公开(公告)号：JP5210912B2

公开(公告)日：2013-06-12

申请号：JP2009023411

申请日：2009-02-04

Applicant: 新光電気工業株式会社

Inventor： 裕一 田口 ,  晶紀 白石 ,  光敏 東

IPC: H05K1/11 ,  H05K1/14

CPC classification number: B81B7/0074 ,  H01L24/16 ,  H01L24/45 ,  H01L24/85 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/85 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/1461 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19107 ,  H05K3/328 ,  H05K2201/10287 ,  H05K2201/10454 ,  H05K2201/10727 ,  H05K2201/10946 ,  H01L2924/00 ,  H01L2224/48

Abstract: A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a penetration electrode formed in the through hole, a wiring layer formed on at least one surface of the silicon substrate and connected to the penetration electrode, and a metal wire terminal connected to the wiring layer and formed to extend from one surface of the silicon substrate to a side surface thereof. The metal wire terminal on the side surface of the electronic device is connected to the mounting substrate such that a substrate direction of the electronic device in which an electronic component is mounted on the wiring substrate intersects orthogonally with a substrate direction of the mounting substrate.

公开(公告)号：JP2013518388A

公开(公告)日：2013-05-20

申请号：JP2012551109

申请日：2011-01-31

Applicant: ネーデルランゼ オルハニサティー フォール トゥーヘパスト−ナトゥールウェテンスハッペァイク オンデルゾーク テーエンオーNederlandse Organisatie Voor Toegepast−Natuurwetenschappelijk Onderzoek Tno

Inventor： コック，マルハレータ，マリア デ ,  デン ブランド， イェルーン ファン ,  ヘック，ヘラルドゥス ティトゥス ファン

IPC: H05B33/06 ,  H01L51/50

CPC classification number: H05K1/0277 ,  G09F9/00 ,  G09F19/22 ,  H01L27/3293 ,  H01L31/0392 ,  H01L31/042 ,  H01L51/5203 ,  H01L2251/5338 ,  H01L2251/5361 ,  H01R4/04 ,  H01R4/70 ,  H01R12/7076 ,  H05B33/0896 ,  H05B33/10 ,  H05K1/0283 ,  H05K1/038 ,  H05K1/147 ,  H05K1/189 ,  H05K3/321 ,  H05K3/325 ,  H05K3/365 ,  H05K13/04 ,  H05K2201/029 ,  H05K2201/0311 ,  H05K2201/046 ,  H05K2201/083 ,  H05K2201/09081 ,  H05K2201/09281 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10484 ,  Y02E10/50 ,  Y10T29/4913

Abstract: 複数のタイル（１）と担体（４０）との集合体であって、前記タイル（１）は電気物理トランスデューサ（１０）および該トランスデューサへの電気コネクタ（２４、２８）をもつ箔（２０）を有する。 前記タイルは前記担体に機械的かつ電気的に結合され、前記タイルは魚の鱗パターンに従って重なる。

公开(公告)号：JP5180431B2

公开(公告)日：2013-04-10

申请号：JP2005253180

申请日：2005-09-01

Applicant: コンパニー ゼネラール デ エタブリッスマン ミシュラン ,  ミシュラン ルシェルシュ エ テクニーク ソシエテ アノニム

Inventor： シー． シネット ジェイ ,  アール． メカルフ アーサー ,  ジェイ． マイアット デビッド

IPC: B60C23/04 ,  H05K7/00 ,  H01R4/02 ,  H01R4/20 ,  H01R13/58 ,  H01R43/02 ,  H02G11/00 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R4/02 ,  B29D2030/0072 ,  B60C23/0493 ,  H01Q1/2241 ,  H01Q1/40 ,  H01R4/20 ,  H01R12/53 ,  H01R13/58 ,  H01R13/5808 ,  H01R13/5845 ,  H01R43/0256 ,  H01R2201/02 ,  H01R2201/26 ,  H05K3/301 ,  H05K3/305 ,  H05K3/3421 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/1194

Abstract: A strain-resistant electrical connection and a method of making the same is provided. A wire or other conductive lead (38) is connected to a circuit in a manner that makes the connection more resistant to mechanical stresses such as movement or rotation of the lead relative to the circuit. A material is configured around the lead and near the point of connection to the circuit so as to create a region of decreasing flexibility or graduated stiffness near the point of connection. In certain embodiments, the lead may also be coiled or otherwise shaped to provide additional ability to withstand mechanical stresses. In other embodiments, additional elements may be provided to assist in controlling the stiffness near the connection point.

公开(公告)号：JP5014890B2

公开(公告)日：2012-08-29

申请号：JP2007162072

申请日：2007-06-20

Applicant: パナソニック株式会社

Inventor： 忠彦 境

IPC: H05K3/34 ,  B23K1/00 ,  B23K3/04

CPC classification number: H05K3/323 ,  H01L24/45 ,  H01L24/46 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45565 ,  H01L2224/4847 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01047 ,  H05K3/3405 ,  H05K3/3484 ,  H05K3/3494 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0278 ,  H05K2203/0425 ,  Y10T156/10 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/01006

公开(公告)号：JP4965551B2

公开(公告)日：2012-07-04

申请号：JP2008500686

申请日：2005-03-09

Applicant: ソシエテ ド テクノロジー ミシュラン ,  ミシュラン ルシェルシュ エ テクニーク ソシエテ アノニム

Inventor： ジョン デヴィッド アダムソン， ,  ジェイ シー． シネット， ,  キャメロン イー． スミス，

IPC: H01Q9/16 ,  G06K19/07 ,  G06K19/077 ,  H01Q1/24 ,  H01Q7/00

CPC classification number: B60C23/0493 ,  B60C23/0452 ,  H05K3/284 ,  H05K3/3426 ,  H05K2201/0133 ,  H05K2201/10265 ,  H05K2201/10287 ,  Y02P70/613

公开(公告)号：JP4957285B2

公开(公告)日：2012-06-20

申请号：JP2007042191

申请日：2007-02-22

Applicant: 富士通株式会社

Inventor： 俊二 馬場

IPC: G06K19/077 ,  G06K19/07

CPC classification number: G06K19/07749 ,  G06K19/07728 ,  H05K1/0271 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0212 ,  H05K2201/10287 ,  H05K2201/2009 ,  H05K2203/1311

Abstract: A radio frequency tag comprising: a base (11); a radio frequency antenna (12) disposed on the base; a circuit chip (13) mounted on the base and electrically connected to the radio frequency antenna, the circuit chip performing radio communication via the radio frequency antenna; and a protection sheet (20A ~ 20H) disposed on the radio frequency antenna, the protection sheet comprising a flexible material and rigid bodies dispersed in the flexible material so as to prevent the protection sheet from being collapsed when the radio frequency tag is bent and compressed.

公开(公告)号：JP4909906B2

公开(公告)日：2012-04-04

申请号：JP2007551637

申请日：2006-01-24

Applicant: ユマテック ゲーエムベーハー

Inventor： マルクス ヴェルフェル

IPC: H05K3/10 ,  H05K1/11

CPC classification number: H05K3/103 ,  H05K13/06 ,  H05K2201/10287 ,  Y10T29/49117 ,  Y10T29/49155

公开(公告)号：JP4824079B2

公开(公告)日：2011-11-24

申请号：JP2008501557

申请日：2006-02-24

Applicant: 富士通株式会社

Inventor： 雅樹 吉丸 ,  直彦 梶尾

IPC: H05K7/14 ,  G06F1/18

CPC classification number: H05K7/1492 ,  H05K1/0263 ,  H05K1/14 ,  H05K1/141 ,  H05K1/148 ,  H05K2201/044 ,  H05K2201/10272 ,  H05K2201/10287

公开(公告)号：JP4813309B2

公开(公告)日：2011-11-09

申请号：JP2006260557

申请日：2006-09-26

Applicant: 株式会社小糸製作所

Inventor： 範明 伊東 ,  広徳 塚本

IPC: F21S8/10 ,  F21V23/00 ,  F21Y101/02

CPC classification number: B60Q1/2696 ,  B60Q1/0094 ,  F21S43/14 ,  F21S43/195 ,  H05K1/0284 ,  H05K1/14 ,  H05K1/148 ,  H05K1/189 ,  H05K3/202 ,  H05K3/328 ,  H05K2201/10106 ,  H05K2201/10272 ,  H05K2201/10287 ,  H05K2201/10651 ,  H05K2203/302

Abstract: A vehicular lamp includes a lamp body; a plurality of LED light sources disposed inside a lamp chamber formed by a front cover positioned in front of the lamp body; and a lighting circuit portion positioned behind the LED light sources. The LED light source is electrically connected to a conductive bus bar, and forms a light-emitting surface at a position opposite the front cover. The lighting circuit portion is formed on the back side of the light-emitting surface of the LED light source with respect to the front cover, and a circuit element thereof is electrically connected to the conductive bus bar. The conductive bus bar to which the LED light source is connected and the conductive bus bar to which the circuit element is connected are conductively connected.

公开(公告)号：JP2011096804A

公开(公告)日：2011-05-12

申请号：JP2009248492

申请日：2009-10-29

Applicant: Daikin Industries Ltd ,  ダイキン工業株式会社

Inventor： KAGIMURA NORIO ,  DOMAE HIROSHI

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K3/32 ,  H01R4/34 ,  H01R12/515 ,  H01R12/585 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/09063 ,  H05K2201/10166 ,  H05K2201/10287 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10962

Abstract: PROBLEM TO BE SOLVED: To meet a larger current than before by using a terminal block in a wiring board unit in which a power module is mounted in a printed circuit board. SOLUTION: The wiring board unit includes a printed circuit board (2), and a terminal block (10) which connects a power module (3) mounted on a printed circuit board (2) and an electrical wiring (8). The terminal block (10) includes a terminal connection (11) to which the power module (3) is directly connected and a wiring connection (12) to which the electrical wiring (8) is connected. In the printed circuit board (2), a hole (2c) which is larger than the plane orthographic projection area of the terminal connection (11) is formed. The terminal connection (11) is located under or over of the hole (2c) of the printed circuit board (2). COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：通过在其中将电源模块安装在印刷电路板中的布线板单元中使用端子块来满足比以前更大的电流。 布线板单元包括印刷电路板（2）和连接安装在印刷电路板（2）上的电源模块（3）和电气布线（8）之间的端子块（10）。 端子块（10）包括直接连接电源模块（3）的端子连接（11）和与电线（8）连接的配线连接（12）。 在印刷电路板（2）中，形成比端子连接体（11）的平面正交投影面积大的孔（2c）。 端子连接（11）位于印刷电路板（2）的孔（2c）的下方或上方。 版权所有（C）2011，JPO＆INPIT