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    Multilayer wiring structure and method for forming multilayer construction
    73.
    发明公开
    Multilayer wiring structure and method for forming multilayer construction 失效
    多层布线结构和形成多层结构的方法

    公开(公告)号：EP0499986A3

    公开(公告)日：1995-03-08

    申请号：EP92102530.0

    申请日：1992-02-14

    Applicant: HITACHI, LTD.

    Inventor： Tawata, Rie ,  Numata, Shunichi ,  Miwa, Takao ,  Fujisaki, Koji ,  Ikeda, Takayoshi ,  Okabe, Yoshiaki ,  Shimanoki, Hisae

    IPC: H05K1/03 ,  H05K1/00 ,  H05K3/46

    CPC classification number: H05K3/4655 ,  H01L23/49894 ,  H01L2924/0002 ,  H05K1/0346 ,  H05K3/4644 ,  H05K3/4652 ,  H05K3/4673 ,  H05K3/4676 ,  H05K2201/0154 ,  H05K2201/0195 ,  H05K2201/068 ,  H05K2203/0759 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49163 ,  Y10T428/31721 ,  H01L2924/00

    Abstract: Low-thermal-expansivity polyimides have a linear rigid skeleton, so that adhesion between perfectly cured low-thermal-expansivity polyimide films is very low. On the other hand, a film of a polyimide (2, 4, 6) having a flexible skeleton shows high adhesiveness even after perfect curing, so that it is possible to enhance adhesion between the low-thermal-expansivity polyimide films (3, 7) by interposing a polyimide having a flexible skeleton. A flexible polyimide thin film (2, 4, 6) is formed as a highly adhesive film on a low-thermal-expansivity polyimide film (3, 7) n a half-cured state, then metallic wiring (5) is applied thereon, followed by formation of another highly adhesive thin film (2, 4, 6) in a half-cured state, and then a low-thermal-expansivity polyimide film (3, 7) is further formed thereon. It is possible to provide a multilayer wiring structure which has improved adhesion between the low-thermal-expansivity polyimide film (3, 7) and the wiring pattern layer (5) or the substrate.

    Abstract translation: 低热膨胀性聚酰亚胺具有线性刚性骨架，因此完全固化的低热膨胀性聚酰亚胺膜之间的粘合性非常低。 另一方面，具有挠性骨架的聚酰亚胺（2,4,6）的膜即使在完全固化后也表现出高粘合性，从而可以提高低热膨胀性聚酰亚胺膜（3,7 ）通过插入具有柔性骨架的聚酰亚胺而形成。 在低热膨胀性聚酰亚胺膜（3,7）的半固化状态下形成柔性聚酰亚胺薄膜（2,4,6）作为高粘附性膜，然后在其上施加金属布线（5） 通过形成处于半固化状态的另一高粘性薄膜（2,4,6），然后在其上进一步形成低热膨胀性聚酰亚胺膜（3,7）。 可以提供具有改进的低热膨胀性聚酰亚胺膜（3,7）和布线图案层（5）或衬底之间的粘合性的多层布线结构。

    A heat-transferring circuit substrate with limited thermal expansion and method for making same
    76.
    发明公开
    A heat-transferring circuit substrate with limited thermal expansion and method for making same 失效
    用其生产有限的热膨胀和方法传热电路基板。

    公开(公告)号：EP0550999A1

    公开(公告)日：1993-07-14

    申请号：EP92311673.5

    申请日：1992-12-21

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Jha, Sunil C. ,  Forster, James A.

    IPC: H01L23/373 ,  H01L21/48 ,  H05K1/05 ,  B23K20/04

    CPC classification number: B32B15/015 ,  B23K20/02 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K1/05 ,  H05K2201/068 ,  H05K2203/0323 ,  Y10T428/12486 ,  Y10T428/12632 ,  H01L2924/00

    Abstract: Layers of copper (10) and Invar (12) are cold pressure rolled with reduction in thickness to be metallurgically bonded together in interleaved relation, and strips (20) of the bonded materials are cold pressure rolled together a plurality of times with reduction in thickness to be metallurgically bonded together to form a metal composite (208) and to break up the layers of Invar in the composite, thereby to distribute portions of the Invar material (12.1) in a copper matrix (10.1) to limit thermal expansion of the composite while permitting the matrix to extend in continuous phase along three mutually perpendicular axes through the composite substantially free of diffusion between the copper and Invar materials.

    Abstract translation: 铜（10）和因瓦合金（12）的层具有厚度减小轧制冷压力，以在交错关系来冶金结合在一起，并且结合材料的条带（20）的冷压力卷在一起的次多个与厚度减小 被冶金结合到一起以形成金属复合物（208）和以破碎殷钢的各层中复合，从而在铜基质（10.1）分发殷钢材料（12.1）的部分，以限制该复合材料的热膨胀 同时允许基质在连续相中沿三个相互垂直的轴线穿过复合基本上不含铜和殷钢材料之间的扩散的延伸。

    Metallfolie mit einer strukturierten Oberfläche
    78.
    发明公开
    Metallfolie mit einer strukturierten Oberfläche 失效
    Metallfolie mit einer strukturiertenOberfläche。

    公开(公告)号：EP0508946A1

    公开(公告)日：1992-10-14

    申请号：EP92810184.9

    申请日：1992-03-12

    Applicant: Dyconex AG

    Inventor： Schmidt, Walter, Dr. ,  Martinelli, Marco

    IPC: B32B15/08 ,  H05K3/38

    CPC classification number: B32B15/08 ,  B29C37/0082 ,  B32B3/30 ,  B32B2311/12 ,  B32B2457/08 ,  C23F1/02 ,  H05K1/056 ,  H05K3/064 ,  H05K3/383 ,  H05K3/384 ,  H05K3/44 ,  H05K2201/0338 ,  H05K2201/0373 ,  H05K2201/068 ,  H05K2203/0323 ,  H05K2203/0723

    Abstract: Die Oberfläche einer Metallfolie, wie sie namentlich als Zwischenlage in Leiterplatten Verwendung findet, wird auf photochemischem Weg aufgerauht. Die Teilschritte basieren auf gängigen Verfahrensschritten. Es werden feine Vertiefungen aus der Metallschicht herausgeätzt oder Erhöhungen aufplattiert. Die Anwendung des Verfahrens bzw. die Verwendung der Folie bei der Herstellung mehrlagiger Leiterplatten mit Schichten unterschiedlicher Wärmedehnung verbessert die Haftung mit der darauf angebrachten, nächsten Leiterbahnenlage wesentlich und verhindert ein delaminieren.

    Abstract translation: 用作电路板中的中间层的金属箔的表面以光化学方式进行粗糙化。 部分阶段基于常规工艺阶段。 从金属层中蚀刻出细小的凹陷，或者在其上镀上高度。 该方法的应用和在制造具有不同热膨胀层的多层电路板中的薄膜的使用基本上改善了对其上施加的下一个导体带材层的粘附性并防止分层。

    FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING
    79.
    发明公开
    FLEXIBLE PRINTED CIRCUIT BOARD AND ITS MANUFACTURING 失效
    灵活的LEITERPLATTE UND HERSTELLUNGSVERFAHREN。

    公开(公告)号：EP0498898A1

    公开(公告)日：1992-08-19

    申请号：EP91915723.0

    申请日：1991-09-03

    Applicant: CHISSO CORPORATION

    Inventor： HASE, Hiroaki ,  KIKUTA, Kazutsune ,  TAKAHASHI, Atsushi ,  KONOTSUNE, Shiro

    IPC: H05K1/03 ,  H05K3/30 ,  H05K3/38 ,  B32B15/08

    CPC classification number: B32B15/08 ,  B32B27/281 ,  B32B2307/30 ,  B32B2307/51 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0346 ,  H05K1/036 ,  H05K1/0393 ,  H05K2201/0154 ,  H05K2201/0358 ,  H05K2201/068 ,  Y10T428/24917 ,  Y10T428/31678 ,  Y10T428/31681

    Abstract: A flexible printed circuit board having a polyimide film formed by a method wherein a polyimide precursor is directly applied on a metallic conductor foil, dried, heated and cured. The polyimide film comprises two or more laminated layers. The coefficient of thermal linear expansion of at least one polyimide layer except for the first polyimide layer in contact with the metallic conductor foil is larger than that of the first polyimide layer. Also, the thicknesses and curls of the laminated layers of the polyimide film satisfy the following equations: 3.0 n-1 X t n n-1 > t n , where t n is the thickness (µm) of the outermost polyimide layer (n-th layer), t n-1 is the thickness (µm) of from the first to the (n-1)-th layers, and Q n-1 is twice the value (cm) of the radius of curvature of the curl of the film of from the first to the (n-1)-th layers. This board does not curl just after the curing, and even after forming a circuit by etching.

    Abstract translation: 一种柔性印刷电路板，其具有通过将聚酰亚胺前体直接涂布在金属导体箔上的方法形成的聚酰亚胺膜，干燥，加热固化。 聚酰亚胺膜包含两层或多层叠层。 除了与金属导体箔接触的第一聚酰亚胺层之外的至少一个聚酰亚胺层的热线性膨胀系数大于第一聚酰亚胺层的热线性膨胀系数。 此外，聚酰亚胺膜的层叠层的厚度和卷曲满足以下等式：3.0 tn，其中tn是最外层聚酰亚胺层（第n层）的厚度（μm），tn-1是从第一至第（n-1）层的厚度（μm） 层和Qn-1是从第一层到第（n-1）层的膜的卷曲的曲率半径的值（cm）的两倍。 该板在固化后即使在通过蚀刻形成电路之后也不会卷曲。

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