公开(公告)号：JP2009246166A

公开(公告)日：2009-10-22

申请号：JP2008091507

申请日：2008-03-31

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： SO TAKESHI ,  MAEDA HIDEKI ,  AIZAWA OSAMU ,  KUBO HIDEO

IPC: H01L23/12 ,  H01L21/60 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L23/4006 ,  H01L23/49811 ,  H01L2023/405 ,  H01L2023/4081 ,  H01L2224/0401 ,  H01L2224/05557 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K2201/0367 ,  H05K2201/0373 ,  H05K2201/094 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49124 ,  H01L2224/05552

Abstract: PROBLEM TO BE SOLVED: To provide a connection terminal capable of excellently maintaining an electrical connection regardless of a thermal expansion difference, and to provide a method of manufacturing the same. SOLUTION: An electronic device package is mounted on a printed wiring board. A solder material 17 is bonded to a conductive pad 28 of a package substrate 16. The solder material 17 is bonded to the conductive pad 28 of the printed wiring board 14. On the conductive pad 28, an uneven contact surface is formed. Between the package substrate 16 and the printed wiring board 14, a thermal expansion difference occurs. In the solder material 17, a shearing stress occurs. When an electronic device is iteratively heated and cooled, cracks 35 may be generated on the solder material 17 gradually in accordance with the thermal expansion difference. The cracks 35 are grown up along the uneven contact surface. The growth of the cracks 35 are meandered by operation of an uneven shape. The growth of the cracks 35 are blocked. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种连接终端，其能够优异地保持电连接，而不管热膨胀差异如何，并且提供其制造方法。

解决方案：电子设备封装安装在印刷电路板上。 焊料17接合到封装基板16的导电焊盘28.焊料17接合到印刷线路板14的导电焊盘28.在导电焊盘28上形成不平坦的接触表面。 在封装基板16和印刷布线板14之间，发生热膨胀差。 在焊料17中，发生剪切应力。 当电子设备被迭代地加热和冷却时，可能根据热膨胀差逐渐地在焊料材料17上产生裂纹35。 裂纹35沿着不平坦的接触表面长大。 裂缝35的生长由于不均匀的形状的操作而蜿蜒曲折。 裂缝35的生长被阻挡。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2008543003A

公开(公告)日：2008-11-27

申请号：JP2008513862

申请日：2006-05-29

Applicant: ルバタ オサケ ユキチュア

Inventor： ヨーゼフ スゲティッヒ、 ,  マシアス ペデビラ、 ,  ペーター ベルクホファー、

IPC: H01B5/00 ,  H01L21/60 ,  H01L31/042

CPC classification number: H05K3/341 ,  H01L31/0508 ,  H01R4/04 ,  H01R4/26 ,  H05K3/4015 ,  H05K2201/0373 ,  H05K2201/10984 ,  Y02E10/50 ,  Y02P70/613

Abstract: 本発明は導電体（2）と導電性被覆材（3）とを含む電気的接続要素（1）に関する。 本発明の目的は、加工が容易で、高い接着力を実現可能であり、被覆材が薄くてよい接続要素を作ることである。 この目的のため、導電体（2）の表面は、少なくとも一部の領域に、構造化したおよび／または粗い表面を有する。

公开(公告)号：JP2008252134A

公开(公告)日：2008-10-16

申请号：JP2008181401

申请日：2008-07-11

Applicant: Matsushita Electric Ind Co Ltd ,  松下電器産業株式会社

Inventor： SUETSUGU KENICHIRO ,  KOSHI MASUO ,  TODOROKI KENICHIRO ,  HIBINO TOSHIHARU ,  TAKANO HIROAKI ,  NAKADA MIKIYA ,  MAEDA YUKIO

IPC: H05K3/34 ,  H05K1/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K3/3447 ,  H05K1/0293 ,  H05K1/115 ,  H05K1/116 ,  H05K3/3452 ,  H05K3/3463 ,  H05K3/4092 ,  H05K2201/0373 ,  H05K2201/0397 ,  H05K2201/09663 ,  H05K2201/0979 ,  H05K2201/099

Abstract: PROBLEM TO BE SOLVED: To effectively reduce occurrence of lift-off in a bonded structure in which electronic components are soldered to a board. SOLUTION: The bonded structure of this invention comprises a substrate(1) with a through-hole (2), lands (3a to 3c), and a lead (5) led from the electronic components and put inside the through-hole. A fillet connecting the lands (3a to 3c) to the lead (5) includes an upper fillet (6a) which is in contact with the front face land part (3a) and a lower fillet (6b) which is in contact with the back face land part (3b) and the outer diameter of the upper fillet is 1.5 or less times of the diameter of the through-hole. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：有效地减少将电子部件焊接到电路板的接合结构中的剥离的发生。 解决方案：本发明的接合结构包括具有通孔（2）的基板（1），从电子部件引出的焊盘（3a至3c）和引线（5） 孔。 将焊盘（3a〜3c）连接到引线（5）的圆角包括与前表面接地部（3a）接触的上圆角（6a）和与背面接触的下圆角（6b） 面部陆部（3b），上部圆角的外径为通孔直径的1.5倍以下。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2007225599A

公开(公告)日：2007-09-06

申请号：JP2007008136

申请日：2007-01-17

Applicant: Johnstech Internatl Corp ,  ジョンズテック インターナショナル コーポレイション

Inventor： SHERRY JEFFREY C

IPC: G01R1/06 ,  G01R31/26

CPC classification number: H05K3/326 ,  G01R1/06738 ,  G01R1/0735 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/81385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K2201/0373 ,  H05K2201/0382 ,  H05K2201/0394 ,  H05K2201/10734 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To improve a device that has a load board and an element I/O arranged physically tightly, improves the electric performance, provides compatibility, allows use by both manual and automatic testing devices, and tests a microcircuit. SOLUTION: A contact element comprises a resilient finger projecting section from an insulating contact membrane as a cantilevered beam. The finger has on a contact side thereof, and a conducting contact pad for contacting the microcircuit terminal. The contact element has a plurality of fingers, where each finger is defined in part by two radially oriented slots in the membrane that mechanically separate each finger from every other finger of the plurality of fingers forming the contact element. The contact elements are arranged in a predetermined pattern to form a contact element array. A plurality of connection vias in an interface membrane are arranged in the predetermined pattern of the contact elements, with each of the connection vias is aligned with one of the test contact elements. The connection vias has a cup shape with an open end, with the open end of the cup-shaped via contacting the aligned contact element. The contact and interface membranes are used as part of a test receptacle including a load board on which individual microcircuits are mounted for testing. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：为了改进具有负载板和物理紧密配置的元件I / O的装置，提高电性能，提供兼容性，允许手动和自动测试装置使用，并测试微电路。 解决方案：接触元件包括从作为悬臂梁的绝缘接触膜的弹性指状突出部分。 手指具有接触侧，以及用于接触微电路端子的导电接触垫。 接触元件具有多个指状物，其中每个手指部分地由膜中的两个径向定向的狭槽限定，其将每个手指与形成接触元件的多个指状物中的每个其他手指机械分离。 接触元件以预定图案布置以形成接触元件阵列。 界面膜中的多个连接通孔以接触元件的预定图案布置，其中每个连接通孔与测试接触元件中的一个对准。 连接通孔具有开口端的杯形，杯形通孔的开口端接触对准的接触元件。 接触膜和界面膜用作测试插座的一部分，包括装载板，各个微电路安装在其上用于测试。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JPWO2005097396A1

公开(公告)日：2007-08-16

申请号：JP2006512095

申请日：2005-04-06

Applicant: 松下電器産業株式会社

Inventor： 笹岡　達雄 ,  達雄 笹岡 ,  堀江　聡 ,  聡 堀江 ,  青倉　勇 ,  勇 青倉 ,  八木　能彦 ,  能彦 八木 ,  深田　和岐 ,  和岐 深田

IPC: B23K20/24 ,  B23K1/20 ,  B23K20/00 ,  B24C1/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38

CPC classification number: B23K1/203 ,  B23K2201/40 ,  H01L21/4864 ,  H01L21/6835 ,  H01L23/3142 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1134 ,  H01L2224/1184 ,  H01L2224/13019 ,  H01L2224/13144 ,  H01L2224/749 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/75753 ,  H01L2224/81009 ,  H01L2224/81011 ,  H01L2224/81013 ,  H01L2224/81191 ,  H01L2224/81395 ,  H01L2224/81801 ,  H01L2224/8182 ,  H01L2224/81894 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01021 ,  H01L2924/01025 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H05K3/328 ,  H05K3/3489 ,  H05K3/383 ,  H05K2201/0373 ,  H05K2201/10674 ,  H05K2203/0307 ,  Y10S438/974 ,  Y10T156/1023 ,  Y10T156/14 ,  H01L2224/05599

Abstract: 初期洗浄工程(S1)により被接合物(1b,2a)の表面を洗浄して酸化物や吸着物等の接合阻害物質(G)の除去を行った後、表面粗さ制御工程(S3)により一方の接合面(1b)を所定粗さの凹凸を形成し、表面処理工程(S5)により接合面(1b,2a)に付着した再吸着物(F)の除去を行って凹凸形成した接合面(1b)を他方の接合面(2a)に押し付けて接合することにより、大気圧条件下での常温金属接合を可能にする接合方法及びその装置を実現する。

公开(公告)号：JP2007123664A

公开(公告)日：2007-05-17

申请号：JP2005315931

申请日：2005-10-31

Applicant: Alps Electric Co Ltd ,  アルプス電気株式会社

Inventor： SUZUKI HIROKI ,  UEHARA MASATO

IPC: H05K3/34

CPC classification number: H05K1/111 ,  H01L24/01 ,  H05K1/095 ,  H05K3/305 ,  H05K3/3442 ,  H05K3/3484 ,  H05K2201/0245 ,  H05K2201/0272 ,  H05K2201/0373 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T428/12042 ,  Y10T428/12049 ,  Y10T428/12479 ,  Y10T428/12528 ,  Y10T428/12569

Abstract: PROBLEM TO BE SOLVED: To provide a junction structure between a substrate and components in which the solder wettability of conductive coating constituted of metal powder and resin is properly improved when using low melting point soldering. SOLUTION: An electrode 3 constituted of: spherical metal powder 10; flake-shaped metal powder 11; and thermal plastic resin 12, is formed on a substrate 1; the electrode 3 and the electronic components are joined by low melting point soldering 5; and a portion 5a of the low melting soldering 5 intrudes from a surface 3a of the electrode 3 into the inside of the electrode 3. Thus, electric connectability between the electrode 3 and the low melting point soldering 5 is satisfactorily maintained. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：在使用低熔点焊接时，在基板和由金属粉末和树脂构成的导电涂层的焊料润湿性适当地提高的部件之间提供接合结构。 电解质：由球状金属粉末10构成的电极3， 片状金属粉末11; 和热塑性树脂12形成在基板1上; 电极3和电子部件通过低熔点焊接5接合; 并且低熔点焊接5的一部分5a从电极3的表面3a侵入电极3的内部。因此，电极3和低熔点焊接5之间的电连接性令人满意地保持。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2007019203A

公开(公告)日：2007-01-25

申请号：JP2005198288

申请日：2005-07-07

Applicant: Showa Denko Kk ,  Toyota Industries Corp ,  昭和電工株式会社 ,  株式会社豊田自動織機

Inventor： OTOSHI KOTA ,  KONO EIJI ,  FUJI TAKASHI ,  TANAKA KATSUAKI ,  FURUKAWA YUICHI ,  YAMAUCHI SHINOBU ,  HOSHINO RYOICHI ,  WAKABAYASHI NOBUHIRO ,  NAKAGAWA SHINTARO

IPC: H01L23/36

CPC classification number: H05K3/0061 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/473 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/341 ,  H05K2201/0373 ,  H05K2201/1028 ,  H05K2203/0405 ,  Y02P70/613 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a heat radiator whose material cost is inexpensive and which is superior in radiation performance.
SOLUTION: The heat radiator 1 is provided with an insulating substrate 3 whose one face is set to be a heating element loading side, and a heat sink 5 fixed to the other face of the insulating substrate 3. A metal layer 7 is arranged on a face opposite to the heating element loading side in the insulating substrate 3. A stress relieving member 4 is installed with intervals between the metal layer 7 and the heat sink 5 in the insulating substrate 3, as formed of a highly thermally-conductive material, and formed of a plate type main body 10 and a plurality of projections 11 on one face of the plate type main body 10. Tip faces of the projections 11 in the stress relieving member 4 are brazed to the metal layer 7, and a face where the projections 11 are not formed in the plate type main body 10 is brazed to the heat sink 5.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种材料成本便宜并且辐射性能优异的散热器。 解决方案：散热器1设置有将一个面设置为加热元件装载侧的绝缘基板3和固定在绝缘基板3的另一个面上的散热片5.金属层7 布置在与绝缘基板3中的加热元件装载侧相对的面上。应力消除构件4在绝缘基板3中的金属层7和散热器5之间设置间隔，由高导热性 材料，并且由板状主体10和在板状主体10的一个面上的多个突起11形成。应力消除构件4中的突起11的尖端被钎焊到金属层7，并且 在板状主体10中没有形成突起11的面钎焊到散热片5.版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2005354070A

公开(公告)日：2005-12-22

申请号：JP2005168767

申请日：2005-06-08

Applicant: Samsung Electronics Co Ltd ,  三星電子株式会社Samsung Electronics Co.,Ltd.

Inventor： JEONG SE-YOUNG ,  OH SE YONG

IPC: H01L23/12 ,  H01L21/288 ,  H01L21/44 ,  H01L21/60 ,  H01L23/32 ,  H01L23/373 ,  H01L23/485 ,  H01L23/498 ,  H01L23/50 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L24/16 ,  H01L21/2885 ,  H01L23/3735 ,  H01L23/49816 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05085 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/113 ,  H05K3/28 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0187 ,  H05K2201/0373 ,  H05K2201/09436 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board which can enhance solder joint reliability, and a semiconductor package module using it. SOLUTION: A printed circuit board for a semiconductor package module comprises: a multilayer printed circuit board having a laminated structure with alternating insulating layers and printed circuit patterns; a first terminal which is a portion of one printed circuit pattern exposed to the outside of the printed circuit board and is to be connected to solder balls of a semiconductor package; a second terminal which is a portion of one printed circuit pattern exposed to the outside of the printed circuit board and has a function to be connected to another printed circuit board; and a buffer layer made of a photosensitive material, which functions as an insulating layer formed under the first terminal and can absorb the stress generated by the difference between the thermal expansion coefficient of the semiconductor package and that of the first terminal. A semiconductor package module has the printed circuit board and the semiconductor package mounted on the printed circuit board. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：提供可以提高焊点可靠性的印刷电路板，以及使用它的半导体封装模块。 解决方案：一种用于半导体封装模块的印刷电路板，包括：具有交替绝缘层和印刷电路图案的叠层结构的多层印刷电路板; 第一端子，其是暴露于印刷电路板的外部并且连接到半导体封装的焊球的一个印刷电路图案的一部分; 第二端子，其是暴露于印刷电路板的外部的一个印刷电路图案的一部分，并且具有连接到另一个印刷电路板的功能; 以及由感光材料制成的缓冲层，其作为形成在第一端子下方的绝缘层，并且可以吸收由半导体封装的热膨胀系数与第一端子的热膨胀系数之间的差产生的应力。 半导体封装模块具有安装在印刷电路板上的印刷电路板和半导体封装。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2005191574A

公开(公告)日：2005-07-14

申请号：JP2004373865

申请日：2004-12-24

Applicant: Stmicroelectronics Inc ,  エスティーマイクロエレクトロニクス,インコーポレイテッド STMicroelectronics,Inc

Inventor： ANTHONY M CHU ,  TEE TONG YAN

IPC: H01L23/50 ,  H01L23/31 ,  H01L23/495 ,  H05K3/34

CPC classification number: H01L21/4821 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2924/00014 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0373 ,  H05K2201/09745 ,  H05K2201/10727 ,  H05K2201/10969 ,  Y02P70/613 ,  H01L2224/45099

Abstract: PROBLEM TO BE SOLVED: To provide a technique for improving solder joining reliability in a QNF integrated circuit package. SOLUTION: In a system for improving solder joining reliability in an integrated circuit package, each of terminals of a Quad Flat Non-leaded integrated-circuit-package is formed such that it has a portion for defining a solder slot on a surface of a bottom of the terminal. An outer surface of a die pad of an integrated circuit package is also formed such that it has portions for defining a plurality of solder slots on periphery of the die pad. When solder is applied to the die pad and the terminal, the solder fills the solder slot, and improves the solder joining reliability in the integrated circuit package. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种用于提高QNF集成电路封装中的焊接可靠性的技术。 解决方案：在用于提高集成电路封装中的焊接可靠性的系统中，四边形扁平非引线集成电路封装的每个端子被形成为使得其具有用于在表面上限定焊料槽的部分 的终端底部。 集成电路封装的管芯焊盘的外表面也形成为具有用于在管芯焊盘的外围限定多个焊料槽的部分。 当焊料施加到管芯焊盘和端子时，焊料填充焊料槽，并提高集成电路封装中的焊接可靠性。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005072595A

公开(公告)日：2005-03-17

申请号：JP2004242890

申请日：2004-08-23

Applicant: Samsung Electronics Co Ltd ,  三星電子株式会社

Inventor： AN SEUNG-DEOG ,  KIM BINSEN

IPC: H05K3/34 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32

CPC classification number: H05K1/11 ,  H05K3/325 ,  H05K2201/0373 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10265 ,  H05K2203/044

Abstract: PROBLEM TO BE SOLVED: To provide a printed circuit board which includes a contact terminal adapted to prevent contact failure and further allow reducing a per-piece cost of production, and an image-recording device provided with the printed circuit board.
SOLUTION: The printed circuit board is provided with a circuit unit for controlling the operations of electronic products and performing processes, and a large-area contact terminal formed of a plurality of small-area terminal sections assembled to contact electrically with external devices. The small-area terminal sections described above can be formed in a variety of configurations, having the same size and the same shape and arranged spaced apart at prescribed intervals. By adopting the above construction, assembling of a plurality of terminal sections of a small area to form a unit contact terminal, having an area no less than a predetermined magnitude is allowed, thereby suppressing the formation of an uneven state of the surface due to soldering. As a result, improvement of the contact with external terminals, reduction of the per-piece cost of production and simplify the production process can be made.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种印刷电路板，其包括适于防止接触故障的接触端子，并且进一步允许减少每件生产成本，以及设置有印刷电路板的图像记录装置。 解决方案：印刷电路板设置有用于控制电子产品和执行过程的操作的电路单元，以及由多个小区域端子部分组成的大面积接触端子，其组装成与外部设备电接触 。 上述小区域端子部分可以形成为具有相同尺寸和相同形状的各种构造，并以规定的间隔布置。 通过采用上述结构，允许组装小面积的多个端子部分以形成具有不小于预定幅度的面积的单元接触端子，从而抑制由于焊接而形成表面的不均匀状态 。 结果，可以改善与外部端子的接触，减少生产成本和简化生产过程。 版权所有（C）2005，JPO＆NCIPI