MULTI-PART FLEXIBLE ENCAPSULATION HOUSING FOR ELECTRONIC DEVICES
    5.
    发明公开
    MULTI-PART FLEXIBLE ENCAPSULATION HOUSING FOR ELECTRONIC DEVICES 审中-公开
    柔性机器人VERKAPSELUNGSGEHÄUSEFÜRELEKTRONISCHE VORRICHTUNGEN

    公开(公告)号:EP3114911A1

    公开(公告)日:2017-01-11

    申请号:EP15758971.4

    申请日:2015-03-04

    申请人: MC10, INC.

    IPC分类号: H05K3/34 H05K3/40 H05K1/03

    摘要: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate. Either housing component may include one or more projections that pass through holes in the substrate to engage complementary depressions in the other housing component to thereby align and interlock the encapsulation housing components with the flexible substrate and electronic circuitry.

    摘要翻译: 封装的适形电子器件,封装的保形集成电路(IC)系统以及制造和使用封装的适形电子器件的方法在本文中给出。 公开了一种保形IC装置,其包括柔性基板,附接到柔性基板的电子电路以及包含电子电路和柔性基板的柔性多部分封装壳体。 多部分壳体包括第一和第二封装壳体部件。 第一封装壳体部件具有凹入区域,用于将电子电路放置在其中,而第二封装壳体部件具有用于在其中安置柔性基板的凹陷区域。 第一封装壳体部件可选地包括用于在其中安置柔性基板的凹陷区域。 两个壳体部件可以包括一个或多个穿过基板中的孔的突起,以接合另一壳体部件中的互补的凹部,从而使密封壳体部件与柔性基板和电子电路对准和互锁。

    MONITORING HIT COUNT FROM IMPACT EVENTS
    7.
    发明公开
    MONITORING HIT COUNT FROM IMPACT EVENTS 审中-公开
    ÜBERWACHUNGDERTREFFERZÄHLUNGVON AUFPRALLEREIGNISSEN

    公开(公告)号:EP2938982A4

    公开(公告)日:2016-06-15

    申请号:EP13867205

    申请日:2013-12-27

    申请人: MC10 INC

    摘要: The systems and methods are provided for monitoring the forces and impacts to an object. The systems and method disclosed herein can be used to monitor forces and impacts to a human subject. In some implementations, the system can be disposed into conformal electronics that can be coupled directly to an object or disposed of other objects such as clothing and protective gear. The system can include a storage module to allow for data to be reviewed and analyzed. In some implementations, the system can also include an indicator. In some implementations, the indicator can be used to display real time analysis of impacts made by the system.

    摘要翻译: 提供的系统和方法用于监测对物体的力和影响。 本文公开的系统和方法可用于监测对人类受试者的力量和影响。 在一些实施方案中,系统可以被布置成可以直接耦合到物体或处理其它物体(例如衣物和保护装置)的保形电子装置。 该系统可以包括一个存储模块,以便对数据进行审查和分析。 在一些实现中,系统还可以包括指示符。 在一些实现中,该指示器可用于显示系统所产生的影响的实时分析。