公开(公告)号：EP2481704A3

公开(公告)日：2014-01-01

申请号：EP12153320.2

申请日：2012-01-31

申请人： Honeywell International, Inc.

发明人： Foster, Michael

IPC分类号： B81B7/00

CPC分类号： B81B7/0074 ,  H01L23/544 ,  H01L2924/0002 ,  H01L2924/1461 ,  H01L2924/00

摘要： Sensor packages and methods for making a sensor device package for side mounting on a circuit board. A sensor device(s) in a mechanical layer (25) of silicon is sandwiched between first and second layers (24, 26) of glass to create a wafer. A first via(s) (30) is created in the first or second layers to expose a predefined area of the mechanical layer of silicon. A second via(s) (102) is created in the first or second layers. The least one second via has a depth dimension that is less than a depth dimension of the first via. A metallic trace (70, 72) is applied between the exposed area on the mechanical layer and a portion of the second via. The wafer is sliced such that the second via is separated into two sections, thereby creating a sensor die. The sensor die is then electrically and mechanically bonded to a circuit board at the sliced second via.

公开(公告)号：EP2674965A1

公开(公告)日：2013-12-18

申请号：EP12744234.1

申请日：2012-01-06

申请人： Shin-Etsu Handotai Co., Ltd.

发明人： OHTSUKI, Tsuyoshi ,  QU, Wei Feng ,  TAHARA, Fumio ,  OOI, Yuuki ,  MITANI, Kiyoshi

IPC分类号： H01L21/02 ,  H01L27/12

CPC分类号： H01L24/83 ,  H01L21/76254 ,  H01L21/76256 ,  H01L21/84 ,  H01L24/26 ,  H01L2224/83 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

摘要： The present invention provides a method for manufacturing a bonded substrate by bonding a base substrate to a bond substrate through an insulator film, including at least: a porous layer forming step of partially forming a porous layer or forming a porous layer whose thickness partially varies on a bonding surface of the base substrate; an insulator film forming step of changing the porous layer into the insulator film, and thereby forming the insulator film whose thickness partially varies on the bonding surface of the base substrate; a bonding step of bonding the base substrate to the bond substrate through the insulator film; and a film thickness reducing step of reducing a film thickness of the bonded bond substrate to form a thin-film layer. As a result, there is provided the method for manufacturing a bonded substrate that enables obtaining an insulator film whose thickness partially varies with use of a simple method.

摘要翻译： 本发明提供一种通过绝缘膜将基底基板粘合到接合基板上的方法，所述绝缘膜至少包括：多孔层形成步骤，部分地形成多孔层或形成厚度部分变化的多孔层 基底基板的接合面; 绝缘膜形成步骤，将多孔层改变为绝缘膜，从而形成厚度在基底基板的接合表面上部分变化的绝缘膜; 键合步骤，通过绝缘膜将基底衬底接合到接合衬底; 以及减薄接合的接合基板的膜厚以形成薄膜层的膜厚减小步骤。 结果，提供了一种能够通过简单的方法获得其厚度部分变化的绝缘膜的接合基板的制造方法。

公开(公告)号：EP2611950B1

公开(公告)日：2013-11-13

申请号：EP11760829.9

申请日：2011-07-08

申请人： Atotech Deutschland GmbH

发明人： PREISSER, Robert, F.

IPC分类号： C25D3/38 ,  C25D5/00 ,  C25D21/02 ,  C25D7/12 ,  C25D17/00 ,  H01L21/768 ,  H01L21/288

CPC分类号： C25D3/38 ,  C25D5/00 ,  C25D7/123 ,  C25D17/001 ,  C25D21/02 ,  H01L21/2885 ,  H01L21/76898 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/1461 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2224/32145 ,  H01L2924/00 ,  H01L2924/014

摘要： Process of electrodepositing a metal in a high aspect ratio via in a silicon substrate to form a through-silicon-via (TSV), utilizing an electrolytic bath including a redox mediator, in an electrolytic metal plating system including a chuck adapted to hold the silicon substrate and to heat the silicon substrate to a first temperature, a temperature control device to maintain temperature of the electrolytic bath at a second temperature, in which the first temperature is maintained in a range from about 30° C. to about 60° C. and the second temperature is maintained at a temperature (a) at least 5° C. lower than the first temperature and (b) in a range from about 15° C. to about 35° C.

摘要翻译： 在电解金属电镀系统中，利用包括氧化还原介体的电解浴，在硅衬底中以高纵横比通孔电沉积金属以形成硅通孔（TSV）的工艺，所述电解金属电镀系统包括适于保持硅 并将硅衬底加热到​​第一温度;温度控制装置，将电解槽的温度保持在第二温度，其中第一温度保持在约30℃至约60℃的范围内 并且第二温度保持在比第一温度低至少5℃的温度（a）和（b）在约15℃至约35℃的范围内

公开(公告)号：EP2501154A4

公开(公告)日：2013-11-13

申请号：EP10839446

申请日：2010-12-22

申请人： FUNAI ELECTRIC CO

发明人： TANAKA FUMINORI ,  HORIBE RYUSUKE ,  UMEDA SHUJI ,  INODA TAKESHI

IPC分类号： H04R1/38 ,  H04R1/02 ,  H04R3/00 ,  H04R19/04

CPC分类号： H04R19/04 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/3025 ,  H04R1/38 ,  H04R1/406 ,  H04R3/005 ,  H04R2499/11 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2493273A4

公开(公告)日：2013-10-16

申请号：EP10824714

申请日：2010-08-04

申请人： FUJIKURA LTD

发明人： YAMAMOTO SATOSHI ,  HIRANO HIROYUKI ,  SUZUKI TAKANAO

IPC分类号： H05K1/11 ,  H05K1/18 ,  H05K3/40

CPC分类号： H01L21/486 ,  H01L23/3107 ,  H01L23/49827 ,  H01L25/0657 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/09701 ,  H01L2924/1461 ,  H05K1/113 ,  H05K3/101 ,  H05K2201/09263 ,  H05K2201/09836 ,  H05K2201/10545 ,  Y10T29/49165 ,  H01L2924/00

摘要： Provided is a device packaging structure including: an interposer substrate including a substrate, and a plurality of through-hole interconnections formed inside a plurality of through-holes passing through the substrate from a first main surface toward a second main surface, the first main surface being one main surface of the substrate, the second main surface being the other main surface thereof; a first device which includes a plurality of electrodes and is arranged so that these electrodes face the first main surface; and a second device which includes a plurality of electrodes of which an arrangement is different from an arrangement of each of the electrodes of the first device, and is arranged so that these electrodes face the second main surface. Each of the through-hole interconnections includes a first conductive portion, provided at a position corresponding to the electrode of the first device, on the first main surface, and a second conductive portion, provided at a position corresponding to the electrode of the second device, on the second main surface, each electrode of the first device is electrically connected to the first conductive portion, each of the electrodes of the second device is electrically connected to the second conductive portion, and each of the through-hole interconnections includes a linear portion vertically extending from at least one of the first main surface and the second main surface.

公开(公告)号：EP2644563A2

公开(公告)日：2013-10-02

申请号：EP13169983.7

申请日：2008-01-23

申请人： STMicroelectronics S.r.l.

发明人： Baldo, Lorenzo ,  Combi, Chantal ,  Cortese, Mario Francesco

IPC分类号： B81B7/00 ,  G01L19/00 ,  G01L13/02 ,  G01D11/24

CPC分类号： B81B7/0061 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81C2203/0154 ,  G01L19/141 ,  G01L19/147 ,  G01L19/148 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2924/00

摘要： Electronic device (1, 1a, 1b, 1c, 1d, 1e) which comprises:
- a substrate (2) provided with at least one passing opening (5),
- a MEMS device (7) with function of differential sensor provided with a first and a second surface (9, 10) and of the type comprising at lesat one portion (11) sensitive to chemical and/or physical variations of fluids present in correspondence with a first and a second opposed active surface (11a, 11b) thereof, the first surface (9) of the MEMS device (7) leaving the first active surface (11 a) exposed and the second surface (10) being provided with a further opening (12) which exposes said second opposed active surface (11b), the electronic device (1, 1d, 1e) being characterised in that the first surface (9) of the MEMS device (7) faces the substrate (2) and is spaced therefrom by a predetermined distance, the sensitive portion (11) being aligned to the passing opening (5) of the substrate (2), and in that it also comprises
- a protective package (14, 14a, 14b), which incorporates at least partially the MEMS device (7) and the substrate (2) so as to leave the first and second opposed active surfaces (11a, 11b) exposed respectively through the passing opening (5) of the substrate (2) and the further opening (12) of the second surface (10).

摘要翻译： 电子设备（1,1a，1b，1c，1d，1e）包括： - 设置有至少一个通过开口（5）的基板（2）， - 具有差动传感器功能的MEMS装置（7） 第一和第二表面（9,10），并且其类型包括对于与第一和第二相对的有效表面（11a，11b）相对应存在的流体的化学和/或物理变化敏感的一部分（11） 离开第一有源表面（11a）的MEMS器件（7）的第一表面（9）暴露，并且第二表面（10）设置有暴露所述第二相对的有效表面（11b）的另外的开口（12） 所述电子设备（1d，1e）的特征在于，所述MEMS器件（7）的所述第一表面（9）面向所述基板（2）并且与所述第一表面（9）隔开预定距离，所述敏感部分 对准衬底（2）的通过开口（5），并且其还包括 - 保护性封装（14,14a，14b） ），其至少部分地结合MEMS器件（7）和衬底（2），以便分别暴露于通过衬底（2）的通过开口（5）的第一和第二相对的有效表面（11a，11b） 和第二表面（10）的另一个开口（12）。

公开(公告)号：EP2006248B1

公开(公告)日：2013-09-04

申请号：EP08158292.6

申请日：2008-06-13

申请人： Honeywell International Inc.

发明人： Eskridge, Mark H. c/o Honeywell Int. Inc.

IPC分类号： B81B7/00

CPC分类号： B81B7/0048 ,  B81B2201/0235 ,  B81B2201/0242 ,  H01L2224/0554 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/05001 ,  H01L2224/0555 ,  H01L2224/0556

摘要： One method of the present invention includes preparing a die (24) with traces and pads as desired for the intended use of the die (24). A MEMS device (22) is mounted to the die (24). The die is then mounted to a substrate of the same material as the die (24). The substrate is then mounted to a package (28). The die (24) and/or the substrate may be flip-chip mounted.

公开(公告)号：EP1978559A3

公开(公告)日：2013-08-28

申请号：EP08006816.6

申请日：2008-04-03

申请人： Hitachi, Ltd.

发明人： Fujiwara, Shinichi

IPC分类号： H01L23/485 ,  H01L21/60

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05655 ,  H01L2224/11334 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/1148 ,  H01L2224/1183 ,  H01L2224/11831 ,  H01L2224/1184 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/13019 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13166 ,  H01L2224/16238 ,  H01L2224/81022 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/81207 ,  H01L2224/81345 ,  H01L2224/81385 ,  H01L2224/81409 ,  H01L2224/81411 ,  H01L2224/81416 ,  H01L2224/81424 ,  H01L2224/81455 ,  H01L2224/8183 ,  H01L2224/831 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1461 ,  H01L2924/15787 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/00

摘要： In a structure for connecting a semiconductor element having a fine pitch electrode at 50 µm pitch or less and a pad or wirings on a substrate, for preventing inter-bump short-circuit or fracture of a connected portion due to high strain generated upon heating or application of load during connection, the substrate and the semiconductor element are connected by way of a bump having a longitudinal elastic modulus (Young's modulus) of 65 GPa or more and 600 GPa or less and a buffer layer including one of tin, aluminum, indium, or lead as a main ingredient and, further, protrusions are formed to at least one of opposing surfaces of the bump and the pad or the wirings on the substrate to each other, and the surfaces are connected by ultrasonic waves.

公开(公告)号：EP2624290A2

公开(公告)日：2013-08-07

申请号：EP13166078.9

申请日：2009-04-03

申请人： The Charles Stark Draper Laboratory, Inc.

发明人： Racz, Livia M. ,  Tepolt, Gary B. ,  Thompson, Jeffrey C. ,  Langdo, Thomas A. ,  Mueller, Andrew J.

IPC分类号： H01L21/68 ,  H01L23/538 ,  H01L25/10 ,  H01L21/60 ,  B81C1/00 ,  H01L23/13

CPC分类号： H01L21/486 ,  B81B2207/012 ,  B81C1/00333 ,  B81C2201/019 ,  B81C2201/0191 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49827 ,  H01L24/19 ,  H01L24/24 ,  H01L24/82 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68377 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/73267 ,  H01L2224/8203 ,  H01L2224/92144 ,  H01L2224/9222 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01084 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  Y10T29/49124 ,  H01L2924/00

摘要： An interposer comprises a substrate and a plurality of posts. Each of the posts extends substantially through a thickness of the substrate. A method for forming an interposer comprises forming a fill hole in a first side of a substrate and a cavity in a second side of the substrate. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity. An encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts.

摘要翻译： 内插器包括基板和多个柱。 每个柱基本上延伸穿过衬底的厚度。 一种用于形成中介层的方法包括在衬底的第一侧中形成填充孔并且在衬底的第二侧中形成空腔。 腔体与填充孔流体连通。 多个柱形成在空腔中。 通过填充孔将密封剂注入空腔中以封装多个柱。

公开(公告)号：EP2468358B1

公开(公告)日：2013-08-07

申请号：EP12153925.8

申请日：2003-06-27

申请人： Boston Scientific Neuromodulation Corporation

发明人： Parramon, Jordi ,  Haller, Matthew I. ,  Marnfeldt, Goran N. ,  McClure, Kelly H.

IPC分类号： A61N1/372 ,  A61N1/378 ,  A61N1/375 ,  A61N1/36 ,  G08C17/02 ,  H04L27/02 ,  H04L27/10 ,  H04W52/02

CPC分类号： A61N1/37276 ,  A61N1/36007 ,  A61N1/3605 ,  A61N1/37205 ,  A61N1/37217 ,  A61N1/37223 ,  A61N1/37229 ,  A61N1/37235 ,  A61N1/3727 ,  A61N1/375 ,  A61N1/3787 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48465 ,  H01L2224/49175 ,  H01L2924/00011 ,  H01L2924/1461 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H02J7/025 ,  H02J7/345 ,  H04B5/0037 ,  H04B5/0081 ,  H04L27/02 ,  H04L27/10 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49826 ,  Y10T29/49945 ,  Y10T29/49968 ,  Y10T428/12264 ,  Y10T428/12271 ,  Y10T428/12347 ,  Y10T428/12375 ,  Y10T428/12396 ,  Y10T428/12535 ,  Y10T428/12806 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01033