公开(公告)号：EP1385363A4

公开(公告)日：2005-06-29

申请号：EP02713291

申请日：2002-04-04

Applicant: MITSUI MINING & SMELTING CO ,  SUZUKI CO LTD

Inventor： HAYASHI KATSUHIKO MITSUI MININ ,  KATAOKA TATSUO ,  KAWAMURA HIROKAZU MITSUI MININ ,  ICHIRYU AKIRA

IPC: H05K3/40 ,  H05K3/42

CPC classification number: H05K3/4046 ,  H05K2201/0347 ,  H05K2201/10416 ,  Y10T29/49126 ,  Y10T29/49155

Abstract: A print circuit board including a dielectric substrate (12) having via-holes (16) perforated therethrough, an implant material (15) filled in the via-holes (16) and selected from a group consisting of oxygen free copper, phosphorus-deoxidized copper and tough pitch copper, and interconnect patterns formed on both surfaces of the substrate (12) and electrically connected to the implant material (15). The probability of generating the deficiencies in the print circuit board of the present invention is reduced under the conditions of the repeated heating and cooling between higher temperatures and lower temperatures to which the print circuit board is likely exposed because the via-holes (16) are made of the highly resistant oxygen free copper, phosphorus-deoxidized copper or tough pitch copper, and the print circuit board is used for a longer period of time as a highly heat-resistant print circuit board.

Abstract translation: 一种印刷电路板，包括具有穿孔的通孔（16）的电介质基板（12），填充在所述通孔（16）中的植入材料（15），并选自由无氧铜，磷 - 脱氧 铜和韧性节距铜，以及形成在基板（12）的两个表面上并电连接到植入材料（15）的互连图案。 由于通孔（16）是在印刷电路板可能暴露的较高温度和较低温度之间的反复加热和冷却的条件下，本发明的印刷电路板产生缺陷的概率降低 由高耐氧无铜，磷脱氧铜或坚韧节距铜制成，印刷电路板作为高耐热性印刷电路板使用较长时间。

公开(公告)号：EP1194025A4

公开(公告)日：2004-08-25

申请号：EP99921226

申请日：1999-05-21

Applicant: IBIDEN CO LTD

Inventor： ASAI MOTOO ,  KARIYA TAKASHI ,  SHIMADA KENICHI ,  SEGAWA HIROSHI

IPC: H05K3/38 ,  H05K3/46

CPC classification number: H05K3/4602 ,  H05K3/382 ,  H05K2201/0215 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096

Abstract: A multilayer printed wiring board so structured that layer-to-layer resin insulating layers and conductor layers are alternately provided on a multilayer core sheet having conductor circuits provided on its inner layers, and a build-up wiring layer where conductor layers are connected through via holes is provided, wherein the multilayer core sheet has a resin insulating layer (3) covering an inner layer conductor circuit (2) provided on a core member (1), a via hole (12) is made through the resin insulating layer and leads to the inner conductor circuit, through holes (10) are made through the resin insulating layer and the core member (1) and filled with a filler (8), and part of via holes (24) made in a build-up wiring layer are positioned directly above the through holes and connected to the through holes. Even if the core sheet is a multilayer one, the electrical connection to the inner circuit in the core sheet through through holes is ensured, thereby providing a multilayer printed wiring board advantageously adaptable to high density of through holes.

公开(公告)号：EP1432294A2

公开(公告)日：2004-06-23

申请号：EP03257866.8

申请日：2003-12-15

Applicant: Endicott Interconnect Technologies, Inc.

Inventor： Fuller, James W., Jr. ,  Markovich, Voya R. ,  Lauffer, John M.

IPC: H05K3/46

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A circuitized substrate assembly (10) and method for making same wherein the assembly includes individual circuitized substrates (11, 13) bonded together. The substrates each include at least one opening (21), only one of which is substantially filled with a conductive paste (25) prior to bonding. Once bonded, the paste is also partially located within the other opening to provide an effective electrical connection therewith.

Abstract translation: 一种电路化衬底组件（10）及其制造方法，其中所述组件包括结合在一起的各个电路化衬底（11,13）。 每个衬底包括至少一个开口（21），在键合之前其中仅一个基本上填充有导电膏（25）。 一旦粘合，糊剂也部分位于另一个开口内以提供与其有效的电连接。

公开(公告)号：EP1415021A1

公开(公告)日：2004-05-06

申请号：EP02761138.3

申请日：2002-07-22

Applicant: Nikko Materials USA, Inc.

Inventor： LEE, Chin-Ho ,  AMEEN, Thomas, J. ,  CALLAHAN, John, P.

IPC: C25D5/34 ,  C25D13/16

CPC classification number: H05K3/384 ,  C25D3/38 ,  C25D5/34 ,  C25D7/0614 ,  H05K1/05 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T428/31678

Abstract: A composite for use if forming a multi-layer printed circuit board, comprised of an INVAR sheet (12) having a thickness of between 0.5 mil and 5 mil; and a layer of electrodeposited copper (72) on at least one side thereof. The copper has a thickness of between 1ν and 50ν, wherein the composite has a thermal coefficient of expansion (TCE) of about 2.8 to 6.0 ppm at temperatures between 0 °F and 200 °F.

公开(公告)号：EP1161125A3

公开(公告)日：2003-10-29

申请号：EP01304508.3

申请日：2001-05-23

Applicant: ALPS ELECTRIC CO., LTD.

Inventor： Yoshisato, Akiyuki ,  Ueda, Kazuhiko ,  Ikarashi, Yasuhiro ,  Inoue, Akihiko ,  Sakuma, Hiroshi

IPC: H05K1/18 ,  H01L23/64

CPC classification number: H05K3/403 ,  H01L23/647 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/16 ,  H05K3/246 ,  H05K2201/0317 ,  H05K2201/0347 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00

Abstract: The invention provides a surface mounting typing electronic circuit unit that is suitable for miniaturization and is suitable for simple output adjustment. Circuit elements including capacitors (C), resistors (R), and inductance elements (L) and a conducting pattern connected to the circuit elements are formed on an alumina substrate (1) by means of thin film forming technique, and a diode (D1) and a semiconductor chip of a transistor are fixed to a connection land of the conducting pattern by means of wire bonding, wherein only the emitter resistor out of the base bias voltage dividing resistors and the emitter resistor of the transistor is trimmed for output adjustment.

公开(公告)号：EP1348234A1

公开(公告)日：2003-10-01

申请号：EP01272987.7

申请日：2001-12-19

Applicant: Telefonaktiebolaget L M Ericsson (Publ)

Inventor： OLOFSSON, Lars-Anders

IPC: H01L21/60 ,  H01L23/535 ,  H05K7/02 ,  H05K1/02

CPC classification number: H05K3/4046 ,  H05K1/0204 ,  H05K3/4623 ,  H05K2201/0347 ,  H05K2201/0382 ,  H05K2201/10234 ,  H05K2201/10416

Abstract: The present invention relates to a method of providing thermal vias in a printed circuit board that includes one or more layers of board material, for conducting heat from components mounted on and/or in the board through said board through said board and away therefrom, and also relates to a printed cirucit board that includes vias arranged in accordance with method. One or more holes (4) are provided in a printed circuit board that includes several metal layers. A metal ball (6) is inserted into each hole and subjected to pressure such as to deform said ball, and tightly fixating the resultant slug against the wall (5) of said hole. The deformed ball or slug fixed in the hole, which may have a metallised inner surface, functions to conduct heat and/or electricity between a metallised topside (2) and bottom side (3) of the printed circuit board and also between intermediate metallised layers in the case of a multi-layer board.

公开(公告)号：EP1298155A1

公开(公告)日：2003-04-02

申请号：EP02021209.8

申请日：2002-09-18

Applicant: San-Ei Kagaku Co. Ltd.

Inventor： Sato, Kiyoshi, San-Ei Kagaku Co., Ltd. ,  Kitamura, Kazunori, San-Ei Kagaku Co., Ltd.

IPC: C08G59/20 ,  C08G59/32 ,  H05K3/00 ,  H05K3/46

CPC classification number: H05K3/0094 ,  C08F283/10 ,  C08F290/00 ,  C08F290/06 ,  C08F290/064 ,  C08L63/00 ,  C08L63/10 ,  G03F7/038 ,  H05K3/287 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  C08L2666/22

Abstract: A photo-setting and thermosetting resin composition comprises (I) a partial adduct of epoxy resin with unsaturated aliphatic acid, (II) (meth)acrylates, (III) a photocrosslinking agent, (IV) liquid epoxy resin, and (V) a latent curing agent. The resin composition can be easily charged and plugged into a through-hole, does not drip down, and can be effectively photo-set and thermoset. A photo-set product prepared of the resin composition can be easily polished. A plugged-through-hole printed wiring (substrate) board prepared of the resin composition does not cause defects such as hollows, cracks, blisters, peelings and so on, is excellent in solder-resistance, does not corrode a metal part, and can produce an appliance of high reliability and long life which does not occur short circuit and poor electrical connection.

Abstract translation: 光硬化和热硬化性树脂组合物包含（i）环氧树脂与不饱和脂族酸的部分加成物，（II）（甲基）丙烯酸酯，（III）光交联剂，（IV）液态环氧树脂，和（V）一 潜伏性固化剂。 该树脂组合物能够容易地充电和插入通孔，不滴落下来，并且可以有效地照片集和热固性材料。 该树脂组合物的制备的光集产品可容易地研磨。 所述树脂组合物不引起缺陷的制备的插入的通孔印刷配线（基板）基板：例如中空部，裂纹，水泡，剥离等，具有优异的钎焊性，不腐蚀的金属部件，并能 在生产高可靠性和长寿命这不会发生短路，电接触不良设备。

公开(公告)号：EP0820217B1

公开(公告)日：2003-01-22

申请号：EP97110015.1

申请日：1997-06-19

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： Felten, John James ,  Padlewski, Stephan

IPC: H05K1/09 ,  H05K3/40 ,  H01B1/22

CPC classification number: H05K1/095 ,  H05K3/246 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2203/0554

公开(公告)号：EP0653904B1

公开(公告)日：2002-12-11

申请号：EP94117078.9

申请日：1994-10-28

Applicant: International Business Machines Corporation

Inventor： Arldt, Roy Lynn ,  Boyko, Christina Marie ,  Cayson, Burtran Joe ,  Kozlowski, Richard Michael ,  Kulesza, Joseph Duane ,  Lauffer, John Matthew ,  Liu, Philip Chihchau ,  Markovich, Voya Rista ,  Mahmoud, Issa Said ,  Muska, James Francis ,  Papathomas, Kostas ,  Sabia, Joseph Gene

IPC: H05K3/40 ,  H05K1/09 ,  H01B1/20

CPC classification number: H05K1/113 ,  B32B7/04 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/16235 ,  H05K1/095 ,  H05K1/16 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/0191 ,  H05K2203/0207 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0763 ,  Y10S428/901 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/25

公开(公告)号：EP1026929A3

公开(公告)日：2002-06-12

申请号：EP00102407.4

申请日：2000-02-03

Applicant: Sony Chemicals Corporation

Inventor： Kurita, Hideyuki ,  Taniguchi, Masato ,  Hishinuma, Hiroyuki ,  Nakamura, Masayuki ,  Namiki, Hidetsugu

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A flexible printed wiring board constructed by using elemental pieces at a low cost. The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24c on one face and adhesive resin films 19a to 19c on the other face. The supporting films 24a to 24c have connecting openings on the bottom face of which the surface of metal wiring circuits are exposed as lands 23a to 23c. On the other hand, conductive bumps 16a to 16c, which are connected respectively to the metal wiring circuits 14a to 14c, project on the resin films 19a to 19c. To construct a flexible printed wiring board 83 by using plural elemental pieces 81a to 81c, the tips of the conductive bumps 16b and 16c are brought into contact respectively with the lands 23a and 23b on the bottom face of the openings and contact-bonded under heating. Thus, the elemental pieces 81a to 81c are adhered to each other owing to the adhesiveness of the resin film 19b and 19c. The connection among the elemental pieces 81a to 81c can be further enhanced by surface-roughing the supporting films 24a to 24c.