公开(公告)号：EP2656383A1

公开(公告)日：2013-10-30

申请号：EP11713628.3

申请日：2011-04-01

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  MITCHELL, Craig

IPC: H01L21/98 ,  H01L25/065

CPC classification number: H01L25/00 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/94 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05023 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05186 ,  H01L2224/0519 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/0603 ,  H01L2224/0613 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06505 ,  H01L2224/116 ,  H01L2224/13023 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/136 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/276 ,  H01L2224/29023 ,  H01L2224/29082 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29144 ,  H01L2224/32148 ,  H01L2224/32238 ,  H01L2224/73103 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/8123 ,  H01L2224/81815 ,  H01L2224/8183 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2224/8323 ,  H01L2224/83815 ,  H01L2224/8383 ,  H01L2224/9202 ,  H01L2224/9221 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01029 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/35 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05552 ,  H01L2924/00012 ,  H01L2924/00

Abstract: Disclosed are a microelectronic assembly of two elements and a method of forming same. A microelectronic element includes a major surface, and a dielectric layer and at least one bond pad exposed at the major surface. The microelectronic element may contain a plurality of active circuit elements. A first metal layer is deposited overlying the at least one bond pad and the dielectric layer. A second element having a second metal layer deposited thereon is provided, and the first metal layer is joined with the second metal layer. The assembly may be severed along dicing lanes into individual units each including a chip.

公开(公告)号：EP2649643A2

公开(公告)日：2013-10-16

申请号：EP11802829.9

申请日：2011-12-07

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  MITCHELL, Craig

IPC: H01L23/485 ,  H01L25/065 ,  H01L21/60 ,  H01L23/31

CPC classification number: H01L21/76898 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/562 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/80 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/02123 ,  H01L2224/0215 ,  H01L2224/0311 ,  H01L2224/0332 ,  H01L2224/03466 ,  H01L2224/03602 ,  H01L2224/0401 ,  H01L2224/05009 ,  H01L2224/05013 ,  H01L2224/05014 ,  H01L2224/05015 ,  H01L2224/05022 ,  H01L2224/05073 ,  H01L2224/05186 ,  H01L2224/05191 ,  H01L2224/05548 ,  H01L2224/05551 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2224/05564 ,  H01L2224/05567 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05578 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05666 ,  H01L2224/06181 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06544 ,  H01L2225/06548 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15165 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81805 ,  H01L2924/06

Abstract: A microelectronic unit 12 includes a substrate 20 and an electrically conductive element 40. The substrate 20 can have a CTE less than 10 ppm/°C, a major surface 21 having a recess 30 not extending through the substrate, and a material 50 having a modulus of elasticity less than 10 GPa disposed within the recess. The electrically conductive element 40 can include a joining portion 42 overlying the recess 30 and extending from an anchor portion 41 supported by the substrate 20. The joining portion 42 can be at least partially exposed at the major surface 21 for connection to a component 14 external to the microelectronic unit 12.

公开(公告)号：EP2647044B1

公开(公告)日：2020-08-05

申请号：EP11711724.2

申请日：2011-03-23

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  MITCHELL, Craig ,  SAVALIA, Piyush

IPC: H01L21/768 ,  H01L23/31 ,  H01L23/48 ,  H01L25/065

公开(公告)号：EP2647046A1

公开(公告)日：2013-10-09

申请号：EP11799219.8

申请日：2011-12-02

Applicant: Tessera, Inc.

Inventor： HABA, Belgacem ,  OGANESIAN, Vage ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  MITCHELL, Craig

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/16

Abstract: A microelectronic assembly can include first and second microelectronic elements each embodying active semiconductor devices adjacent a front surface thereof, and having an electrically conductive pad exposed at the respective front surface. An interposer of material having a CTE less than 10 ppm/° C. has first and second surfaces attached to the front surfaces of the respective first and second microelectronic elements, the interposer having a second conductive element extending within an opening in the interposer. First and second conductive elements extend within openings extending from the rear surface of a respective microelectronic element of the first and second microelectronic elements towards the front surface of the respective microelectronic element. In one example, one or more of the first or second conductive elements extends through the respective first or second pad, and the conductive elements contact the exposed portions of the second conductive element to provide electrical connection therewith.

Abstract translation: 微电子组件可以包括第一和第二微电子元件，每个微电子元件各自体现邻近其前表面的有源半导体器件，并且具有在相应的前表面处暴露的导电焊盘。 具有小于10ppm /℃的CTE的材料的插入件具有附接到相应的第一和第二微电子元件的前表面的第一和第二表面，所述插入件具有在插入件的开口内延伸的第二导电元件。 第一和第二导电元件在从第一和第二微电子元件的相应微电子元件的后表面延伸到相应微电子元件的前表面的开口内延伸。 在一个示例中，第一或第二导电元件中的一个或多个延伸穿过相应的第一或第二焊盘，并且导电元件接触第二导电元件的暴露部分以提供与其的电连接。

公开(公告)号：EP2647044A1

公开(公告)日：2013-10-09

申请号：EP11711724.2

申请日：2011-03-23

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  MITCHELL, Craig ,  SAVALIA, Piyush

IPC: H01L23/48 ,  H01L25/065

Abstract: A microelectronic assembly is provided in which first and second electrically conductive pads exposed at front surfaces of first and second microelectronic elements, respectively, are juxtaposed, each of the microelectronic elements embodying active semiconductor devices. An electrically conductive element may extend within a first opening extending from a rear surface of the first microelectronic element towards the front surface thereof, within a second opening extending from the first opening towards the front surface of the first microelectronic element, and within a third opening extending through at least one of the first and second pads to contact the first and second pads. Interior surfaces of the first and second openings may extend in first and second directions relative to the front surface of the first microelectronic element, respectively, to define a substantial angle.

公开(公告)号：EP2617054B1

公开(公告)日：2020-05-27

申请号：EP11767505.8

申请日：2011-09-14

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  MITCHELL, Craig ,  SAVALIA, Piyush

IPC: H01L21/768 ,  H01L23/48 ,  H01L25/065

公开(公告)号：EP2652782A2

公开(公告)日：2013-10-23

申请号：EP11805336.2

申请日：2011-12-14

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  MITCHELL, Craig

IPC: H01L21/98

CPC classification number: H01L23/562 ,  B81C1/00269 ,  B81C1/00357 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/563 ,  H01L21/568 ,  H01L23/13 ,  H01L24/05 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83191 ,  H01L2224/83345 ,  H01L2224/83385 ,  H01L2224/83855 ,  H01L2224/83856 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/10158 ,  H01L2924/10253 ,  H01L2924/1027 ,  H01L2924/1032 ,  H01L2924/1037 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2924/00

Abstract: A method of bonding first and second microelectronic elements includes pressing together a first substrate 100 containing active circuit elements 108 therein with a second substrate 112, with a flowable dielectric material 102 between confronting surfaces of the respective substrates, each of the first and second substrates 100,112 having a coefficient of thermal expansion less than 10 parts per million/ °C, at least one of the confronting surfaces having a plurality of channels 118A-118F extending from an edge of such surface, such that the dielectric material 102 between planes defined by the confronting surfaces is at least substantially free of voids and has a thickness over one micron, and at least some of the dielectric material 102 flows into at least some of the channels.

公开(公告)号：EP2647040A2

公开(公告)日：2013-10-09

申请号：EP11711722.6

申请日：2011-03-22

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  MITCHELL, Craig ,  SAVALIA, Piyush

IPC: H01L21/60 ,  H01L23/48 ,  H01L23/498

CPC classification number: H01L23/481 ,  H01L21/76802 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76898 ,  H01L21/78 ,  H01L23/145 ,  H01L23/147 ,  H01L23/49827 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L24/89 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/83 ,  H01L2224/9202 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A microelectronic assembly is provided which includes a first element consisting essentially of at least one of semiconductor or inorganic dielectric material having a surface facing and attached to a major surface of a microelectronic element at which a plurality of conductive pads are exposed, the microelectronic element having active semiconductor devices therein. A first opening extends from an exposed surface of the first element towards the surface attached to the microelectronic element, and a second opening extends from the first opening to a first one of the conductive pads, wherein where the first and second openings meet, interior surfaces of the first and second openings extend at different angles relative to the major surface of the microelectronic element. A conductive element extends within the first and second openings and contacts the at least one conductive pad.

Abstract translation: 提供了一种微电子组件，其包括基本上由半导体或无机电介质材料中的至少一种组成的第一元件，该介电材料具有面向并附着到微电子元件的主表面的表面，在该电子元件的主表面处暴露多个导电焊盘，该微电子元件具有 其中的有源半导体器件。 第一开口从第一元件的暴露表面延伸到附接到微电子元件的表面，并且第二开口从第一开口延伸到第一导电焊盘中，其中第一和第二开口相交，其中内表面 第一和第二开口相对于微电子元件的主表面以不同的角度延伸。 导电元件在第一和第二开口内延伸并接触至少一个导电垫。

公开(公告)号：EP2596520A1

公开(公告)日：2013-05-29

申请号：EP10855116.9

申请日：2010-10-13

Applicant: Tessera, Inc.

Inventor： OGANESIAN, Vage ,  HABA, Belgacem ,  MOHAMMED, Ilyas ,  MITCHELL, Craig ,  SAVALIA, Piyush

IPC: H01L21/00

CPC classification number: H01L21/76898 ,  H01L23/481 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/02375 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/06166 ,  H01L2224/06181 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/17181 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/8185 ,  H01L2224/94 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/03 ,  H01L2224/81

Abstract: A microelectronic unit, microelectronic element, e g, an integrated circuit chip, having a semiconductor region of monocrystalline form. The semiconductor region has a front surface extending in a first direction, an active circuit element adjacent the front surface, a rear surface remote from the front surface and a conductive which extends towards the rear surface The conductive can be insulated from the semiconductor region by an inorganic dielectric layer An opening can extend from the rear surface partially through a thickness of the semiconductor region, with the opening and the conductive via having respective widths, in the first direction The width of the opening may be greater than the width of the conductive via where the opening meets the conductive via A rear contact can be electrically connected to the conductive and exposed at the rear surface for electrical connection with an external circuit element.

Abstract translation: 一种微电子单元包括微电子元件，例如以集成电路芯片，具有单晶形式的半导体区域的半导体区域从具有前表面在第一方向上延伸，以有源电路元件的相邻的前表面，后表面远程 前表面上，以及导电通路朝后表面延伸。 导电通孔可以从半导体区域通过在无机介质层绝缘。 中的开口可以从背面部分地穿过其厚度的半导体区域的延伸，与所述开口，并且经由在第一方向上具有宽度respectivement的导电。 开口的宽度可以比经由其中开口满足通过导电的导电的宽度大。 后部接触可通过被电连接至所述导电，并在后表面在外部电路元件与电气连接露出，作为寻求另一个类似微电子单元，微电子封装，或电路板。

公开(公告)号：EP2647046B1

公开(公告)日：2020-11-18

申请号：EP11799219.8

申请日：2011-12-02

Applicant: Tessera, Inc.

Inventor： HABA, Belgacem ,  OGANESIAN, Vage ,  MOHAMMED, Ilyas ,  SAVALIA, Piyush ,  MITCHELL, Craig

IPC: H01L25/065 ,  H01L23/48 ,  H01L25/16