Abstract:
The invention concerns a coating composition which may be used to form a peelable solder mask. The coating composition comprises a mixture of vinylic resin, microcrystalline wax and solvent. Applied as a film coating, the coating composition can be used to provide a temporary mask to selected areas of a substrate, for example, a printed circuit, prior to exposure to a solder flux, the mask being readily peelable from the substrate.
Abstract:
Die Erfindung betrifft ein Verfahren zum Herstellen von haftfesten Metallschichten auf Kunststoffsubstraten durch Strukturieren der zu beschichtenden Substratoberfläche vor dem Metallisieren. Auf die zu metallisierende Substratoberfläche (1) werden nacheinander eine Glasharzschicht (2) und eine Photoresistschicht (3) aufgetragen. Die Photoresistschicht (3) wird mittels reaktiven lonenätzens in einem CF 4 -Plasma mit relativ hoher Energiedichte aufgerauht. Die resultierende Rauhigkeit der Photoresistschicht (3) wird mittels reaktiven lonenätzens als Lochstruktur in die Glasharzschicht (2) übertragen. Diese dient als Maske in einem reaktiven lonenätzprozeß mit einem Sauerstoffplasma, bei dem Vertiefungen (4) vertikal in die Substratoberfläche (1) geätzt werden. Durch weiteres reaktives lonenätzen mit einem Sauerstoffplasma werden diese vertieft, und es wird eine Überhangstruktur (5) erzeugt. Auf der so vorbereiteten Substratoberfläche (1) werden nach Entfernen der Glasharzschicht (2) eine dünne Metallschicht (6) aufgesputtert und eine Metallschicht (7) stromlos abgeschieden. Es können auch unter Verwendung einer Photoresistmaske mittels Additivtechnik Leiterbahnen stromlos abgeschieden werden. Durch die definierte Oberflächenstruktur des Substrats lassen sich die Haftfestigkeiten der aufmetallisierten Schichten um ein Vielfaches verbessern.
Abstract:
A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
Abstract:
A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
Abstract:
A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
Abstract:
A method comprising forming a substrate scaffold structure for use in the fabrication of a reversibly deformable circuit board, the substrate scaffold structure comprising a predefined waveform topography onto which one or more scaffold-conforming thin film layers can be deposited for use in forming electronic circuit elements of the reversibly deformable circuit board, the waveform topography of the substrate scaffold structure predefined to facilitate operational reversible deformation of the circuit board.
Abstract:
The present invention provides a fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals. The present invetion also provides a reinforced laminate comprising: (a) at least one matrix material; and (b) at least one fabric comprising at least one fiber strand comprising a plurality of fibers and having a resin compatible coating composition on at least a surface of the at least one fiber strand, wherein the at least one fiber strand has an Air Jet Transport Drag Force value of greater than 100,000 gram force per gram mass of strand as determined by a needle air jet nozzle unit having an internal air jet chamber having a diameter of 2 millimeters and a nozzle exit tube having a length of 20 centimeters at a strand feed rate of 274 meters per minute and an air pressure of 310 kiloPascals.