公开(公告)号：JPWO2012157704A1

公开(公告)日：2014-07-31

申请号：JP2013515192

申请日：2012-05-17

Applicant: 戸田工業株式会社

Inventor： 伊藤　千穂 ,  千穂 伊藤 ,  剛志 八塚 ,  剛志 八塚 ,  康男 柿原 ,  康男 柿原

IPC: B22F1/00 ,  B22F9/00 ,  H01B1/00 ,  H01B1/22 ,  H01B5/00 ,  H01B5/14 ,  H01B13/00 ,  H05K1/09 ,  H05K3/12 ,  H05K3/24

CPC classification number: C09D5/24 ,  B22F1/0011 ,  B22F1/0074 ,  B22F7/04 ,  B22F9/24 ,  B22F2998/10 ,  C22C1/0425 ,  H01B1/026 ,  H01B1/22 ,  H05K1/095 ,  H05K2201/0272 ,  H05K2201/0323 ,  B22F3/22 ,  B22F2003/248 ,  C23C18/00

Abstract: 【課題】パラジウム等の高価な触媒を用いることなく無電解金属めっきを施すことのできる銅粉末含有塗膜用の銅粉末及び銅ペーストと、該銅ペーストを用いて形成される銅粉末含有塗膜への無電解金属めっき又は過熱水蒸気による加熱処理により導電性塗膜を形成する製造方法を提供する。SEM観察による平均粒子径が0.05〜2μmの銅粉末であり、該銅粉末のBET比表面積値(SSA)(m2/g)と炭素含量(C)(重量%)が下記の式[1]の関係にある銅粉末及び該銅粉末を含有する銅ペーストを用いて絶縁基板上に塗膜を形成し、乾燥させて銅粉末含有塗膜を得た後、該塗膜上に無電解金属めっき又は過熱水蒸気による加熱処理を施す導電性塗膜の製造方法。C/SSA≦7×10−2・・・・[1]

公开(公告)号：JP5534127B2

公开(公告)日：2014-06-25

申请号：JP2008143987

申请日：2008-05-31

Applicant: スリーボンドファインケミカル株式会社

Inventor： 宏則 鈴木 ,  仁志 真舩

IPC: C08L101/00 ,  C08K3/08 ,  C08K3/22 ,  H01B1/20

CPC classification number: H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2201/083

公开(公告)号：JP5398935B1

公开(公告)日：2014-01-29

申请号：JP2013505252

申请日：2012-03-30

Applicant: 株式会社応用ナノ粒子研究所 ,  新電元工業株式会社

Inventor： 晃雄 小松 ,  良 松林

IPC: B22F9/00 ,  B22F1/00 ,  B22F1/02 ,  C09J9/02 ,  H01B1/00 ,  H01B1/22 ,  H01R43/02

CPC classification number: B23K35/025 ,  B22F1/0018 ,  B22F1/0062 ,  B22F7/064 ,  B23K1/20 ,  B23K35/302 ,  B23K35/3612 ,  H01B1/026 ,  H01B1/22 ,  H05K1/092 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/0272

Abstract: 本発明の課題は、比較的低価格で接合特性、熱伝導性及び電気的特性の優れた複合ナノ金属ペーストを提供することである。
本発明は、金属核に有機被覆層が形成される複合ナノ金属粒子を含む金属ペーストにおいて、銅フィラーを含有し、前記有機被覆層の熱分解温度が異なる第1複合ナノ金属粒子と第２複合ナノ金属粒子を結合材として含有し、前記第1複合ナノ金属粒子に対する前記有機被覆層の質量比率Ｗ１が２〜１３ｍａｓｓ％の範囲にあり、前記第２複合ナノ金属粒子に対する前記有機被覆層の質量比率Ｗ２が５〜２５ｍａｓｓ％の範囲にあり、前記第1複合ナノ金属粒子を被覆する前記有機被覆層の熱分解温度をＴ１とし、前記第２複合ナノ金属粒子を被覆する前記有機被覆層の熱分解温度をＴ２としたとき、Ｔ１＜Ｔ２且つＷ１＜Ｗ２の関係を有する銅フィラー含有複合ナノ金属ペーストである。

公开(公告)号：JP5342453B2

公开(公告)日：2013-11-13

申请号：JP2009543654

申请日：2008-11-21

Applicant: パナソニック株式会社

Inventor： 貴之 樋口 ,  秀規 宮川 ,  敦史 山口 ,  新 岸 ,  直倫 大橋

IPC: H01B1/22 ,  B22F1/00 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H01B1/00

CPC classification number: H05K3/321 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: Disclosed is an electrically conductive paste which enables to reduce the level of void growth in a conducting pathway formed in a joint part produced after curing the electrically conductive paste in the implementation of an electronic component on a circuit board by using the electrically conductive paste, and which contains a reduced amount of a viscosity-adjusting/thixotropy-imparting additive. Two Sn-containing low-melting-point alloy particles having different melting points and different average particle diameters are selected as electrically conductive filler components to be used in an electrically conductive paste, and the two alloy particles are mixed at a predetermined ratio for use.

公开(公告)号：JP5326281B2

公开(公告)日：2013-10-30

申请号：JP2007552901

申请日：2006-12-20

Applicant: ルネサスエレクトロニクス株式会社

Inventor： 琢央 船矢 ,  新太郎 山道 ,  秀哉 村井 ,  克 菊池 ,  広一 本多 ,  真一 宮崎

IPC: H01L23/12

CPC classification number: H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/49866 ,  H01L24/45 ,  H01L24/48 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/19041 ,  H05K1/115 ,  H05K1/117 ,  H05K3/20 ,  H05K3/4614 ,  H05K3/4682 ,  H05K3/4694 ,  H05K2201/0272 ,  H05K2201/0352 ,  H05K2201/09845 ,  H05K2201/09972 ,  H05K2203/0425 ,  H05K2203/061 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A wiring board for mounting semiconductor device, includes at least a dielectric film 1; wirings formed in the dielectric film 1; a plurality of electrode pads provided at front and back surfaces of the dielectric film with their surfaces exposed and at least portions of lateral sides of them buried into the dielectric film; vias connecting the wirings and the electrode pads. At least one via connecting each other the wirings formed in the dielectric film includes second material different from first material forming the vias connecting the wirings and the electrode pads. The wiring board for mounting semiconductor device, is effective for an increase in terminals and finer pitch of terminal intervals due to an improvement in integration, performance or multi-function of semiconductor devices, can mount semiconductor devices especially on both sides of the board at a high density and high accuracy, and furthermore, is excellent in reliability as well.

公开(公告)号：JP5256281B2

公开(公告)日：2013-08-07

申请号：JP2010503690

申请日：2008-03-18

Applicant: 株式会社応用ナノ粒子研究所 ,  新電元工業株式会社

Inventor： 晃雄 小松 ,  弘明 岩黒 ,  良 松林

IPC: H01B1/22 ,  H01B1/00 ,  H01B13/00

CPC classification number: H01B1/22 ,  H01L24/29 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/29101 ,  H01L2224/29339 ,  H01L2224/32245 ,  H01L2224/37139 ,  H01L2224/40095 ,  H01L2224/40247 ,  H01L2224/77272 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/097 ,  H05K3/321 ,  H05K2201/0224 ,  H05K2201/0272 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/84

Abstract: The invention provides a technique of converting C1-9 or C11 composite silver nanoparticles into a paste by the use of a resin exhibiting non-fluidity at 10°C or below in order to inhibit the nanoparticles from agglomeration in storage, that is, a non-fluid paste of such nanoparticles. A composite silver nanopaste prepared by mixing a metal component containing as the essentials composite silver nanoparticles constituted of both silver cores which are made of silver atom aggregates and have a mean particle diameter of 1 to 20nm and organic coats which cover the cores respectively and are made of at least one member selected from among alcohol residues, alcohol molecule derivatives and alcohol molecules which each contain 1 to 9 or 11 carbon atoms with a resin, characterized in that at 10°C or below, the resin is in a non-fluid state to keep the metal component in a dispersed state, while on heating, it can be fluidized to permit coating.

公开(公告)号：JP2013119089A

公开(公告)日：2013-06-17

申请号：JP2011266729

申请日：2011-12-06

Applicant: Fujitsu Ltd ,  富士通株式会社

Inventor： KITAJIMA MASAYUKI ,  YAMAGAMI TAKATOYO ,  KUBOTA TAKASHI ,  ISHIKAWA KUNIKO

IPC: B23K35/14 ,  B22F1/00 ,  B22F1/02 ,  C22C9/00 ,  C22C12/00 ,  C22C13/00 ,  C22C28/00 ,  H05K3/32

CPC classification number: H01B1/22 ,  H01L2924/0002 ,  H05K1/09 ,  H05K3/3484 ,  H05K2201/0272 ,  H05K2203/047 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a conductive bonding material surely mountable by primary reflow heating and prevented from re-melting in secondary reflow heating, an electronic component using the conductive bonding material, and an electronic device with the electronic component mounted thereon.SOLUTION: The conductive bonding material contains copper particles coated with either gallium or a gallium alloy, and either tin particles or tin alloy particles. It is prefarably that the gallium alloy is one of Ga-Ni alloy, a Ga-Cu alloy, a Ga-Sn alloy and a Ga-Au alloy, the volume average particle diameter of copper particles is 0.5 μm or more and 30 μm or less, the average thickness of a coating film containing either the gallium or the gallium alloy is 0.5 μm or more and 10 μm or less, and the like.

Abstract translation: 要解决的问题：为了提供可通过初级回流加热可靠地安装的导电接合材料，并且防止二次回流加热中的再熔化，使用导电接合材料的电子部件以及安装有电子部件的电子器件 。

解决方案：导电接合材料包含用镓或镓合金涂覆的铜颗粒，以及锡颗粒或锡合金颗粒。 优选的是，镓合金是Ga-Ni合金，Ga-Cu合金，Ga-Sn合金和Ga-Au合金之一，铜粒子的体积平均粒径为0.5μm以上且30μm以下 含镓或镓合金的涂膜的平均厚度为0.5μm以上且10μm以下。 版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP5195760B2

公开(公告)日：2013-05-15

申请号：JP2009536080

申请日：2008-10-02

Applicant: 日立化成株式会社

Inventor： 馨 今野 ,  宏樹 林 ,  崇司 川守

IPC: C09J201/00 ,  B23K35/22 ,  B23K35/26 ,  B23K35/363 ,  C09J9/02 ,  C09J11/04 ,  C09J11/06 ,  C22C12/00 ,  C22C13/00 ,  H01B1/22 ,  H01L21/60 ,  H05K3/32

CPC classification number: H01L24/16 ,  B22F1/0059 ,  B22F2001/0066 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/302 ,  B23K35/3613 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  C08K3/0066 ,  C08K3/017 ,  C08K3/08 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01L24/12 ,  H01L2224/05568 ,  H01L2224/13099 ,  H01L2224/1329 ,  H01L2224/13347 ,  H01L2224/13439 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16265 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/15747 ,  H01L2924/19043 ,  H01L2924/20107 ,  H05K1/141 ,  H05K3/321 ,  H05K2201/0272 ,  H05K2203/0425 ,  Y10T428/31511 ,  Y10T428/31678 ,  H01L2924/00 ,  H01L2224/05599

Abstract: There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

公开(公告)号：JP5170685B2

公开(公告)日：2013-03-27

申请号：JP2008532041

申请日：2007-08-24

Applicant: 株式会社村田製作所

Inventor： 昭博 野村 ,  英清 高岡 ,  公介 中野

IPC: H01B1/22 ,  C09J163/00 ,  H01B13/00 ,  H05K1/14 ,  H05K3/32

CPC classification number: H05K3/321 ,  C08K3/08 ,  C08K7/00 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K2201/0272 ,  H05K2201/10636 ,  H05K2203/0425 ,  Y02P70/611 ,  Y10T428/2857 ,  Y10T428/31678

公开(公告)号：JP5067163B2

公开(公告)日：2012-11-07

申请号：JP2007544190

申请日：2006-11-10

Applicant: 千住金属工業株式会社 ,  株式会社村田製作所

Inventor： 稔 上島 ,  公介 中野 ,  英清 高岡

IPC: B23K35/22 ,  B23K35/14 ,  B23K35/26 ,  B23K35/363 ,  B23K35/40 ,  C22C12/00 ,  H05K3/34

CPC classification number: B23K35/264 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/302 ,  B23K35/362 ,  H05K3/3484 ,  H05K2201/0272