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    SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME, AND FLEXIBLE PRINTED WIRING BOARD USING SAME
    31.
    发明公开
    SUBSTRATE FOR FLEXIBLE PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME, AND FLEXIBLE PRINTED WIRING BOARD USING SAME 审中-公开
    基材软性印刷电路板的生产和柔性基板工艺

    公开(公告)号：EP2981157A1

    公开(公告)日：2016-02-03

    申请号：EP14773451.1

    申请日：2014-03-12

    Applicant: Sumitomo Electric Industries, Ltd. ,  Sumitomo Electric Printed Circuits, Inc.

    Inventor： YONEZAWA, Takayuki ,  KAIMORI, Shingo ,  SUGAWARA, Jun ,  ASAI, Shogo ,  UCHITA, Yoshifumi

    IPC: H05K3/24 ,  H05K1/02 ,  H05K3/28

    CPC classification number: H05K3/243 ,  H05K1/02 ,  H05K1/0296 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0341 ,  H05K2201/0769

    Abstract: It is an object of the present invention to provide a substrate for a flexible printed circuit board having high long-term heat resistance and oil resistance, a method for manufacturing the same, and a flexible printed circuit board using the same. A flexible printed circuit board according to the present invention includes an insulating flexible base film, a conductive pattern made of copper disposed on a surface side of the base film, and a protective film disposed on a surface side of the conductive pattern with an adhesive layer therebetween. The flexible printed circuit board further includes a shielding layer disposed on a surface of the conductive pattern, the shielding layer preventing leakage of copper or permeation of components reactive with copper. The main component of the shielding layer may be nickel (Ni), tin (Sn), or aluminum (Al). The shielding layer may be formed by a plating on the surface of the conductive pattern. The average thickness of the shielding layer may be 0.01 to 6.0 µm.

    Abstract translation: 这是本发明的一个目的是提供一种具有高的长期耐热性和耐油性，其制造方法，以及使用其的柔性印刷电路板的柔性印刷电路板的基板。 的柔性印刷电路板雅丁到本发明包括在绝缘柔性基片，由铜制成设置在基片的一个表面侧的导体图案，以及保护膜在粘合剂层设置在所述导体图案的表面侧与 有间。 柔性印刷电路板还包括设置在所述导电图案的表面上的屏蔽层，屏蔽层防止铜或组件的渗透泄漏与铜发生反应。 所述屏蔽层的主要成分可以是镍（Ni），锡（Sn），或铝（Al）。 屏蔽层可以由导电图案的表面上镀覆来形成。 所述屏蔽层的平均厚度可以是0点01分至6.0微米。

    Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure
    35.
    发明公开
    Method for forming metal circuit, liquid trigger material for forming metal circuit and metal circuit structure 审中-公开
    一种用于制造金属电路的方法，液体释放材料以形成金属电路和金属电路图案

    公开(公告)号：EP2869309A1

    公开(公告)日：2015-05-06

    申请号：EP14177426.5

    申请日：2014-07-17

    Applicant: Industrial Technology Research Institute

    Inventor： Kao, Tune-Hune ,  Huang, Meng-Chi ,  Chou, Min-Chieh

    IPC: H01B1/14 ,  H05K1/09 ,  H05K3/18 ,  H05K3/24 ,  H05K3/46

    CPC classification number: C23C18/1651 ,  C09D5/24 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/165 ,  H05K1/0296 ,  H05K1/0373 ,  H05K3/107 ,  H05K3/185 ,  H05K3/4661 ,  H05K3/4676 ,  H05K2201/0209

    Abstract: A metal circuit structure, a method for forming a metal circuit and a liquid trigger material for forming a metal circuit are provided. The metal circuit structure includes a substrate, a first trigger layer and a first metal circuit layer. The first trigger layer is disposed on the substrate and includes a first metal circuit pattern. The first metal circuit layer is disposed on the first circuit pattern and is electrically insulated from the substrate. The composition of the first trigger layer includes an insulating gel and a plurality of trigger particles. The trigger particles are at least one of organometallic particles, a chelation and a semiconductor material having an energy gap greater than or equal to 3 eV. The trigger particles are disposed in the insulating gel, such that the dielectric constant of the first trigger layer after curing is between 2 and 6.5.

    Abstract translation: 本发明提供一种金属的电路结构，用于形成金属电路和用于形成金属电路的液体触发材料的方法。 金属电路结构包括一个基片，一个第一触发层和第一金属层电路。 第一触发层配置在基板上，并且包括第一金属电路图案。 第一金属线路层设置在第一电路图案和电从衬底绝缘。 第一触发层的组合物包括在绝缘凝胶和触发颗粒的复数。 触发颗粒是有机金属颗粒，螯合和具有能隙大于或等于3电子伏特的半导体材料中的至少一种。 所述触发粒子被设置在所述绝缘凝胶，检查做的第一触发层的介电常数后固化是2和6.5之间。

    LEITERPLATTE AUS AIN MIT KUPFERSTRUKTUREN
    40.
    发明公开
    LEITERPLATTE AUS AIN MIT KUPFERSTRUKTUREN 审中-公开

    公开(公告)号：EP2774461A1

    公开(公告)日：2014-09-10

    申请号：EP12787675.3

    申请日：2012-10-31

    Applicant: CeramTec GmbH

    Inventor： DOHN, Alexander ,  LENEIS, Roland ,  HERRMANN, Klaus ,  JÄHNIG, Dietmar

    IPC: H05K3/24 ,  H05K3/40 ,  H01L27/01 ,  H05K3/12 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02

    CPC classification number: H05K3/1216 ,  H05K1/0263 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/115 ,  H05K3/1291 ,  H05K3/245 ,  H05K3/246 ,  H05K3/4038 ,  H05K3/4061 ,  H05K2201/10106 ,  H05K2203/086 ,  H05K2203/1476 ,  Y10T29/49165

    Abstract: The invention relates to a process for producing a ceramic circuit board with electrical conductor traces and contacting points on at least one of the two sides, and with at least one through-hole contact (via). According to the invention, the following successive process steps are performed: a) Production of a ceramic substrate made of aluminium nitride and drilling of holes at the intended locations for the vias, b) Filling the holes with a first adhesive paste made of copper, tungsten, molybdenum or alloys thereof, or mixtures thereof, and c) Single-pass overprinting with a second adhesive paste using a first screen-printing operation on at least one side of the ceramic substrate with the desired layout of the conductor traces and contact points, d) Optionally, a full or partial repeat of overprinting with the second adhesive paste, e) Stoving the printed ceramic substrate in an oven with N
    2 (nitrogen), wherein the oxygen content is kept controlled to 0-50 ppm O
    2 , f) Overprinting using a second screen-printing process with a low-glass cover paste over the second adhesive paste until the desired thickness of the conductor traces and contact points is achieved, g) Stoving the printed ceramic substrate in an oven with N
    2 (nitrogen), wherein the oxygen content is kept controlled to 0-50 ppm O
    2 .

    Abstract translation: 用于制造具有电导体迹线和侧面上的接触点并具有通孔接触的陶瓷电路板的方法，其顺序为a）在用于通孔的位置处产生AlN衬底和钻孔，b）用粘合剂填充孔 含有铜，钨和/或钼的合金或其合金，以及c）利用导电迹线和接触点的布局在陶瓷基板的侧面上使用第一丝网印刷操作的第二粘合剂糊剂进行单遍套印， d）任选地，用第二粘合剂浆料完全或部分重复套印，e）在氮气烘箱中用氮气烘烤印刷的陶瓷衬底，同时控制0-50ppm O2的氧气，f）使用第二丝网印刷方法 在第二粘合剂糊剂上覆盖玻璃膏，并且g）用氮气保持印刷的陶瓷基板，同时保持氧含量在0-50ppm O2。

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