公开(公告)号：EP1315407A2

公开(公告)日：2003-05-28

申请号：EP02258032.8

申请日：2002-11-21

Applicant: Shipley Co. L.L.C.

Inventor： Allen, Craig S. ,  Rzeznik, Maria Anna ,  Cairns, S. Matthew

IPC: H05K1/16 ,  H05K3/18 ,  H01G4/005

CPC classification number: H05K1/162 ,  H01G4/06 ,  H01L21/2885 ,  H01L28/56 ,  H01L28/60 ,  H05K3/181 ,  H05K2201/0195 ,  H05K2201/0236 ,  H05K2201/09309

Abstract: Multilayer dielectric structures particularly suitable for use in capacitors and having a plating dopant in an amount sufficient to promote plating of a conductive layer are provided, together with methods of forming such structures. Such dielectric structures show increased adhesion of subsequently applied conductive layers.

Abstract translation: 提供特别适用于电容器并具有足以促进导电层镀覆的电镀掺杂剂的多层电介质结构，以及形成这种结构的方法。 这种电介质结构显示随后施加的导电层的附着力增加。

公开(公告)号：EP0756540B1

公开(公告)日：1999-07-14

申请号：EP95918023.3

申请日：1995-04-18

Applicant: KERMEL S.N.C.

Inventor： CASSAT, Robert ,  FAURE, Jean-Paul

IPC: B32B5/24 ,  H05K1/03

CPC classification number: B32B5/02 ,  B32B5/24 ,  B32B7/12 ,  B32B15/08 ,  B32B27/20 ,  B32B27/281 ,  B32B27/32 ,  B32B27/34 ,  B32B27/365 ,  B32B27/42 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2307/304 ,  B32B2307/306 ,  B32B2323/00 ,  B32B2361/00 ,  B32B2367/00 ,  B32B2369/00 ,  B32B2377/00 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0236 ,  H05K2201/0278 ,  Y10T428/23943 ,  Y10T428/23986

Abstract: A composite material and a method for making same are disclosed. A composite article including an electrically and/or thermally insulating substrate and protective layers on each side thereof is particularly disclosed. Said material includes protective layers consisting of fibres of a heat-stable material flocked onto the insulating substrate, and a heat-stable coating resin. The resulting protective layer has improved protective properties, particularly moisture-proofness. The composite material may also be used as a metal layer carrier for forming flexible printed electrical circuits.

公开(公告)号：EP0335565B1

公开(公告)日：1994-06-15

申请号：EP89302794.6

申请日：1989-03-21

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Takahashi, Hiroshi ,  Takanezawa, Shin ,  Kanno, Masao ,  Iwasaki, Yorio ,  Okamura, Toshirou ,  Nakaso, Akishi ,  Hasegawa, Kiyoshi

IPC: H05K3/18 ,  H05K3/42

CPC classification number: H05K3/426 ,  H05K1/0373 ,  H05K3/181 ,  H05K3/184 ,  H05K3/387 ,  H05K2201/0236 ,  H05K2201/0344 ,  H05K2203/0709 ,  H05K2203/1407 ,  H05K2203/1415

公开(公告)号：EP0145613A1

公开(公告)日：1985-06-19

申请号：EP84420175.6

申请日：1984-10-17

Applicant: CIBA-GEIGY AG

Inventor： Cassat, Robert

IPC: H05K1/03

CPC classification number: H05K3/188 ,  H05K1/0373 ,  H05K3/105 ,  H05K3/387 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0245 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/1157 ,  H05K2203/125 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/256

Abstract: @ L'invention se rapporte à des substrats métallisables par traitement de réduction éventuellement suivi d'une métallisation par voie électrolytique, destinés à la réalisation de circuits imprimés.
Les substrats comprennent une âme centrale constituée essentiellement de matière fibreuse cellulosique et/ou de paillettes de mica et d'une résine thermodurcissable renfermant éventuellement une charge inerte, et sur une ou deux de ses faces d'au moins une couche obtenue à partir d'une composition de résine thermodurcissable chargée par un oxyde métallique non conducteur dont le degré d'oxydation est choisi de manière à permettre une réduction facile par un borohydrure et qui est susceptible de former intermédiairement des hydrures métalliques instables.
L'invention se rapporte à un procédé d'obtention desdits substrats par «voie papetière».

公开(公告)号：EP3387887A1

公开(公告)日：2018-10-17

申请号：EP16797521.8

申请日：2016-11-15

Applicant: Continental Automotive GmbH

Inventor： FRANK, Sebastian ,  PUCHER, Björn ,  FISCHER, Peter

IPC: H05K1/02 ,  H05K3/18 ,  H05K3/32

CPC classification number: H05K3/185 ,  H05K1/0284 ,  H05K3/32 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2201/10303 ,  H05K2203/107 ,  H05K2203/1469

Abstract: The invention relates to a method for sealing and/or electrically connecting components for a motor vehicle, having the steps of providing a first element (10) and a second element (20) which is arranged in a recess (14) of the first element (10); introducing electrically conductive additives into the first element (10) in the region of a boundary surface (5) which is formed as a transition between the first and the second element (10, 20); exposing the boundary surface (5) of the first element (10) and the second element (20); and chemically depositing a provided material and thereby forming a sealing layer and/or electrically conductive connection layer (3) on the first element (10) and the second element (20), thus sealing the boundary surface (5) and/or electric connection between the first element (10) and the second element (20).

公开(公告)号：EP3235354A2

公开(公告)日：2017-10-25

申请号：EP15820078.2

申请日：2015-12-16

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： STAHR, Hannes

IPC: H05K1/18 ,  H05K3/04 ,  H05K3/10 ,  H01L23/522 ,  H01L23/538 ,  H01L23/00 ,  H05K3/18 ,  H05K3/24

CPC classification number: H01L23/5389 ,  H01L21/4803 ,  H01L21/4846 ,  H01L21/486 ,  H01L23/13 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/08 ,  H01L24/32 ,  H01L24/82 ,  H01L2224/08235 ,  H01L2224/32225 ,  H01L2224/73267 ,  H05K1/0366 ,  H05K1/09 ,  H05K1/115 ,  H05K1/185 ,  H05K1/186 ,  H05K3/0032 ,  H05K3/027 ,  H05K3/045 ,  H05K3/107 ,  H05K3/181 ,  H05K3/184 ,  H05K3/188 ,  H05K3/242 ,  H05K2201/0236 ,  H05K2201/0376 ,  H05K2203/107 ,  H05K2203/1469

Abstract: A component carrier for carrying electronic components, wherein the component carrier comprises an at least partially electrically insulating core, at least one electronic component embedded in the core, and a coupling structure with at least one electrically conductive through-connection extending at least partially therethrough and having a component contacting end and a wiring contacting end, wherein the at least one electronic component is electrically contacted directly to the component contacting end, wherein at least an exterior surface portion of the coupling structure has homogeneous ablation properties and is patterned so as to have surface recesses filled with an electrically conductive wiring structure, and wherein the wiring contacting end is electrically contacted directly to the wiring structure.

Abstract translation: 一种用于承载电子部件（104）的部件载体（100），其中部件载体（100）包括至少部分电绝缘的芯部（102），嵌入芯部（102）中的至少一个电子部件（104） 耦合结构（106,202），所述耦合结构具有至少部分地穿过其延伸并且具有组件接触端（112）和布线接触端（114）的至少一个导电穿通连接（108），其中所述至少一个电子组件 （104）与部件接触端（112）直接电接触，其中至少耦合结构（106,202）的外表面部分具有均匀的烧蚀特性并且被图案化以便具有填充有导电材料 （110），并且其中所述布线接触端（114）直接与所述布线结构（110）电接触。

公开(公告)号：EP2958113A1

公开(公告)日：2015-12-23

申请号：EP14789124.6

申请日：2014-04-17

Applicant: LG Chem, Ltd.

Inventor： PARK, Chee Sung ,  JEONG, Han Nah ,  JUNG, Sang Yun ,  PARK, Cheol Hee ,  CHUNG, Chan Yeup ,  KIM, Jae Hyun ,  JUN, Shin Hee

IPC: H01B1/22 ,  H01B13/00

CPC classification number: H05K3/105 ,  C08K3/22 ,  C08K2003/2227 ,  C08K2003/2248 ,  C23C18/1608 ,  C23C18/161 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1658 ,  C23C18/204 ,  C23C18/405 ,  H01B1/22 ,  H05K1/0296 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/0014 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/107 ,  C08L69/00

Abstract: The present invention relates to a composition for forming a conductive pattern, which is able to form a fine conductive pattern onto a variety of polymer resin products or resin layers by a very simple process, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming the conductive pattern, including a polymer resin; and a non-conductive metal compound containing a first metal and a second metal, in which the non-conductive metal compound has a three-dimensional structure containing a plurality of first layers that contains at least one metal of the first and second metals and has edge-shared octahedrons two-dimensionally connected to each other, and a second layer that contains a metal different from that of the first layer and is arranged between the neighboring first layers; and a metal core containing the first or second metal or an ion thereof is formed from the non-conductive metal compound by electromagnetic irradiation.

Abstract translation: 本发明涉及一种组合物，用于形成导电图案，在所有这是能够通过非常简单的工艺，以形成到各种聚合物树脂产品或树脂层的微细的导体图案，用于形成使用相同的导电图案的方法，以及 具有导电图案的树脂结构。 用于形成导电图案，其包括聚合物树脂的组合物; 和包含第一金属和第二金属，其中所述其他非导电性金属化合物具有包含第一层上的多个三维结构没有包含在第一和第二金属中的至少一种金属，并且具有非导电性金属化合物 共边八面体二维连接到海誓山盟，和第二层也包含与所述第一层不同的金属做的，并且在第一相邻层之间布置; 以及金属核包含第一或第二金属或离子的其从由电磁辐射的其它非导电性金属化合物形成。

公开(公告)号：EP2529395A4

公开(公告)日：2015-05-06

申请号：EP10844919

申请日：2010-11-10

Applicant: MACDERMID ACUMEN INC

Inventor： HAMILTON ROBERT ,  LONG ERNEST ,  KROL ANDREW M

IPC: H01L21/4763 ,  B05D3/06 ,  C23C18/16 ,  C23C18/20 ,  C23C18/38 ,  H01L21/44 ,  H01L23/04 ,  H05K3/18

CPC classification number: B05D3/06 ,  C23C18/1612 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/38 ,  H05K3/185 ,  H05K2201/0236 ,  H05K2201/09118 ,  H05K2203/0786 ,  H05K2203/107 ,  H05K2203/122

Abstract: A method of treating a laser-activated thermoplastic substrate having a metal compound dispersed therein is described. The substrate is contacted with an aqueous composition comprising: (i) a thiol functional organic compound; (ii) an ethoxylated alcohol surfactant; and (iii) xanthan gum. By use of the treatment composition, when the substrate is subsequently laser-activated and plated by electroless plating, extraneous plating of the substrate is substantially eliminated.

公开(公告)号：EP2247171B1

公开(公告)日：2015-04-22

申请号：EP08867811.5

申请日：2008-12-24

Applicant: FUJIFILM Corporation

Inventor： UEKI, Shiki

IPC: H05K3/18 ,  B32B15/08 ,  H05K1/03

CPC classification number: H05K3/181 ,  H05K1/0373 ,  H05K2201/0236 ,  Y10T428/31678

公开(公告)号：EP2581469A1

公开(公告)日：2013-04-17

申请号：EP11184516.0

申请日：2011-10-10

Applicant: Enthone, Inc.

Inventor： Bastenbeck, Edwin W. ,  Orschel, Harald, Dr. ,  Prinz, Ulrich, Dr.

IPC: C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  C23C18/30 ,  C23C18/22

CPC classification number: H05K3/182 ,  B05D3/005 ,  B05D5/12 ,  C23C18/1607 ,  C23C18/1641 ,  C23C18/166 ,  C23C18/204 ,  C23C18/2086 ,  C23C18/22 ,  C23C18/30 ,  C23C18/38 ,  C23C18/42 ,  H05K3/185 ,  H05K2201/0236

Abstract: The invention disclosed relates to an aqueous activator solution and a method for the electroless deposition of copper on a laser direct structured substrate surface. By the invention, an aqueous activator solution comprising a strong reducing agent is proposed to enhance the catalytic activity of the irradiated surface area of a LDS substrate.

Abstract translation: 游离缺失本发明光盘涉及在wässrige活化剂溶液和铜对激光直接结构化基底表面的无电沉积的方法。 通过本发明，底物到wässrige活化剂溶液，其包括一种强还原剂，提出以提高LDS的照射表面积的催化活性。