L25/0753 ,  H01L33/641 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/181 ,  H05K1/053 ,  H05K1/183 ,  H05K3/0061 ,  H05K2201/0373 ,  H05K2201/10106 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

公开(公告)号：EP1873827A4

公开(公告)日：2014-01-01

申请号：EP06731255

申请日：2006-04-06

Applicant: TOYOTA JIDOSHOKKI KK ,  SHOWA DENKO KK

Inventor： OTOSHI KOTA ,  KONO EIJI ,  KUBO HIDEHITO ,  KIMBARA MASAHIKO ,  FURUKAWA YUICHI ,  YAMAUCHI SHINOBU ,  HOSHINO RYOICHI ,  WAKABAYASHI NOBUHIRO ,  NAKAGAWA SHINTARO

IPC: H01L23/36 ,  H01L23/367 ,  H01L23/373 ,  H01L23/473 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40

CPC classification number: H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0061 ,  H05K3/341 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/09681 ,  H05K2201/0969 ,  Y02P70/613 ,  H01L2924/00

Abstract: A heat radiator (1) includes an insulating substrate (3) whose first side serves as a heat-generating-element-mounting side, and a heat sink (5) fixed to a second side of the insulating substrate (3). A metal layer (7) is formed on a side of the insulating substrate (3) opposite the heat-generating-element-mounting side. A stress relaxation member (4) intervenes between the metal layer (7) of the insulating substrate (3) and the heat sink (5). The stress relaxation member (4) is formed of an aluminum plate (10) having a plurality of through holes (9) formed therein, and the through holes (9) serve as stress-absorbing spaces. The stress relaxation member (4) is brazed to the metal layer (7) of the insulating substrate (3) and to the heat sink (5). This heat radiator (1) is low in material cost and exhibits excellent heat radiation performance.