公开(公告)号：EP1723689B1

公开(公告)日：2014-10-15

申请号：EP04795893.9

申请日：2004-10-18

Applicant: RAYTHEON COMPANY

Inventor： TONOMURA, Samuel, D.

IPC: H01P1/16 ,  H01L23/498 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01P1/20 ,  H01Q15/00 ,  H05K1/02

CPC classification number: H01P1/16 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/552 ,  H01L23/66 ,  H01L25/16 ,  H01L2223/6627 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2924/01046 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/19032 ,  H01L2924/3025 ,  H01P1/2005 ,  H01Q15/006 ,  H05K1/0236 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09681 ,  H01L2924/00

公开(公告)号：EP2391191A1

公开(公告)日：2011-11-30

申请号：EP10164333.6

申请日：2010-05-28

Applicant: Thales

Inventor： Denis, Stéphane ,  Cazenave, Jean-Pierre ,  Haquet, Gérard

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0228 ,  H01L23/66 ,  H01L2223/6633 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01P5/028 ,  H05K1/0239 ,  H05K2201/09336 ,  H05K2201/09781 ,  H05K2201/10363 ,  H05K2201/1053 ,  H01L2924/00

Abstract: Dispositif d'interconnexion (100) de circuits électroniques, notamment de circuits électroniques hyperfréquence, caractérisé en ce qu'il comprend au moins une ligne de transmission (103) couplée à une ligne de masse (104), les deux lignes (103, 104) étant réalisées sur une face d'un substrat diélectrique (101), au moins une surface de métallisation formant sur l'autre face du substrat diélectrique (101) au moins un élément de couplage (102) disposé sur une surface sensiblement égale à la surface occupée par la ligne de transmission (103) et la ligne de masse (104), l'interconnexion se réalisant sensiblement au niveau des extrémités de la ligne de transmission (103) et de la ligne de masse (104).

Abstract translation: 所述装置（100）具有连接到接地线（104），其中，所述传输线和接地线的在电介质基片（101）的一侧形成的传输线（103）。 金属化表面上形成所述电介质基板的另一侧的耦合元件，用于传输线和接地之间的电耦合的加强。 所述耦合元件被设置等于由传输线和接地线，其中互连在所述传输线和接地线的端部上形成占据的表面的表面上。

公开(公告)号：EP2184964A2

公开(公告)日：2010-05-12

申请号：EP09159298.0

申请日：2003-01-23

Applicant: Mitsubishi Materials Corporation ,  Panasonic Corporation

Inventor： Yamaguchi, Kunio ,  Kimura, Ryouhei ,  Tanaka, Atsushi ,  Morozumi, Kenyu

IPC: H05K9/00 ,  H05K1/02 ,  H03H9/02

CPC classification number: H05K1/0243 ,  H03H9/0259 ,  H03H9/02913 ,  H05K1/111 ,  H05K2201/09063 ,  H05K2201/09281 ,  H05K2201/09336 ,  H05K2201/10083

Abstract: A protective member (315) which has a surface which is coated with, for example, a conductive sheet or the like is carried upon the surface (311A) of the SAW filter (311) which has been mounted in the fitting region (313) upon the printed substrate (312). Here, within the conductive surface of the protective member (315), by surface contact with the surface (311A) of the SAW filter (311), the size of a conductive coating surface (315A) of the protective member which covers this surface (311A) is set so as to be the same as the size of the surface (311A) of the SAW filter (311), or to be smaller than the size thereof.
Furthermore a shield frame member (316) which is shaped as a frame and which is made from a metal (for example from copper or the like) is provided so as to surround the periphery of the fitting region (313) for the SAW filter (311) and moreover a shield lid member (317) which is shaped as a lid and which is made from a metal (for examplefrom copper or the like) is provided so as to be sandwiched from both sides by the printed substrate (312).

Abstract translation: 在已安装在安装区域（313）中的SAW滤波器（311）的表面（311A）上承载具有例如导电片等的表面的保护构件（315） 在印刷基板（312）上。 这里，在保护构件（315）的导电表面内，通过与SAW滤波器（311）的表面（311A）的表面接触，覆盖该表面的保护构件的导电性涂覆面（315A）的尺寸 311A）被设定为与SAW滤波器（311）的表面（311A）的尺寸相同，或者小于其尺寸。 此外，被形成为框架并由金属（例如由铜等制成）的屏蔽框架构件（316）设置成围绕用于SAW滤波器的装配区域（313）的周边 311），并且还设有形成为盖并由金属（例如铜等）制成的屏蔽盖构件317，以便由印刷基板312从两侧夹持。

公开(公告)号：EP2163144A1

公开(公告)日：2010-03-17

申请号：EP07846765.1

申请日：2007-11-23

Applicant: Sony Ericsson Mobile Communications AB

Inventor： LUNDELL, Patrik ,  ESKILSSON, Stefan ,  AHLBERG,Thomas

IPC: H05K1/00 ,  H05K1/02 ,  H01P3/08

CPC classification number: H05K1/0253 ,  H05K1/0298 ,  H05K2201/0191 ,  H05K2201/09327 ,  H05K2201/09336 ,  H05K2201/09627 ,  Y10T29/49155

Abstract: A multilayered printed wiring board, a multilayer PWB, and a method for manufacturing the same. The multilayer PWB comprises a first main surface (201) and an opposing second main surface (202), where the multilayer PWB has a height (h) being defined, by the distance from the first main surface to the opposing second main surface. The two surfaces and the height together define the thickness of the multilayer PWB. The multilayer PWB comprises a reference ground plane, a microstrip conductor (210) separated from the reference ground plane (230') by a first dielectric layer (250) and a stripline conductor (220) connected with the microstrip conductor and being separated from the reference ground plane (230' ') by a second dielectric layer (260). The reference ground plane is formed by two or more different partial reference (230',230' ') ground planes positioned at different layers of the multilayer PWB. Furthermore, the reference ground plane is moveable from the first partial reference ground plane to the second partial reference ground plane when a signal current transits from the microstrip conductor to the stripline conductor, and vice versa.

公开(公告)号：EP0766503B1

公开(公告)日：2007-07-18

申请号：EP96115548.8

申请日：1996-09-27

Applicant: CANON KABUSHIKI KAISHA

Inventor： Ohtaki, Toru, c/o Canon K.K. ,  Ichida, Yasuteru, c/o Canon K.K. ,  Takeuchi, Yasushi, c/o Canon K.K.

IPC: H05K1/02 ,  H05K1/16

CPC classification number: H01L23/48 ,  H01L23/642 ,  H01L23/645 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2224/4943 ,  H01L2924/00014 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0233 ,  H05K1/0298 ,  H05K1/162 ,  H05K1/165 ,  H05K3/3421 ,  H05K2201/09263 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/09772 ,  H05K2201/1006 ,  H05K2201/10689 ,  Y10S257/924 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

公开(公告)号：EP1414279A2

公开(公告)日：2004-04-28

申请号：EP03022912.4

申请日：2003-10-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Furutani, Koji, (170)Intellectual Property Dept.

IPC: H05K1/02 ,  H05K3/46 ,  H01L23/538

CPC classification number: H01L23/50 ,  H01L23/49822 ,  H01L2924/0002 ,  H04B1/005 ,  H04B1/0057 ,  H04B1/006 ,  H04B1/52 ,  H05K1/0237 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/112 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/096 ,  H05K2201/09781 ,  H05K2201/0979 ,  H01L2924/00

Abstract: In a high-frequency module, intermediate ground electrodes (Go1, Gm1, Gg1, Go2, Gm2, Gg2) are provided between a common ground electrode (Gd) and upper-surface ground electrodes (Gq1, Gq2,) for mounting high-frequency components (21, 22) on an upper surface of a multilayer substrate. With regard to the number of via-hole conductors interconnecting ground electrodes, the number of via-hole conductors (Vdg) between the intermediate ground electrodes (Go1, Gm1, Gg1, Go2, Gm2, Gg2) and the common ground electrode (Gg) is larger than the number of via-hole conductors (Voq) between the upper-surface ground electrodes (Gq1, Gq2) and the intermediate ground electrodes (Go1, Gm1, Gg1, Go2, Gm2, Gg2).

公开(公告)号：EP0880150B1

公开(公告)日：2003-03-19

申请号：EP98109129.1

申请日：1998-05-19

Applicant: NEC CORPORATION

Inventor： Tohya, Hirokazu ,  Yoshida, Shiro ,  Shimada, Yuzo

IPC: H01F17/00 ,  H05K1/16

CPC classification number: H01F17/0013 ,  H05K1/0233 ,  H05K1/165 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/097

公开(公告)号：EP1286464A1

公开(公告)日：2003-02-26

申请号：EP02018186.3

申请日：2002-08-19

Applicant: Alps Electric Co., Ltd.

Inventor： Osada, Shigeru

IPC: H03H7/09 ,  H01F27/00

CPC classification number: H05K1/165 ,  H01F5/003 ,  H01F17/0033 ,  H05K3/222 ,  H05K2201/093 ,  H05K2201/09336 ,  H05K2201/097 ,  H05K2201/10636 ,  H05K2203/171 ,  Y02P70/611

Abstract: In a coupling adjusting structure for a double-tuned circuit according to the present invention, first and second coils are configured such that a pair of first conductive patterns formed on a first surface of a printed circuit and a corresponding pair of second conductive patterns formed on a second surface of the printed circuit board are connected via corresponding connecting conductors, thereby making the first and second coils low and thin. Also, one end of the first coil and the corresponding end of the second coil are disposed close to each other, a first ground conductive pattern is disposed at least on the first surface of the printed circuit, and a first jumper connected to the first ground conductive pattern is disposed between the first and second coils so as to adjust an inductive coupling of the double-tuned circuit, thereby achieving a coupling adjusting structure for a double-tuned circuit whose inductive coupling is adjustable.

Abstract translation: 在根据本发明的用于双调谐电路的耦合调节结构中，第一和第二线圈被配置成使得形成在印刷电路的第一表面上的一对第一导电图案和形成在 印刷电路板的第二表面通过相应的连接导体连接，从而使第一和第二线圈变薄和薄。 此外，第一线圈的一端和第二线圈的对应端部彼此靠近地设置，第一接地导体图案至少设置在印刷电路的第一表面上，并且第一跳线连接到第一接地 导电图案设置在第一和第二线圈之间，以便调整双调谐电路的电感耦合，从而实现用于电感耦合可调节的双调谐电路的耦合调整结构。

公开(公告)号：EP0848447A3

公开(公告)日：1999-03-10

申请号：EP97310005.0

申请日：1997-12-11

Applicant: SHARP KABUSHIKI KAISHA

Inventor： Somei, Junichi

IPC: H01P3/08

CPC classification number: H01P3/081 ,  H02M2007/53876 ,  H05K1/0251 ,  H05K3/429 ,  H05K2201/0715 ,  H05K2201/09336 ,  H05K2201/09627 ,  H05K2201/09845

Abstract: There is provided a transmission circuit using a strip line which can be formed in three dimensions with simple construction and low cost and which has high reliability. A first microstrip line is formed by sandwiching a dielectric substrate 1 between a first strip conductor 2 provided on a top surface of the dielectric substrate 1 and a first grounding conductor 3 provided on a bottom surface of the dielectric substrate 1. A second microstrip line is formed by sandwiching the dielectric substrate 1 between a second strip conductor 4 provided on the bottom surface of the dielectric substrate 1 and a second grounding conductor 5 provided on the top surface of the dielectric substrate 1. The first strip conductor 2 and the second strip conductor 4 are electrically connected to each other by a connecting through hole 11 provided in the dielectric substrate 1.

Abstract translation: 提供了一种使用带状线的传输电路，其可以以简单的结构和低成本三维形成，并且具有高可靠性。 通过将电介质基板1夹在设置在电介质基板1的上表面上的第一带状导体2和设置在电介质基板1的底面上的第一接地导体3之间来形成第一微带线。第二微带线是 通过将电介质基板1夹持在设置在电介质基板1的底面上的第二带状导体4和设置在电介质基板1的上表面的第二接地导体5之间而形成。第一带状导体2和第二带状导体 4通过设置在电介质基板1中的连接通孔11彼此电连接

公开(公告)号：EP0880150A2

公开(公告)日：1998-11-25

申请号：EP98109129.1

申请日：1998-05-19

Applicant: NEC CORPORATION

Inventor： Tohya, Hirokazu ,  Yoshida, Shiro ,  Shimada, Yuzo

IPC: H01F17/00

CPC classification number: H01F17/0013 ,  H05K1/0233 ,  H05K1/165 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/097

Abstract: An insulative magnetic layer is disposed between a power source conductor layer and a ground conductor layer of a printed-wiring board. Two pieces of conductors are formed by cutting out a part of the power source conductor layer. Another two pieces of conductors are formed by cutting out a part of the ground conductor layer. The former conductors and the latter conductors are connected by five viaholes. A spiral coil inductor of a spiral form is formed in this way. This inductor has the strengthened inductance owing to the insulative magnetic layer provided therein.

Abstract translation: 在印刷电路板的电源导体层和接地导体层之间设置有绝缘性的磁性层。 通过切割电源导体层的一部分来形成两个导体。 通过切掉接地导体层的一部分来形成另外两个导体。 前导体和后导体通过五个通孔连接。 以这种方式形成螺旋形螺旋线圈电感器。 该电感器由于其中提供的绝缘磁性层而具有增强的电感。