公开(公告)号：EP0031852A1

公开(公告)日：1981-07-15

申请号：EP80900418.7

申请日：1980-01-04

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： OIZUMI, Masayuki ,  GOTO, Masana ,  AZUMI, Ichiro ,  UOZUMI, Shoji ,  UEKITA, Masakazu ,  ABE, Masaharu Dorumi Nada 604, 1-1 Oishi ,  FUSHIKI, Yasuo ,  ISHIKI, Minoru ,  KAWASAKI, Kunio

IPC: B32B15/08 ,  H05K1/03

CPC classification number: B32B38/08 ,  B32B5/26 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/72 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/068 ,  H05K2203/1476

Abstract: A method of and device for continuously fabricating a printed circuit laminate or electrically insulating laminate. The method comprises the steps of continuously conveying sheet-like substrates (6) impregnated with a thermosetting resin liquid which produces almost no by-products such as gas, liquid, etc. during the hardening reaction process, laminating the substrates (6), applying coatings (11) to both sides of the laminated substrates at the same time as the laminating step or thereafter, and then allowing the resin to set without the application of pressure.

Abstract translation: 连续制造印刷电路层压板或电绝缘层压板的方法和设备。 该方法包括以下步骤：在固化反应过程中连续输送浸渍有几乎不产生气体，液体等副产物的热固性树脂液体的片状基材（6），层压基材（6），施加 在层压步骤之后或之后在层压衬底的两侧涂覆涂层（11），然后在不施加压力的情况下使树脂固化。

公开(公告)号：EP3216823A1

公开(公告)日：2017-09-13

申请号：EP15857169.5

申请日：2015-10-28

Applicant: ASAHI KASEI KABUSHIKI KAISHA

Inventor： KAKUTANI Takenori ,  MIWA Takao ,  ONO Hirofumi ,  SAITO Yamato

IPC: C08J5/24 ,  B32B5/28 ,  C08J5/06 ,  D21H15/02 ,  H05K1/03

CPC classification number: C08J5/06 ,  B32B5/022 ,  B32B5/04 ,  B32B5/08 ,  B32B5/26 ,  B32B5/28 ,  B32B7/04 ,  B32B15/085 ,  B32B15/12 ,  B32B15/14 ,  B32B15/20 ,  B32B27/06 ,  B32B27/285 ,  B32B27/32 ,  B32B27/38 ,  B32B29/00 ,  B32B29/005 ,  B32B2255/06 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2307/206 ,  B32B2307/50 ,  B32B2307/546 ,  B32B2307/72 ,  B32B2307/7242 ,  B32B2307/732 ,  B32B2457/00 ,  B32B2457/08 ,  C08J5/005 ,  C08J5/24 ,  C08J2301/02 ,  C08J2323/06 ,  C08J2363/00 ,  C08J2379/08 ,  D04H1/4258 ,  D21H11/18 ,  D21H13/08 ,  D21H21/52 ,  H05K1/0366 ,  H05K1/038 ,  H05K2201/0195 ,  H05K2201/0293

Abstract: Provided are: a resin-containing sheet in which not only the mechanical strength of a cellulose nanofiber nonwoven fabric but also the flexural resistance of a substrate are improved; and a structure and a wiring board which include the same. The resin-containing sheet includes: a specific cellulose nanofiber nonwoven fabric (11); a fixing agent (2) which fixes together fibers (1) in the cellulose nanofiber nonwoven fabric (11); and a resin (3) which is in contact with the cellulose nanofiber nonwoven fabric (11) and the fixing agent (2), wherein the storage modulus of the fixing agent (2) is higher than that of the resin (3). The structure is obtained by tightly adhering the resin-containing sheet to a substrate. The wiring board includes this structure.

Abstract translation: 本发明提供一种含有树脂的片材，不仅纤维素纳米纤维无纺布的机械强度提高，而且基材的耐弯曲性提高， 以及包括其的结构和布线板。 含树脂片包含：特定纤维素纳米纤维无纺布（11）; 将纤维（1）固定在纤维素纳米纤维无纺布（11）上的固定剂（2）; 和与纤维素纳米纤维非织造织物（11）和定影剂（2）接触的树脂（3），其中定影剂（2）的储能模量高于树脂（3）的储能模量。 该结构是通过将含树脂片材紧密地粘合到基材上而获得的。 布线板包括这种结构。

公开(公告)号：EP2791235B1

公开(公告)日：2017-02-01

申请号：EP12809895.1

申请日：2012-12-04

Applicant: SABIC Global Technologies B.V.

Inventor： MONIRUZZAMAN, Mohammad

IPC: H01L23/29 ,  H01B1/24 ,  H05K1/02 ,  H05K1/03 ,  H05K9/00

CPC classification number: H05K1/0366 ,  H01B1/24 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K9/0079 ,  H05K2201/0154 ,  H05K2201/0293 ,  H01L2924/00

公开(公告)号：EP2810540A4

公开(公告)日：2016-01-06

申请号：EP13743076

申请日：2013-01-30

Applicant: STORA ENSO OYJ

Inventor： SIRVIÖ PETRI ,  MAIJALA JUHA

IPC: H05K3/10 ,  H05K1/03 ,  H05K3/12

CPC classification number: B05C1/003 ,  B05C19/008 ,  B05D1/007 ,  B05D1/28 ,  B05D3/0263 ,  B05D3/029 ,  B05D3/06 ,  B05D3/12 ,  C23C26/02 ,  H05K1/038 ,  H05K1/0386 ,  H05K3/102 ,  H05K3/1241 ,  H05K3/1266 ,  H05K3/1283 ,  H05K2201/0293 ,  H05K2203/0126 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/102 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1545 ,  H05K2203/1581

Abstract: A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.

公开(公告)号：EP1927940B1

公开(公告)日：2015-06-24

申请号：EP06024978.6

申请日：2006-12-02

Applicant: HID Global GmbH

Inventor： Michalk, Manfred ,  Hirschfeld, Kay

IPC: H05K1/03 ,  G06K19/077

CPC classification number: H05K3/103 ,  H05K1/0366 ,  H05K1/182 ,  H05K2201/0293 ,  H05K2201/10287 ,  Y10T428/249953 ,  Y10T428/249986

公开(公告)号：EP2676799A4

公开(公告)日：2013-12-25

申请号：EP12760231

申请日：2012-03-16

Applicant: MITSUBISHI CHEMICAL EUROPE GMBH ,  MITSUBISHI ENG PLASTICS CORP

Inventor： TAKANO TAKAHIRO ,  SUMINO TAKAHIKO ,  ISHIHARA KENTAROU ,  SCHRAUWEN BERNARDUS ANTONIUS GERARDUS

IPC: B41M5/26 ,  C08J5/04 ,  C08K3/22 ,  C08K9/02 ,  C08L55/02 ,  C08L77/00 ,  H05K1/03 ,  H05K3/18

CPC classification number: C08K13/04 ,  B41M5/265 ,  C08G69/265 ,  C08J5/043 ,  C08J2377/00 ,  C08K3/2279 ,  C08K7/04 ,  C08K9/02 ,  C08L77/06 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/38 ,  H05K1/0366 ,  H05K3/185 ,  H05K2201/0129 ,  H05K2201/0236 ,  H05K2201/0293 ,  H05K2201/09118 ,  H05K2201/0999 ,  H05K2203/107 ,  C08L77/00

Abstract: Provided is a thermoplastic resin molded article excellent in bending strength, flexural modulus and Charpy impact strength, on which the plated layer may be formed in a successful manner. THe thermoplastic resin composition for laser direct structuring comprising, per 100 parts by weight of the thermoplastic resin, 10 to 150 parts by weight of an inorganic fiber and 1 to 30 parts by weight of a laser direct structuring additive, the laser direct structuring additive containing at least one of copper, antimony and tin, and having a Mohs hardness 1.5 or more smaller than the Mohs hardness of the inorganic fiber.

公开(公告)号：EP2448380A1

公开(公告)日：2012-05-02

申请号：EP10188945.9

申请日：2010-10-26

Applicant: ATOTECH Deutschland GmbH

Inventor： Bruderer, Alex ,  Galster, Norbert ,  Kress, Jürgen ,  Probst, Michel

IPC: H05K3/00 ,  H05K3/10 ,  H05K3/46

CPC classification number: H05K3/0085 ,  H05K1/0313 ,  H05K3/0032 ,  H05K3/4673 ,  H05K2201/0112 ,  H05K2201/0195 ,  H05K2201/029 ,  H05K2201/0293 ,  Y10T29/49155 ,  Y10T428/24967

Abstract: Disclosed are composite build-up materials for the manufacture of printed circuit boards, IC substrates, chip packages and the like. The composite build-up materials are suitable for embedding circuitry such as microvias, trenches and pads.
The composite build-up materials comprise a carrier layer (1), a reasin layer without reinforcement (2), and a resin layer with reinforcement (3). The circuitry (9) is embedded into the resin layer without reinforcement (2).

Abstract translation: 公开了用于制造印刷电路板，IC基板，芯片封装等的复合材料堆积材料。 复合材料建立材料适用于嵌入微电路，沟槽和焊盘等电路。 复合材料堆积材料包括载体层（1），没有增强材料的再吸附层（2）和具有增强层（3）的树脂层。 电路（9）嵌入树脂层而不加固（2）。

公开(公告)号：EP1839833A1

公开(公告)日：2007-10-03

申请号：EP06702660.9

申请日：2006-01-10

Applicant: YAMAUCHI CORPORATION

Inventor： YOSHIDA, Akira ,  OZEKI, Takamitsu

IPC: B29C43/32 ,  B29C43/02 ,  D04H1/54 ,  H05K3/46

CPC classification number: B30B15/061 ,  B29C43/18 ,  B29C43/203 ,  B29C43/3642 ,  B29C2043/3615 ,  B29C2043/3655 ,  B32B37/185 ,  B32B2305/20 ,  B32B2307/51 ,  B32B2309/02 ,  B32B2379/08 ,  D04H1/485 ,  D04H1/498 ,  D04H1/541 ,  D04H1/558 ,  D04H3/147 ,  H05K3/4611 ,  H05K2201/0293 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T442/659 ,  Y10T442/667

Abstract: A hot-press cushioning material comprises a non-woven fabric made of a fiber web (4). The fiber web (4) comprises a first fiber (4a) containing a first component having a relatively low softening temperature as a main constituent, and a second fiber (4b) containing a second component having a relatively high softening temperature as a main constituent. The non-woven fabric is compressed at a temperature which is not lower than the softening temperature of the first component but lower than the softening temperature of the second component.

Abstract translation: 热压缓冲材料包括由纤维网（4）制成的无纺布。 纤维网（4）包括含有以较低软化温度为主要成分的第一成分的第一纤维（4a）和含有相对较高软化温度的第二成分作为主要成分的第二纤维（4b）。 无纺布在不低于第一成分的软化温度但低于第二成分的软化温度的温度下进行压缩。

公开(公告)号：EP1577274A3

公开(公告)日：2005-11-30

申请号：EP05012735.6

申请日：2002-06-07

Applicant: JAPAN VILENE COMPANY, LTD.

Inventor： Kawabe, Masaaki ,  Tarao, Takashi ,  Kimura, Kouji

IPC: C03B37/01 ,  H05K1/03 ,  D04H1/42

CPC classification number: D01D5/0038 ,  C03B37/011 ,  D01F9/08 ,  D04H1/4209 ,  D04H1/4382 ,  H05K1/0366 ,  H05K2201/0293 ,  Y10T428/249924 ,  Y10T428/249928 ,  Y10T442/60

Abstract: An inorganic material-based article comprising inorganic material-based ultra-fine long fibers having an average fiber diameter of 2 µm or less, and composed mainly of an inorganic component, wherein the inorganic material-based ultra-fine long fibers are collected and contacting surfaces of the inorganic material-based ultra-fine long fibers are bonded to each other not via an adhesive is disclosed.

Abstract translation: 1.一种无机材料系物品，其特征在于，由平均纤维直径为2μm以下的无机材料系超细长纤维构成，主要由无机成分构成，收集无机材料系超细长纤维， 公开了无机材料基超细长纤维的表面不经由粘合剂彼此结合。

公开(公告)号：EP1420928B1

公开(公告)日：2005-07-20

申请号：EP02763567.1

申请日：2002-08-29

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： SAMUELS, Michael, R.

IPC: B29B13/10 ,  B02C19/12

CPC classification number: B32B27/12 ,  B29B13/10 ,  B32B15/04 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: Thermotropic liquid crystalline polymers are readily ground to smaller particle sizes by using a two or more stage grinding process. The particles produced usually are relatively short, but still, fibers. The ground LCP is useful for rotational molding, powder coating, and forming nonwoven structures.