公开(公告)号：EP0437976B1

公开(公告)日：1995-08-30

申请号：EP90314303.0

申请日：1990-12-27

Applicant: NEC CORPORATION

Inventor： Norimatsu, Hidehiko, c/o NEC Corporation

IPC: H05K1/18 ,  H01L23/64

CPC classification number: H05K1/025 ,  H05K1/0216 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/0792 ,  H05K2201/093 ,  H05K2201/0969 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10174

公开(公告)号：EP0575892A1

公开(公告)日：1993-12-29

申请号：EP93109693.7

申请日：1993-06-17

Applicant: MITSUBISHI DENKI KABUSHIKI KAISHA

Inventor： Oshima, Seiichi, c/o Mitsubishi Denki K.K: ,  Tametani,Fumitaka c/c Mitsubishi Denki K.K. ,  Yamagata,Jun c/o Fukuryo Semiconductor Eng.Corp. ,  Takanashi,Ken c/o Mitsubishi Denki K.K.

IPC: H01L25/16 ,  H01L23/64 ,  H05K9/00

CPC classification number: H01L25/162 ,  H01L23/5383 ,  H01L23/642 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2223/6644 ,  H01L2224/04042 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0218 ,  H05K1/0219 ,  H05K1/0262 ,  H05K1/144 ,  H05K9/0039 ,  H05K2201/093 ,  H05K2201/10015 ,  H05K2201/10689 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85399

Abstract: In a four-layers circuit board on which a control circuit is arranged, wiring sub-patterns 133a in the first layer are divided into four areas A1-A3 and A8, for respective sets of circuit parts having same power potentials. Respective sub-patterns belonging to the areas A1-A3 are partially or fully surrounded by wiring sub-patterns PEa1-PEa3 connected to negative power potentials of circuit parts belonging to respective areas, respectively. Similarly, at least part of a wiring patten Pa2 for transmitting an input signal to a semiconductor active element is surrounded by a wiring pattern PEa4. Penetration of electric noises to the wiring patterns for the control circuit, in particular to the wiring pattern for transmitting the input signal to semiconductor element, is decreased to thereby prevent misoperation due to electric noises.

Abstract translation: 在布置有控制电路的四层电路板中，对于具有相同功率电位的各组电路部分，将第一层中的布线子图案133a分成四个区域A1-A3和A8。 属于区域A1-A3的各个子图案分别被部分地或全部地被连接到属于各个区域的电路部分的负功率电位的布线子图案PEa1-PEa3包围。 类似地，用于将输入信号发送到半导体有源元件的布线图案Pa2的至少一部分被布线图案PEa4包围。 对于控制电路的布线图案，特别是将输入信号传送到半导体元件的布线图形，电噪声的渗透减少，从而防止由于电噪声而引起的误操作。

公开(公告)号：EP0331486A3

公开(公告)日：1991-05-08

申请号：EP89302078.4

申请日：1989-03-02

Applicant: SHAYE COMMUNICATIONS LIMITED

Inventor： Beesley, Graham Edgar

IPC: H01Q1/24

CPC classification number: H05K1/16 ,  H01Q1/243 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/0715 ,  H05K2201/093

Abstract: Electronic circuitry incorporating an aerial is built upon a printed circuit board (3/4) whose metallisation acts as the radiating element of the aerial. In the particular form shown, the printed circuit board forms a folded dipole aerial with a gap (9) in the metallisation forming a feed point for the aerial. The components (13) of the circuitry are mounted within the enclosure formed by the printed circuit board, and are thus shielded by the metallisation.

Abstract translation: 包含天线的电子电路建立在印刷电路板（3/4）上，印刷电路板的金属化作为天线的辐射元件。 在所示的特定形式中，印刷电路板形成折叠的偶极天线，在金属化中具有间隙（9），形成天线的馈电点。 电路的组件（13）安装在由印刷电路板形成的外壳内，因此被金属化屏蔽。

公开(公告)号：EP0391105A2

公开(公告)日：1990-10-10

申请号：EP90104949.4

申请日：1990-03-16

Applicant: Haller, Manfred ,  Hagen, Wolfgang

Inventor： Haller, Manfred ,  Hagen, Wolfgang ,  Dirks, Christian, Prof. Dipl.-Ing.

IPC: H05K7/10

CPC classification number: H05K7/1092 ,  H01L2924/0002 ,  H05K1/0227 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/103 ,  H05K2201/049 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09663 ,  H05K2201/10022 ,  H05K2201/10325 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10689 ,  Y02P70/611 ,  H01L2924/00

Abstract: Die Erfindung betrifft eine Schaltungsplatine für die optimale Entkopplung von Schaltungen mit digitalen IC's. Die Platine ist gekennzeichnet durch eine mit einem SMD-­Kondensator (7) und zwei damit verbundenen und zu den zu entkoppelnden Punkten führenden Leiterbahnen (3, 4) ver­sehene Platine (1), die mit allen vorhandenen Präzisions­kontaktanschlüssen bestückbar ist. Weiterhin ist die Platine der Form des IC's oder des IC-Sockels angepaßt und weist jeweils eine der Anzahl der Kontaktstifte des IC's oder der Kontaktanschlüsse des IC-Sockels entspre­chende Anzahl von Bohrungen (2) auf, wobei die zum SMD-­Kondensator (7) führenden Leiterbahnen verhältnismäßig breit ausgebildet sind und zu den Anschlüssen der zu entkoppelnden Punkte führen.

Abstract translation: 本发明涉及一种电路板，用于电路中的与数字IC的最佳去耦。 该板的特征在于具有一个SMD电容器（7）和两个所涉及的，并导致到去耦导体点（3,4）设置有印刷电路板（1），它可以配备有所有已知的精密接触端子。 此外，IC或IC插座的形状的电路板被适配，并且每个具有许多的IC的或IC插座的相应的孔的数量的接触端子（2），其中，所述的SMD电容器（7）领先接触销 迹线被设计成相对宽的和导致的端子是解耦点。

公开(公告)号：EP0331486A2

公开(公告)日：1989-09-06

申请号：EP89302078.4

申请日：1989-03-02

Applicant: SHAYE COMMUNICATIONS LIMITED

Inventor： Beesley, Graham Edgar

IPC: H01Q1/24

CPC classification number: H05K1/16 ,  H01Q1/243 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/0715 ,  H05K2201/093

Abstract: Electronic circuitry incorporating an aerial is built upon a printed circuit board (3/4) whose metallisation acts as the radiating element of the aerial. In the particular form shown, the printed circuit board forms a folded dipole aerial with a gap (9) in the metallisation forming a feed point for the aerial. The components (13) of the circuitry are mounted within the enclosure formed by the printed circuit board, and are thus shielded by the metallisation.

Abstract translation: 包含天线的电子电路建立在印刷电路板（3/4）上，印刷电路板的金属化作为天线的辐射元件。 在所示的特定形式中，印刷电路板形成折叠的偶极天线，在金属化中具有间隙（9），形成天线的馈电点。 电路的组件（13）安装在由印刷电路板形成的外壳内，因此被金属化屏蔽。

公开(公告)号：EP0169530A3

公开(公告)日：1987-01-14

申请号：EP85109136

申请日：1985-07-22

Applicant: HITACHI, LTD.

Inventor： Sengoku, Norio ,  Kozai, Hiroshi ,  Kobayashi, Fumiyuki

IPC: H05K01/00

CPC classification number: H05K1/116 ,  H05K3/429 ,  H05K2201/093 ,  H05K2201/09718

Abstract: In a multilayer printed circuit board including a signal layer (3'), a power supply layer (3), and through-holes (1A, 1B), the shape of each of clearances (2A, 2B) formed on a power supply layer (3) for the purpose of attaining insulation from through-holes (1A. 1B) is nearly a quadrangle having tour circular corners. Thereby, the area of the power supply layer (3) left between adjacent clearances (2A, 2B) is increased to suppress increase in electrical resistance at that portion.

公开(公告)号：EP3383148A3

公开(公告)日：2018-10-10

申请号：EP18161588.1

申请日：2018-03-13

Applicant: Delphi Technologies LLC

Inventor： ZIMMERMAN, David W ,  PEPPLES, Michael J. ,  IHMS, David W.

IPC: H05K1/18 ,  H05K1/02 ,  H05K3/34 ,  H01L23/31 ,  H01L23/498 ,  H01L23/66

CPC classification number: H01L24/17 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/66 ,  H01L24/06 ,  H01L24/32 ,  H01L24/73 ,  H01L2223/6605 ,  H01L2223/6683 ,  H01L2224/16227 ,  H01L2224/30179 ,  H01L2224/32227 ,  H01L2224/73204 ,  H01L2224/81815 ,  H01L2924/0665 ,  H01L2924/10161 ,  H01L2924/1423 ,  H05K1/0243 ,  H05K3/3436 ,  H05K2201/093 ,  H05K2201/10166 ,  Y02P70/613

Abstract: A circuit-board-assembly (10) includes a printed-circuit-board (12), an integrated-circuit-die (14), a ball-grid-array (16), a barrier-material (18), and an adhesive-material (20). The printed-circuit-board (12) includes a mounting-surface (22) that defines a plurality of contact-pads and a continuous-trace that interconnects a selected-group (28) of the contact-pads. The integrated-circuit-die (14) includes an electrical-circuit having a plurality of solder-pads. The ball-grid-array (16) includes a plurality of solder-balls interposed between the contact-pads and the solder-pads. The plurality of solder-balls establish electrical communication between the electrical-circuit and the contact-pads. The barrier-material (18) is located between a string (38) of solder-balls that are attached to the selected-group (28) of the contact-pads to create a barrier (40). The barrier (40) segregates an underfill-region (42) from a non-underfill-region (44) between the printed-circuit-board (12) and the integrated-circuit-die (14). The barrier (40) is in direct-contact with the string (38) of the solder-balls, the integrated-circuit-die (14), and the continuous-trace. The adhesive-material (20) is in direct contact with a portion of the underfill-region (42) and the barrier (40) prevents the adhesive-material (20) from encroaching upon the non-underfill-region (44).

公开(公告)号：EP2651199B1

公开(公告)日：2018-02-21

申请号：EP13162441.3

申请日：2013-04-05

Applicant: Canon Kabushiki Kaisha

Inventor： Murai, Yusuke ,  Hoshi, Sou ,  Yamashita, Nobuaki

IPC: H05K1/02

CPC classification number: H05K1/025 ,  H01L2224/16225 ,  H05K1/0225 ,  H05K1/0243 ,  H05K1/181 ,  H05K2201/09263 ,  H05K2201/093 ,  H05K2201/09709

Abstract: Provided is a printed circuit board 100 capable of increasing an inductance value of a power pattern and a ground pattern while keeping a low electric resistance value of the power pattern and the ground pattern. The printed circuit board includes a printed wiring board 101 including: a power layer 113 having a power pattern 131 formed therein; and a ground layer 112 having a ground pattern 121 formed therein. On the printed wiring board, an LSI 102 as a semiconductor device and an LSI 104 as a power supply member are mounted. The ground pattern has a first ground region R that overlaps the power pattern as viewed from the direction perpendicular to the surface of the printed wiring board. In the first ground region, at least one defect portion 122 is formed. In the first ground region, the defect portion forms a region 121a that is narrower than the power pattern.

公开(公告)号：EP3244711A1

公开(公告)日：2017-11-15

申请号：EP17166595.3

申请日：2017-04-13

Applicant: KATHREIN-Werke KG

Inventor： Langenberg, Jörg ,  Leinenbach, Florian ,  Ponn, Philipp

IPC: H05K3/00 ,  H01Q1/52 ,  H05K3/34 ,  H05K9/00

CPC classification number: F16B5/0024 ,  F16B5/02 ,  H01Q21/08 ,  H01Q21/26 ,  H05K3/0061 ,  H05K3/3447 ,  H05K9/006 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/093 ,  H05K2201/09718 ,  H05K2201/09745 ,  H05K2201/10371 ,  H05K2201/2036

Abstract: Bereitgestellt wird eine Adapterplatte (1) für HF-Strukturen, die dazu eingerichtet ist, zwischen einer Rückseite einer Leiterplatte (2) und einem Reflektor (4) angeordnet zu werden, wobei die Adapterplatte elektrisch leitfähig ist, und die Adapterplatte an jeder Stelle, an der ein Element durch die Leiterplatte auf die Seite der Adapterplatte durchgeführt ist, eine Öffnung (102) oder eine Vertiefung (101) aufweist, wobei mindestens ein Element ausschließlich zur Massekontaktierung durch die Leiterplatte geführt ist.

Abstract translation: 提供了一种用于HF-结构，其适于被设置在印刷电路板的后侧之间提供一个适配器板（1）（2）和反射器（4），其中所述适配器板是导电的，并且在每个位置处，其中所述适配板 元件穿过电路板到达适配板的侧部，开口（102）或凹部（101），其中至少一个元件专门用于通过电路板进行接地。

公开(公告)号：EP1912488B1

公开(公告)日：2017-07-19

申请号：EP07102581.1

申请日：2007-02-16

Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.

Inventor： Hattori, Makoto, c/o Air-conditioning & Refrigeration Systems ,  Asai, Masahiko, c/o Air-conditioning & Refrigeration Systems ,  Toyama, Koji, c/o NAGOYA Research & Development Center ,  Nakano, Koji, c/o NAGOYA Research & Development Center

IPC: H05K9/00 ,  H05K1/02

CPC classification number: H05K1/0262 ,  H05K1/0227 ,  H05K1/0231 ,  H05K2201/093 ,  H05K2201/09663