公开(公告)号：EP2235751B1

公开(公告)日：2016-04-13

申请号：EP08870490.3

申请日：2008-12-24

申请人： Linear Technology Corporation

发明人： PRUITT, David

IPC分类号： H01L23/495 ,  H01L23/00

CPC分类号： H01L23/49562 ,  H01L23/4952 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05655 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48655 ,  H01L2224/48855 ,  H01L2224/49431 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2924/20755 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2197055B1

公开(公告)日：2016-03-30

申请号：EP10158429.0

申请日：1997-07-29

申请人： Nichia Corporation

发明人： Shimizu, Yoshinori ,  Sakano, Kensho ,  Noguchi, Yasunobu ,  Moriguchi, Toshio

IPC分类号： H01L33/50 ,  H05B33/14 ,  H01J29/20

CPC分类号： H01L33/50 ,  C09K11/7767 ,  C09K11/7774 ,  G02B6/0023 ,  G02B6/0025 ,  G02B6/0051 ,  G02B6/0073 ,  H01J29/20 ,  H01L24/45 ,  H01L33/501 ,  H01L33/502 ,  H01L33/504 ,  H01L33/56 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45169 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01067 ,  H01L2924/01068 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2933/0091 ,  H05B33/14 ,  Y02B20/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/00012

公开(公告)号：EP2993156A1

公开(公告)日：2016-03-09

申请号：EP15191198.9

申请日：2006-11-21

申请人： Murata Electronics Oy

发明人： Kuisma, Heikki

IPC分类号： B81C1/00 ,  B81B7/02 ,  G01C19/5783

CPC分类号： G01C19/56 ,  B81B7/02 ,  B81B2207/012 ,  B81B2207/015 ,  B81C1/0023 ,  B81C2203/0792 ,  G01C19/5783 ,  G01L9/0042 ,  G01P1/023 ,  G01P15/0802 ,  H01L2224/16145 ,  H01L2224/1703 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： The invention relates to microelectromechanical components, like microelectromechanical gauges used in measuring e.g. acceleration, angular acceleration, angular velocity, or other physical quantities. The microelectromechanical component, according to the invention, comprises a microelectromechanical chip part (46), sealed by means of a cover part (24), (28), (33), (41), (47), (48), and an electronic circuit part (64), (74), suitably bonded to each other. The aim of the invention is to provide an improved method of manufacturing a microelectromechanical component, and to provide a microelectromechanical component, which is applicable for use particularly in small microelectromechanical sensor solutions.

摘要翻译： 本发明涉及微机电组件，如在E.G.测量使用微机电仪表 加速度，角加速度，角速度，或其它物理量。 的微机电元件，雅丁本发明，包括微机电芯片部（46），由盖部分的装置（24）的密封（28）（33）（41）（47）（48），和 到电子电路部件（64），（74），适当地相互结合。 本发明的目的是提供一种改进的制造一个微机电元件的方法，并且提供一种微机电元件，所有这些都适用于特别是在小微机电传感器的解决方案使用。

公开(公告)号：EP2803082B1

公开(公告)日：2016-02-03

申请号：EP12798672.7

申请日：2012-11-29

申请人： Robert Bosch GmbH

发明人： DUERR, Johannes ,  BECKER, Rolf ,  LAMERS, Sven ,  MUELLER, Lutz ,  BEZ, Fabian ,  SCHLECHT, Michael

IPC分类号： H01L23/053 ,  H01L23/26

CPC分类号： H01L23/26 ,  H01L21/56 ,  H01L23/053 ,  H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05624 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48453 ,  H01L2224/48465 ,  H01L2224/48507 ,  H01L2224/48599 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2924/01327 ,  H01L2924/19105 ,  H01L2924/00 ,  H01L2924/2075 ,  H01L2924/00014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00012

公开(公告)号：EP2975100A1

公开(公告)日：2016-01-20

申请号：EP15001711.9

申请日：2015-06-09

申请人： LG Electronics Inc.

发明人： Yoo, Younggil ,  Kim, Minsung ,  Lee, Jeongsoo

IPC分类号： C09K11/77 ,  H01L33/50

CPC分类号： C09K11/7774 ,  C09K11/646 ,  C09K11/7734 ,  H01L33/504 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49107 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： Disclosed are phosphors and, more particularly, yellow light emitting phosphors and light emitting device packages using the same. The yellow light emitting phosphor includes a first phosphor to emit light having a central wavelength located within a band of 510 nm to 550 nm, a second phosphor adapted to be mixed with the first phosphor to emit light having a central wavelength located within a band of 560 nm to 600 nm, and a third phosphor adapted to be mixed with the first and second phosphors to emit light having a central wavelength located within a band of 610 nm to 630 nm, the third phosphor having a light absorption rate of 50% or less at a wavelength of 550 nm.

公开(公告)号：EP1900042B1

公开(公告)日：2016-01-20

申请号：EP06768112.2

申请日：2006-07-05

申请人： SHOWA DENKO K.K.

发明人： WATANABE, Takashi ,  TAKEUCHI, Ryouichi

IPC分类号： H01L33/00 ,  H01L33/30

CPC分类号： H01L33/0079 ,  H01L33/30 ,  H01L33/387 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2933/0016 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2779332A4

公开(公告)日：2015-11-25

申请号：EP12847313

申请日：2012-11-08

申请人： CITIZEN HOLDINGS CO LTD

发明人： IDE MASAFUMI ,  YODA KAORU

IPC分类号： H01S5/022 ,  G02B6/42 ,  G02F1/377 ,  H01L25/16 ,  H01L33/50 ,  H01S5/00 ,  H01S5/40

CPC分类号： F21K9/64 ,  F21K9/56 ,  F21Y2101/00 ,  F21Y2115/10 ,  F21Y2115/30 ,  G02B6/122 ,  G02B6/4239 ,  G02F1/0147 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01S5/0092 ,  H01S5/02248 ,  H01S5/4093 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention is directed to the provision of an optical integrated device wherein provisions are made to be able to mount components on a substrate with high accuracy and high packing density without having to heat the components. The optical integrated device includes a substrate, an optical device optically coupled to a first device, and an electrical device mounted on top of the optical device or on top of a second device, wherein the optical device is bonded to the substrate by surface activated bonding via a first bonding portion formed from a metallic material on the substrate, and the electrical device is bonded to the optical device or the second device by surface activated bonding via a second bonding portion formed from a metallic material on the optical device or the second device.

公开(公告)号：EP2701192A4

公开(公告)日：2015-11-18

申请号：EP11864059

申请日：2011-04-18

申请人： MITSUBISHI ELECTRIC CORP

发明人： OGA TAKUYA ,  KATO MASAKI ,  SUGIHARA TSUYOSHI

IPC分类号： H01L25/07 ,  B60L11/18 ,  B60L15/00 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L25/18 ,  H02K11/00 ,  H02M7/48

CPC分类号： H01L25/07 ,  B60L11/1803 ,  B60L15/007 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/3701 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48699 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H02K11/33 ,  H02M7/537 ,  Y02T10/645 ,  Y02T10/7005 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： Provided is a semiconductor device including: a first MOS-FET (21) joined to a first base plate (11) via solder; a second MOS-FET (22) joined to a second base plate (12) via solder; a first lead (31) joining the first base plate (11) and the second MOS-FET (22); and a second lead (32) joining the second MOS-FET (22) and a current path member (13) that gives and receives current flowing through the MOS-FETs (21, 22) to and from the outside. The second base plate (12) is more rigid than both the leads (31, 32), a boundary line (D-D) intersects the second base plate (12) without intersecting both the leads (31, 32), the boundary line including a gap portion (52) along which both the MOS-FETs (21, 22) are opposed to each other, extending in the direction in which both the MOS-FETs (21, 22) are not opposed to each other.

公开(公告)号：EP2593975B1

公开(公告)日：2015-10-28

申请号：EP11746186.3

申请日：2011-07-08

申请人： OSRAM Opto Semiconductors GmbH

发明人： STREPPEL, Ulrich

IPC分类号： H01L33/60 ,  H01L33/58 ,  H01L33/56 ,  H01L25/075

CPC分类号： F21V13/04 ,  F21V13/12 ,  H01L25/0753 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP2931009A1

公开(公告)日：2015-10-14

申请号：EP15155076.1

申请日：2015-02-13

申请人： Intel Corporation

发明人： Aleksov, Aleksandar ,  Kobrinsky, Mauro ,  Swan, Johanna ,  Dias, Rajendra C.

IPC分类号： H05K1/14

CPC分类号： H01L25/50 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48465 ,  H01L2224/48472 ,  H01L2224/85399 ,  H01L2924/00014 ,  H05K1/0284 ,  H05K1/0393 ,  H05K1/117 ,  H05K1/142 ,  H05K1/148 ,  H05K3/4691 ,  H05K2201/10287 ,  Y10T29/49126 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

摘要： Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.

摘要翻译： 这里通常讨论的是可以包括用于柔性线接合装置的装置，系统或方法的系统和装置。 根据一个实例，设备可以包括（1）第一刚性电路，其包括靠近第一刚性电路的第一边缘的第一多个接合焊盘，（2）第二刚性电路，其包括接近于第一刚性电路的第二多个接合焊盘 第二刚性电路的第一边缘，与第一刚性电路相邻的第二刚性电路和面向第一刚性电路的第一边缘的第二刚性电路的第一边缘，或（3）第一多个引线接合引线， 所述第一多个接合线的电线和机械连接到所述第一多个接合焊盘的接合焊盘的接合线和所述第二多个接合焊盘的接合焊盘。