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    ANORDNUNG MIT EINEM ELEKTRISCHEN LEITERBAHNTRÄGER UND EINEM OPTOELEKTRONISCHEN BAUELEMENT SOWIE VERFAHREN ZUM HERSTELLEN EINER SOLCHEN ANORDNUNG
    74.
    发明公开
    ANORDNUNG MIT EINEM ELEKTRISCHEN LEITERBAHNTRÄGER UND EINEM OPTOELEKTRONISCHEN BAUELEMENT SOWIE VERFAHREN ZUM HERSTELLEN EINER SOLCHEN ANORDNUNG 审中-公开
    和导电体的载体和光电子器件和方法安排生产这种安排

    公开(公告)号：EP2409189A1

    公开(公告)日：2012-01-25

    申请号：EP10706902.3

    申请日：2010-01-21

    Applicant: U2t Photonics Ag

    Inventor： MATISS, Andreas ,  JACOB, Alexander ,  LEONHARDT, Christoph

    IPC: G02B6/42

    CPC classification number: H05K1/0243 ,  G02B6/4201 ,  G02B6/4274 ,  H05K1/024 ,  H05K3/3421 ,  H05K2201/09909 ,  H05K2201/10121 ,  H05K2201/10977 ,  Y10T29/49144

    Abstract: The invention relates, among other things, to an assembly (10), comprising an electric conductive track carrier (20) and a component (30) arranged on the conductive track carrier. According to the invention, the component is a fiber-optoelectronic component and comprises: a housing (40), at least one electro-optic or optoelectronic component (50), at least one fiber-optic interface (60) connected to the electro-optic or optoelectronic component, and at least one electric interface (80) for connecting the component to the conductive track carrier, wherein the electric interface comprises at least one bent electric soldered connection element (100), the one end (110) of which is attached to a bottom connection section (120) of the housing bottom (125) and from there extends laterally outwardly such that the other end (130) of the soldered connection element – as viewed from above – protrudes laterally and is laterally soldered to the conductive track carrier outside of the outer housing contour (140), and wherein the soldered connection element is bent away from the bottom connection section such that the bottom connection section has a distance (A) from the conductive track carrier.

    METHOD FOR ELECTROCONDUCTIVE CIRCUIT FORMATION
    78.
    发明授权
    METHOD FOR ELECTROCONDUCTIVE CIRCUIT FORMATION 有权
    方法为进行电路培训

    公开(公告)号：EP1976352B1

    公开(公告)日：2010-09-29

    申请号：EP07707217.1

    申请日：2007-01-23

    Applicant: SANKYO KASEI CO., LTD.

    Inventor： YUMOTO, Tetsuo

    IPC: H05K3/18 ,  H05K3/00 ,  H05K1/03

    CPC classification number: H05K3/184 ,  H05K1/0373 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/0158 ,  H05K2201/0212 ,  H05K2201/09118 ,  H05K2201/09909 ,  H05K2203/0773

    Abstract: An electroconductive circuit, in which a masking material and a base both have a low dielectric loss tangent to a high-frequency signal and have excellent adhesion to each other, can be formed in a simple and low-cost manner. A cycloolefin resin with a flexible polymer mixed and dispersed therein is injection molded to form a primary base (1), and a cycloolefin resin, in which a compatible flexible polymer has not been mixed, is injection molded on the surface of the primary base (1) to form a masking layer (2). Since the cycloolefin resin per se has etching resistance, for only the surface of the primary base (1) not covered with the masking layer (2), that is, only a part (1a) on which an electroconductive circuit is to be formed, the flexible polymer is dissolved for roughening and only the part (1a) can be rendered hydrophilic. Accordingly, an electroconductive layer (4) can be selectively formed by electroless plating only onto the part (1a) not covered with the masking layer (2).

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