公开(公告)号：EP0834917B1

公开(公告)日：2002-02-13

申请号：EP96115745.0

申请日：1996-10-01

Applicant: NITTO DENKO CORPORATION

Inventor： Naito, Toshiki, Nitto Denko Corp. ,  Ouchi, Kazuo, Nitto Denko Corp.

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L24/81 ,  H01L23/4985 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1572 ,  H01L2924/00

公开(公告)号：EP1035581A3

公开(公告)日：2001-07-18

申请号：EP00301836.3

申请日：2000-03-07

Applicant: SHINKO ELECTRIC INDUSTRIES CO. LTD.

Inventor： Ohi, Masayuki, c/o Shinko Electric Ind. Co., Ltd. ,  Imai, Kunihiko, c/o Shinko Electric Ind. Co., Ltd.

IPC: H01L23/498 ,  H01L23/538 ,  H05K1/02 ,  H01L21/48

CPC classification number: H05K3/0094 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/5384 ,  H01L2924/0002 ,  H05K3/429 ,  H05K3/4602 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2203/025 ,  H01L2924/00

Abstract: A multilayer wiring board (50) including a core board which comprises a resin baseplate (10) outer wiring patterns (12) on one and the other sides of the core board (10), respectively, and throughholes (44) penetrating the core board and having a side wall coated with a conductive material (46) electrically connecting the outer wiring patterns with each other, wherein a space within the throughholes is filled with a filler material (48) having a thermal expansion coefficient substantially equal to that of the resin baseplate (10).

Abstract translation: 一种多层布线基板（50），其特征在于，在芯基板（10）的一面侧和另一面侧分别具有树脂基板（10），外侧布线图案（12），贯通该核心基板 并且具有涂覆有导电材料（46）的侧壁，所述导电材料（46）将外部布线图案彼此电连接，其中贯通孔内的空间填充有热膨胀系数基本上等于树脂的热膨胀系数的填充材料（48） 底板（10）。

公开(公告)号：EP1096842A2

公开(公告)日：2001-05-02

申请号：EP00309489.3

申请日：2000-10-27

Applicant: Ajinomoto Co., Inc.

Inventor： Nakamura, Shigeo, c/o Aminoscience Lab. ,  Yokota, Tadahiko, c/o Aminoscience Lab.

IPC: H05K3/46

CPC classification number: H05K3/4069 ,  H05K3/0035 ,  H05K3/0094 ,  H05K3/246 ,  H05K3/381 ,  H05K3/426 ,  H05K3/4661 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2203/0191 ,  H05K2203/066 ,  H05K2203/068 ,  H05K2203/085 ,  H05K2203/1383 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: Herein is disclosed a method of manufacturing a multilayered printed wiring board using an adhesive film comprising a support base film provided with a mold release layer and a thermosetting resin composition laminated on the surface of the mold release layer, said resin composition being provided with the same or smaller area as or than that of the support base film, provided with thermal fluidity and being solid at normal temperatures.
The method includes:

1) directly covering at least the pattern processed portion on one surface or both surfaces of a pattern processed circuit substrate with the resin composition layer of said adhesive film, and performing laminating by heating and pressurizing under a vacuum condition; and
2) thermally curing the resin composition with the support base film attached thereto. Subsequent process steps include uncovering the resin composition layer by stripping at least the support base film.

Abstract translation: 在为圆盘游离缺失使用粘合剂膜，其包括支撑基膜，设置有脱模层和层叠在该脱模层的表面上的热固性树脂组合物，所述树脂组合物被提供有相同的制造多层印刷电路板的方法 或更小的区域或比该支撑基座的电影，设置有热流动性和在常温下为固体。 该方法包括：1）直接覆盖至少所述图案处理在一个表面上或部分用粘合剂。所述电影的树脂组合物层的图案加工的电路基板的两面，并通过加热进行层压和在真空条件下加压; 和2）热固化与膜连接到其上支撑基体的树脂组合物。 随后的工艺步骤包括：通过至少剥离支撑基片露出树脂组合物层。

公开(公告)号：EP1059833A2

公开(公告)日：2000-12-13

申请号：EP00304783.4

申请日：2000-06-06

Applicant: Xerox Corporation

Inventor： Dances, Robert J.

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K3/0061 ,  H01L24/17 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0206 ,  H05K3/328 ,  H05K3/386 ,  H05K3/42 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09781 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2224/05599

Abstract: A heat transferring printed wiring board utilizes a plurality of printed heat conductive lines (24) to be bonded to each component (12) in order to transfer heat from each component to a heat sink (14). The heat conductive lines (24), which have connection to the components on the board, transfer the heat from each individual component (12) to the heat sink (14).

Abstract translation: 传热印刷线路板利用多个印刷的导热线（24）与每个部件（12）接合，以将热量从每个部件传递到散热片（14）。 与板上的部件连接的导热线（24）将热量从每个单独部件（12）传递到散热器（14）。

公开(公告)号：EP1026929A2

公开(公告)日：2000-08-09

申请号：EP00102407.4

申请日：2000-02-03

Applicant: Sony Chemicals Corporation

Inventor： Kurita, Hideyuki ,  Taniguchi, Masato ,  Hishinuma, Hiroyuki ,  Nakamura, Masayuki ,  Namiki, Hidetsugu

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4617 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K3/28 ,  H05K3/4007 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0195 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A flexible printed wiring board constructed by using elemental pieces at a low cost.
The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24c on one face and adhesive resin films 19a to 19c on the other face. The supporting films 24a to 24c have connecting openings on the bottom face of which the surface of metal wiring circuits are exposed as lands 23a to 23c. On the other hand, conductive bumps 16a to 16c, which are connected respectively to the metal wiring circuits 14a to 14c, project on the resin films 19a to 19c. To construct a flexible printed wiring board 83 by using plural elemental pieces 81a to 81c, the tips of the conductive bumps 16b and 16c are brought into contact respectively with the lands 23a and 23b on the bottom face of the openings and contact-bonded under heating. Thus, the elemental pieces 81a to 81c are adhered to each other owing to the adhesiveness of the resin film 19b and 19c. The connection among the elemental pieces 81a to 81c can be further enhanced by surface-roughing the supporting films 24a to 24c.

Abstract translation: 以低成本使用元件构成的柔性印刷电路板。 根据本发明的元件81a至81c分别在一个表面上设置有支撑膜24a至24c，而在另一个面上分别设置粘结树脂膜19a至19c。 支撑膜24a至24c在其底面上具有连接开口，金属布线电路的表面露出为接地片23a至23c。 另一方面，分别连接到金属布线电路14a至14c的导电凸块16a至16c突出在树脂膜19a至19c上。 为了通过使用多个元件片81a至81c来构造柔性印刷线路板83，导电凸块16b和16c的顶端分别与开口底面上的焊盘23a和23b接触并在加热下接触接合 。 因此，由于树脂膜19b和19c的粘附性，元件81a至81c彼此粘合。 通过对支撑膜24a〜24c进行表面粗化，能够进一步提高元件81a〜81c之间的连接。

公开(公告)号：EP0536418B1

公开(公告)日：1999-07-28

申请号：EP92909488.6

申请日：1992-04-23

Applicant: CITIZEN WATCH CO. LTD.

Inventor： MIMURA, Seiichi ,  SHIMIZU, Junichiro ,  TAJIRI, Takayuki ,  ICHIKAWA, Shingo ,  KANEKO, Hiroyuki ,  OHI, Masayuki

IPC: H01L23/13 ,  H05K3/24 ,  H01L23/498 ,  H01L23/31 ,  H05K3/06

CPC classification number: H05K3/4007 ,  H01L23/3121 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5384 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K3/3436 ,  H05K3/423 ,  H05K3/427 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/1476 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A semiconductor device si so configured that the circuit patterns formed on both sides of a copper-clad double-sided laminated board are connected to each other by through holes, and IC chips are mounted on the front side, and further, external-connection terminals are provided on the reverse side. In this semiconductor device, the connection terminals are copper core bumps on the land parts of the through holes which are made in diebond patterns. A method of manufacturing semiconductor devices in which copper core bumps are formed on circuit patterns formed on a circuit board, by plating using resist patterns. In this manufacturing method, the parts, where the bumps are to be formed, of the circuit patterns formed by the resist patterns are treated by the same kind of pattern etching as the one used for forming the circuit patterns.

公开(公告)号：EP0683007B1

公开(公告)日：1998-05-20

申请号：EP95105476.6

申请日：1995-04-12

Applicant: Carl Zeiss ,  CARL-ZEISS-STIFTUNG, HANDELND ALS CARL ZEISS ,  Hewlett-Packard GmbH

Inventor： Schulte in den Bäumen, Joachim, Dr. ,  Grub, Robert, Dr. ,  Gross, Herbert ,  Schweizer, Jurgen, Dr. ,  Dippon,Siegfrid ,  Tamm, Wilhelm ,  Lam, Si-Ty, Dr. ,  Kahlert, Hans-Jürgen, Dr. ,  Endert, Heinrich, Dr.

IPC: B23K26/06

CPC classification number: B23K26/0673 ,  B23K26/04 ,  B23K26/067 ,  H05K1/036 ,  H05K3/0017 ,  H05K3/0023 ,  H05K3/0032 ,  H05K3/108 ,  H05K3/388 ,  H05K3/426 ,  H05K2201/0329 ,  H05K2201/0347 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2203/025 ,  H05K2203/107

公开(公告)号：EP0727926A3

公开(公告)日：1998-01-07

申请号：EP96300569.9

申请日：1996-01-26

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Mizumoto, Shogo ,  Tsukada, Yutaka

IPC: H05K3/46 ,  H05K3/40

CPC classification number: H05K1/113 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/4069 ,  H05K3/421 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/0347 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/025 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/49167 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: The present invention provides a structure for electrically connecting two or more layers spaced apart from each other in a multilayer printed wiring board, said structure being small in consumed area, tolerant to a high integration, high in the reliability of the process, and good in the yield of products. When forming a via hole in the second insulating layer formed in contact with the first insulating layer having a via hole, a via hole is formed right above the via hole in the first insulating layer. Since the via hole formed in the first insulating layer is filled with a predetermined filler prior to forming the second insulating layer, the consumed area is reducible.

公开(公告)号：EP0800336A1

公开(公告)日：1997-10-08

申请号：EP96935417.4

申请日：1996-10-23

Applicant: IBIDEN CO., LTD.

Inventor： KAWAMURA, Yoichiro ,  MURASE, Hideki ,  ASAI, Motoo

IPC: H05K3/46

CPC classification number: H05K3/0094 ,  H05K3/382 ,  H05K3/384 ,  H05K3/4602 ,  H05K2201/0129 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0347 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09881 ,  H05K2203/0773

Abstract: As an object of proposing a resin filler a resin filler suitable for filling in the concave portion created on the surface of the wiring substrate or the through-hole formed in the substrate and a construction of a build-up multilayer printed circuit board having an excellent reliability obtained by smoothening the surface of the substrate filled with the resin filler, this invention proposes a solvent-free resin filler filled in the concave portion created on the surface of the wiring substrate or in the through-holes formed in the substrate, which comprises a bisphenol type epoxy resin as a resin component and an imidazole curing agent as a curing agent, and if necessary, inorganic particles as an additive component, and a build-up multilayer printed circuit board using this resin filler.

Abstract translation: 作为树脂填料的目的，提供一种适于填充在布线基板的表面上形成的凹部的树脂填料或形成在基板中的通孔，以及具有优异的积层多层印刷电路板的结构 通过使填充有树脂填料的基板的表面平滑化获得的可靠性，本发明提出了填充在形成在布线基板的表面上或形成在基板中的通孔中的凹部中的无溶剂树脂填料，其包含 作为树脂成分的双酚型环氧树脂和作为固化剂的咪唑固化剂，以及必要时作为添加剂成分的无机粒子，以及使用该树脂填料的积层多层印刷电路板。

公开(公告)号：EP0653904A3

公开(公告)日：1996-12-18

申请号：EP94117078.9

申请日：1994-10-28

Applicant: International Business Machines Corporation

Inventor： Arldt, Roy Lynn ,  Boyko, Christina Marie ,  Cayson, Burtran Joe ,  Kozlowski, Richard Michael ,  Kulesza, Joseph Duane ,  Lauffer, John Matthew ,  Liu, Philip Chihchau ,  Markovich, Voya Rista ,  Mahmoud, Issa Said ,  Muska, James Francis ,  Papathomas, Kostas ,  Sabia, Joseph Gene

IPC: H05K3/40 ,  H05K1/09 ,  H01B1/20

CPC classification number: H05K1/113 ,  B32B7/04 ,  H01B1/22 ,  H01B1/24 ,  H01L2224/16235 ,  H05K1/095 ,  H05K1/16 ,  H05K1/167 ,  H05K3/0023 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/4053 ,  H05K3/4069 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/10734 ,  H05K2203/0126 ,  H05K2203/0191 ,  H05K2203/0207 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/0763 ,  Y10S428/901 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24826 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/25

Abstract: The present invention permits solder joints to be made directly to via and through holes without the solder being wicked into the vias or through holes, by filling plated through holes (14) with an epoxy or cyanate fill composition (16). When cured and overplated, the fill composition (16) provides support for the solder joint (22) and provides a flat solderable surface (18) for the inter-connection. In certain embodiments, the cured fill compositions, offer a further advantage of being conductive. The invention also relates to several novel methods for filling through holes with such fill compositions, and to resistors located in through holes and vias.

Abstract translation: 本发明允许焊点（22）直接通过贯通孔（14），而不焊料为芯吸到通孔或通孔（14），通过用导电酚醛环氧树脂填充孔（14）充填镀制成 组合物（16）。 当固化时，用镀覆（18），所述填充组合物（16）提供支持，为焊点和提供了用于互连（22）的平坦焊接表面（18）。 因此，本发明涉及若干新颖方法，用于通过孔（14），求补的组合物（16）填充，并位于通孔（14）和通孔的电阻。