公开(公告)号：EP2117082B1

公开(公告)日：2016-05-18

申请号：EP06822495.5

申请日：2006-10-27

Applicant: Asahi Denka Kenkyusho Co., Ltd.

Inventor： MIZOGUCHI, Masanori

IPC: H01R12/77 ,  H01R12/78 ,  H01R12/79 ,  H05K3/32 ,  H05K3/36 ,  H01R12/58 ,  H01R12/62 ,  H01R12/59 ,  H01R12/61 ,  H05K1/11 ,  H05K3/40

CPC classification number: H01R12/592 ,  H01R12/58 ,  H01R12/613 ,  H01R12/62 ,  H01R12/777 ,  H01R12/778 ,  H01R12/78 ,  H01R12/79 ,  H05K1/118 ,  H05K3/326 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/091 ,  H05K2201/0969 ,  H05K2201/1059 ,  H05K2201/209

公开(公告)号：EP2957154A1

公开(公告)日：2015-12-23

申请号：EP14703896.2

申请日：2014-02-12

Applicant: IMEC VZW ,  Universiteit Gent

Inventor： VAN KEYMEULEN, Bjorn ,  BOSSUYT, Frederick ,  VERVUST, Thomas

IPC: H05K1/03 ,  H05K1/18 ,  D03D1/00 ,  A41D1/00

CPC classification number: H05K1/038 ,  A41D1/002 ,  H05K1/0283 ,  H05K1/189 ,  H05K3/0026 ,  H05K3/321 ,  H05K3/46 ,  H05K2201/0263 ,  H05K2201/0969 ,  H05K2201/10977 ,  H05K2203/107

Abstract: The present disclosure relates to a method of integrating a interposer device with a textile layer, wherein the interposer device is a stretchable interposer device comprising a stretchable electrically conductive structure with at least one contact pad for establishing at least one electrically conductive path towards the textile layer. The interposer device is arranged to be mechanically attached to a textile layer comprising a plurality of yarns, at least one of which is an electrically conductive yarn. An electrical connection is established between the at least one conductive yarn of the textile layer and the at least one contact pad, which electrical connection is established after the interposer device has been mechanically attached to the textile layer.

公开(公告)号：EP1986478B1

公开(公告)日：2015-12-09

申请号：EP08007115.2

申请日：2008-04-10

Applicant: DENSO CORPORATION

Inventor： Watanabe, Tatsuya ,  Imoto, Masahiko ,  Iiboshi, Hideyuki ,  Awano, Shinichi

IPC: H05K1/11 ,  H05K3/20

CPC classification number: H05K3/3442 ,  H01L2924/0002 ,  H05K1/111 ,  H05K1/183 ,  H05K3/202 ,  H05K2201/0382 ,  H05K2201/062 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/09745 ,  H05K2201/10636 ,  H05K2201/2081 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00

公开(公告)号：EP2932806A1

公开(公告)日：2015-10-21

申请号：EP13811340.2

申请日：2013-12-09

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： TUOMINEN, Mikal ,  FISCHENEDER, Martin

IPC: H05K1/02

CPC classification number: H05K1/0253 ,  H01P3/08 ,  H05K1/0225 ,  H05K1/0245 ,  H05K2201/09272 ,  H05K2201/0969

Abstract: A printed circuit board that includes conductive layers separated by insulation layers of dielectric material, at least one conductive layer being patterned and having at least one signal line embedded in an insulation material, whereby a conductive ground plan layer, separated by the insulation material and lying in a predetermined distance (d) from the at least one signal line includes a ground plane area associated to and extending along the at least one signal line, the conductive layer associated to and extending along the at least one signal line is provided with openings therein. Preferably the openings are spaces between conducting stripes, extending, seen from above, across the at least one signal line, the conducting stripes being integrally connected with the conductive remainder of the conductive layer.

Abstract translation: 一种印刷电路板（9），包括由介电材料的绝缘层（14,16）分开的导电层（11,15,21），至少一个导电层（11,15）被图案化并且具有至少一个信号线（ 其中嵌入绝缘材料（10,14,16）中的由绝缘材料隔开并与所述至少一个信号线隔开预定距离（d）的导电接地平面层（15）包括 与所述至少一个信号线关联并且沿着所述至少一个信号线延伸的接地平面区域（17），与所述至少一个信号线（12,13）关联并且沿着所述至少一个信号线（12,13）延伸的所述导电层（15）在其中设置有开口（18）。 优选地，开口（18）是导电条（19）之间的空间，从上方看穿过至少一条信号线延伸，导电条与导电层（15）的导电剩余物（20）整体连接。

公开(公告)号：EP2147464B1

公开(公告)日：2015-10-21

申请号：EP08736587.0

申请日：2008-04-25

Applicant: International Business Machines Corporation

Inventor： WEEKLY, Roger, Donell ,  HARIDASS, Anand ,  CHUN, Sungjun

IPC: H05K1/02 ,  H01L23/66 ,  H01L23/498 ,  H05K3/46 ,  H05K1/11

CPC classification number: H01L21/76879 ,  H01L23/66 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/3011 ,  H05K1/0253 ,  H05K1/112 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/09627 ,  H05K2201/0969 ,  H01L2224/0401

Abstract: An integrated circuit substrate is designed and fabricated with a selectively applied transmission line reference plane metal layer to achieve signal path shielding and isolation, while avoiding drops in impedance due to capacitance between large diameter vias and the transmission line reference plane metal layer. The transmission line reference plane defines voids above (or below) the signal-bearing plated-through holes (PTHs) that pass through a rigid substrate core, so that the signals are not degraded by an impedance mismatch that would otherwise be caused by shunt capacitance from the top (or bottom) of the signal-bearing PTHs to the transmission line reference plane. For voltage-plane bearing PTHs, no voids are introduced, so that signal path conductors can be routed above or adjacent to the voltage-plane bearing PTHs, with the transmission line reference plane preventing shunt capacitance between the signal path conductors and the PTHs.

公开(公告)号：EP2574155B1

公开(公告)日：2015-07-29

申请号：EP11844521.2

申请日：2011-09-30

Applicant: Murata Manufacturing Co., Ltd.

Inventor： KATO Noboru

IPC: H05K1/02 ,  H01P3/08 ,  H01P3/12 ,  H05K1/11 ,  H01P1/203 ,  H05K1/03

CPC classification number: H01P3/003 ,  H01P1/20363 ,  H01P3/08 ,  H01P3/085 ,  H03H7/38 ,  H05K1/0221 ,  H05K1/0225 ,  H05K1/0242 ,  H05K1/0253 ,  H05K1/028 ,  H05K2201/09618 ,  H05K2201/0969 ,  H05K2201/09727

公开(公告)号：EP2548421B1

公开(公告)日：2015-02-25

申请号：EP11709694.1

申请日：2011-03-16

Applicant: Robert Bosch GmbH

Inventor： HEIM, Michael ,  BRAUN, Sigmund

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

公开(公告)号：EP2312916B1

公开(公告)日：2014-12-31

申请号：EP10186521.0

申请日：2010-10-05

Applicant: IBIDEN CO., LTD.

Inventor： Tsukada, Kiyotaka ,  Muraki, Tetsuya

IPC: H05K3/20 ,  H05K1/02 ,  H05K1/18 ,  H01L23/14 ,  H01L23/373

CPC classification number: H05K3/202 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49811 ,  H01L23/49833 ,  H01L25/072 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H05K3/28 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/0969 ,  H05K2201/10166 ,  H05K2201/10303 ,  H01L2924/00

Abstract: A circuit board ( 10 ) comprises a first conductive post ( 31 ) for electrically connecting to the collector electrode of a semiconductor device ( 50 ), a first metal plate ( 11 ) connecting to the first conductive post ( 31 ), a second conductive post ( 32 ) for electrically connecting to the gate electrode ( 52 ) of the semiconductor device ( 50 ), a second metal plate ( 12 ) connecting to the second conductive post ( 32 ), a third conductive post ( 33 ) for electrically connecting to the emitter electrode ( 53 ) of the semiconductor device ( 50 ), and a third metal plate ( 13 ) connecting to the third conductive post ( 33 ).

公开(公告)号：EP2618642A3

公开(公告)日：2014-08-06

申请号：EP13151202.2

申请日：2013-01-14

Applicant: Xerox Corporation

Inventor： Freitag, Chad D. ,  Newton, Tygh ,  Slenes, Chad J.

IPC: H05K1/11

CPC classification number: H05K3/4007 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K3/321 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/09681 ,  H05K2201/0969

Abstract: An electrical interconnect has a circuit substrate (208) and an electrical connection point (202) on the circuit substrate. The electrical connection point includes a lattice (212) of conductive material that is adjacent a gap (210) in the circuit substrate and has anchor points (214) that are attached to the circuit substrate. In some configurations, a conductive epoxy (206) encapsulates at least a portion of the lattice of conductive material and may include a second electrical connection point that is bonded to the other electrical connection point through the conductive epoxy.

公开(公告)号：EP2728978A1

公开(公告)日：2014-05-07

申请号：EP12874364.8

申请日：2012-12-04

Applicant: Shanghai Tianma Micro-Electronics Co., Ltd.

Inventor： HUANG, Zhongshou ,  LI, Jialing ,  MA, Jun

IPC: H05K1/11 ,  H01R11/01 ,  G06F3/044

CPC classification number: H05K1/144 ,  G02F1/13338 ,  G02F2201/122 ,  G02F2202/28 ,  G02F2203/01 ,  G06F3/0416 ,  G06F3/044 ,  H05K1/111 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/0108 ,  H05K2201/042 ,  H05K2201/0969 ,  H05K2201/10136 ,  Y02P70/611

Abstract: The invention discloses a connection apparatus for electrically conductive pads and a touch control screen. The connection apparatus for electrically conductive pads disclosed according to the invention includes a first substrate and a second substrate arranged in opposition, wherein a plurality of first electrically conductive pads are arranged on the inside of the first substrate, and a plurality of second electrically conductive pads are arranged on the inside of the second substrate; electrically conductive glue is arranged between the first electrically conductive pads and the second electrically conductive pads; and the first electrically conductive pads each include a first body, the second electrically conductive pads each include a second body, and the first body and/or the second body includes a hollow portion or portions. The connection apparatus for electrically conductive pads disclosed according to the invention includes the foregoing electrically conductive pads with a hollow portion(s), light rays can be transmitted through the electrically conductive pads to illuminate the electrically conductive glue between the upper and lower electrically conductive pads to have the electrically conductive glue solidified at a desired level for the purpose of bonding and interconnecting the upper and lower electrically conductive pads.

Abstract translation: 本发明公开了一种用于导电焊盘和触摸控制屏的连接装置。 根据本发明公开的用于导电焊盘的连接装置包括第一基板和布置成相对布置的第二基板，其中多个第一导电焊盘布置在第一基板的内侧，并且多个第二导电焊盘 布置在第二基板的内侧; 导电胶被布置在第一导电焊盘和第二导电焊盘之间; 并且所述第一导电焊盘各自包括第一主体，所述第二导电焊盘各自包括第二主体，并且所述第一主体和/或所述第二主体包括中空部分。 根据本发明公开的用于导电焊盘的连接装置包括具有中空部分的上述导电焊盘，光线可以透过导电焊盘传输，以照亮上和下导电焊盘之间的导电胶 以使导电胶固化在期望的水平，以便键合和互连上和下导电焊盘。